Reinforced concrete (RC) is by far the most widely used composite material in the world. Despite the enormous economic importance of RC construction, there is a lack of viable concepts for its digital fabrication. While 3D printing of plain concrete has been pushed forward by a growing research community in recent years, methods for integration of steel reinforcement have only scarcely been researched and little attention has been payed to meet the practical requirements of construction sites and prefabrication plants. Therefore, full-scale implementations of current approaches are hardly available. Based on both, a sound review of R&D for digital fabrication of RC structures and an analysis of practical requirements, the present paper proposes a novel 3D printing process for RC structures, called Additive Manufacturing of Reinforced Concrete (AMoRC), viable for real-world application. In this hybrid process, consisting of an intermittent stud welding process and a continuous concrete extrusion process, segmented steel reinforcing bars are joined to form a three-dimensional reinforcement mesh and simultaneously encased with extruded concrete. The paper describes the conceptual design and development of the process and demonstrates the results of preliminary investigations on its feasibility. As AMoRC enables the operation of rebar welding and concrete extrusion process with synchronized feed rates, combination of both processes in one hybrid print head for digital fabrication of RC is a key-advantage of the proposed method.
Today, it is already foreseeable that additive manufacturing of mortar and concrete has groundbreaking potential and will revolutionize or at least fundamentally change the way we build. In recent years, 3D concrete printing (3DCP) with extrusion-based deposition methods has been pushed forward by a growing research community. Albeit being regarded one of the most promising innovations in construction industry, a consistent characterization methodology for assessing the constitutive behavior of 3D printed, hardened cementitious materials is missing, so far, which hinders its widespread use in engineering practice. The major objective of this paper is to fill this gap by developing a new experimental framework that can thoroughly describe the mechanical properties of 3D printed cementitious materials. Based on both a review of state-of-the-art test setups and a comprehensive experimental campaign, the present paper proposes a set of easy-to-use experimental methods that allow us to assess flexural, tensile, shear and compressive strength as well as fracture energy of 3D printed concretes and mortars in a reliable and reproducible manner. The experimental results revealed anisotropic material behavior for flexural, tensile, shear and compressive loading. Furthermore, they confirm that interval time (time gap between deposition of subsequent layers) has a crucial effect on investigated material properties leading to a severe reduction in strength and fracture energy for longer interval times.
1 August 2018 in Journal of Constructional Steel Research
The quality of strain measurements using distributed fiber optic sensors (DFOS) depends largely on the bond between the host material and the optical fiber. Experimental investigations were carried out to test the suitability of five different DFOS types for crack monitoring. The DFOS were subsequently bonded to two 4 m long reinforced concrete (RC) beams, so that the influence of the application technique could be evaluated. DFOS measurements were verified by digital image correlation (DIC) and electrical strain gauges (SGs). For the different DFOS types, clear differences in the measured strain curves and determined crack widths were observed. The focus was on two robust DFOS, which can be deployed on construction sites. Compared to the layered sensing cable, a monolithic DFOS showed a clear strain distribution with pronounced strain peaks even for closely spaced cracks. The crack widths obtained by integrating the strain curves showed high agreement with DIC measurements.