The properties and microstructure evolution of quaternary Cu-Ni-Co-Si alloys with different Ni/Co mass ratios were investigated. The microstructure and morphological characteristics of the precipitates were analyzed by using electron backscatter diffraction (EBSD), transmission electron microscopy (TEM) and high-resolution transmission electron microscopy (HRTEM). The mechanical properties and conductivity of the alloys were significantly improved after the addition of Co. The grains presented an obvious growth trend with an increase in Ni/Co mass ratios, and the appropriate Co accelerated the recrystallization process. The δ-(Ni, Co)₂Si phases of the Cu-Ni-Co-Si alloys and δ-Ni₂Si phases of the Cu-Ni-Si alloys shared the same crystal structure and orientation relationships with the matrix, which had two variant forms: δ₁ and δ₂ phases. The precipitates preferential grew along with the direction of the lowest energy and eventually exhibited two different morphologies. Compared with that of the Cu-Ni-Si alloy, the volume fraction of precipitates in the alloys with Co was significantly improved, accompanied by an increase in the precipitated phase size. The addition of Co promoted the precipitation of the precipitated phase and further purified the matrix. A theoretical calculation was conducted for different strengthening mechanisms, and precipitation strengthening was the key reinforcement mechanism. Moreover, the kinetic equations of both alloys were obtained and coincided well with the experimental results.

The Cu–20 wt% Ag alloy wire rod was prepared using three-chamber vacuum cold mold vertical continuous up-casting followed by multi-pass continuous drawing. The evolution of microstructure, mechanical property, and electrical property of the Cu–20 wt% Ag alloy wire during multi-pass continuous drawing was studied. After multi-pass continuous drawing, the continuous network eutectic structure in the longitudinal section of the as-casted rod was gradually drawn into long fibers that approximately parallel to the axial direction, while the space of the continuous network eutectic structure in the transverse section is getting smaller and smaller. Both the preferred orientation of copper and silver grains are (1,1,1). With the increase of drawing strain ( η ), the tensile strength of Cu–20 wt% Ag alloy wire gradually increases while the elongation gradually decreases. When the diameter is drawn to 0.02 mm ( η = 11.94), the tensile strength of the alloy is 1,682 MPa and elongation is 2.0%. The relationship between tensile strength, elongation, and diameter conforms to Allometric and Boltzmann functions, respectively.

The microstructure evolution and properties of a Cu–Cr–Ag alloy during continuous extrusion and an aging process were studied by Scanning Electron Microscope (SEM) and Transmission Electron Microscope (TEM). Owing to strong shear deformation that happened during continuous extrusion with working temperatures of 450 to 480 °C, a larger number of fine grains were obtained. Both face-centered cubic (FCC) and body-centered cubic (BCC) precipitates simultaneously existed in the matrix when aged for 450 °C for 2 h, and the Cr phases with BCC structure had an N–W relationship with the matrix. After continuous extrusion, 60% cold deformation, 875 °C × 1 h solid solution treatment, 60% cold deformation, 450 °C × 2 h aging treatment, and 70% cold deformation, the Cu–Cr–Ag alloy acquired excellent comprehensive properties: tensile strength of 494.4 MPa, yield strength of 487.6 MPa, and electrical conductivity of 91.4% IACS.

As it is known, beryllium bronze, an important copper alloy, is widely used in the field of aerospace. Since the performance of domestic and imported beryllium bronze alloys have obvious differences, domestic beryllium bronze QBe2.0 and imported C17200 alloy were adopted, and the hardness and tensile properties of imported and domestic beryllium bronze alloys in the peak aging state were compared and analyzed. In addition, the microstructure morphologies of the C17200 alloy and QBe2.0 alloy were analyzed by SEM, EBSD, and TEM. This study adopted a data-driven exploration approach to elaborate the differences between C17200 and QBe2.0 alloy. After aging at 300 °C for 2 h (peak aging), the tensile strengths of the C17200 alloy and QBe2.0 alloy were 1357 MPa and 1309 MPa, the yield strengths were 1195 MPa and 1188 MPa, and the elongations were 5.5% and 4.0%, respectively. In the peak-aged state, the grain size, uniformity, small angle grain boundary, and twin density of the C17200 alloy were much better than those of the QBe2.0 alloy, which led to more significant grain refinement and twin strengthening effects. A large amount of γ’ phase, γ phase, and β phase were precipitated in both alloys, but the precipitation density of the γ’ strengthening phase in the C17200 alloy was much greater than that of the QBe2.0 alloy. The C17200 alloy exhibited better mechanical properties under the combined effects of the various strengthening mechanisms, which provided a guideline for the subsequent improvement of domestic alloys and laid a solid foundation for the development of new copper alloys.

The relationship between microstructure evolution and properties of a Cu-Cr-Sn alloy during aging and high-temperature softening was investigated in detail in the present work. The results show that the addition of Sn refines obviously the size of the Cr phase and enhances the thermal stability of the alloy, which improves the peak-aged hardness of the Cu-Cr-Sn alloy reaching 139 HV after aging at 450 °C for 240 min. In addition, the recrystallization behavior of the Cu-Cr alloy with the 0.12 wt.% of Sn at high temperature is also significantly inhibited. Lots of precipitated Cr phases and a high density of dislocations are found in the Cu-Cr-Sn alloy annealed at high temperature, resulting in the softening temperature of the Cu-Cr-Sn alloy reaching 565 °C, which is higher than (about 50 °C) that of the Cu-Cr alloy.