Chaouki HANNACHI

Prof. Chaouki HANNACHI

IM2NP, Aix-Marseille University, Marseille, Provence-Alpes-Côte d’Azur, France
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Research Focus & Metrics

Academic Career Length

14Years (2013-Present)

(Calculated once Scilit publication data is synced: current year − year of first publication + 1)

Representative Publications

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23 May 2018 in IEEE Microwave and Wireless Components Letters
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Journal Article
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Chaouki HANNACHIChaouki HANNACHI
Chaouki HANNACHI
TDTarek Djerafi
Tarek Djerafi
Serioja Ovidiu TatuSerioja Ovidiu Tatu
Serioja Ovidiu Tatu
A rectangular WR12 waveguide to microstrip line (MSL) transition using a very thin high-permittivity ceramic substrate (ϵr = 9.9 and h = 127 μm) is presented and analyzed. The proposed configuration uses a gradually extending metal ridge over a thin-film MSL to ensure electric field transformation, and an accurate impedance matching, while maintaining a good electrical contact, without any soldering or gluing. The fabricated prototype has been successfully tested in terms of insertion and return losses. The obtained results exhibit a bandwidth of more than 37% at -10 dB with an insertion loss of 1.5-2.7 dB, over the entire 60-90-GHz frequency band. The design simplicity and suitability for high-permittivity thin-film substrates, as well as the very broadband operation capability, enable it to be easily integrated with various planar monolithic microwave integrated circuits/miniaturized hybrid microwave integrated circuits microstrip circuits for different millimeter-wave applications.

18 November 2013 in Journal of Electrical and Computer Engineering
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Chaouki HANNACHIChaouki HANNACHI
Chaouki HANNACHI
DHD. Hammou
D. Hammou
TDT. Djerafi
T. Djerafi
ZOZ. Ouardirhi
Z. Ouardirhi
STS. O. Tatu
S. O. Tatu
This paper presents the characterization results of several new passive millimeter wave circuits integrated on very thin ceramic substrate. The work is focused on the design and characterization of a novel rounded Wilkinson power divider, a 90° hybrid coupler, a rat-race coupler, and a novel six-port (multiport) circuit. Measurements show the wideband characteristics, allowing therefore their use for multi-Gb/s V-band wireless communication systems.

1 January 2017 in IET Microwaves, Antennas & Propagation
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Chaouki HANNACHIChaouki HANNACHI
Chaouki HANNACHI
STSerioja Ovidiu Tatu
Serioja Ovidiu Tatu
This study presents a comparative study of several printed antennas having different shapes of the patch (rectangular, square, triangular, trapezoidal, circular, elliptical, and annular ring), suitable for 60 GHz wireless applications. All these microstrip patch antennas have been designed and fabricated on a very thin ceramic substrate to enable a high level of integration with other integrated circuits including passive circuits (such as power dividers, hybrid couplers, and passive filters), and active circuits (such as low noise amplifier (LNA), radio frequency (RF) mixers, and frequency multipliers). In that event, all of those circuits will be incorporated on a single and very small planar substrate to reduce overall size, and to avoid lossy millimetre‐wave connectors. To analyse and compare the performances, advanced design system of Keysight Technologies was used for circuits design and simulation. This comparison is based on the obtained results particularly in radiation characteristics and inputs return loss, by determining the main associated parameters such as the bandwidth, voltage standing wave ratio, gain, directivity, efficiency, and cross‐polarisation level. This comparative study would be very helpful for RF design engineers to select suitable antenna geometry while designing microstrip patch antenna arrays at 60 GHz millimetre‐wave band.

2 January 2023 in Sensors
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Chaouki HANNACHIChaouki HANNACHI
Chaouki HANNACHI
FDFrédérique Deshours
Frédérique Deshours
GAGeorge Alquie
George Alquie
HKHamid Reza Kokabi
Hamid Reza Kokabi
This paper examines the effect of finger fat pad thickness on the accuracy performance of complementary split-ring resonator (CSRR)-based microwave sensors for non-invasive blood glucose level detection. For this purpose, a simplified four-layer Cole–Cole model along with a CSRR-based microwave sensor have been comprehensively analyzed and validated through experimentation. Computed scattering parameter (S-parameter) responses to different fat layer thicknesses are employed to verify the concordance of the studied model with the measurement results. In this respect, a figure of merit (FM) based on the normalized squared difference is introduced to assess the accuracy of the considered Cole–Cole model. We have demonstrated that the analyzed model agrees closely with the experimental validation. In fact, the maximum error difference for all five fingertips does not exceed 1.73 dB over the entire frequency range of interest, from 1 GHz to 4 GHz.

18 May 2017 in IEEE Access
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Chaouki HANNACHIChaouki HANNACHI
Chaouki HANNACHI
Serioja Ovidiu TatuSerioja Ovidiu Tatu
Serioja Ovidiu Tatu
In this paper, a broadband 60-GHz millimeter-wave 4x1 microstrip patch antenna array using the gap-coupled technique is presented and analyzed. In order to meet the challenging requirement of reduced size related to this kind of technique, and facilitate the integration with other integrated passive or active devices, the proposed antenna array has been designed on a thin ceramic substrate (εr = 9.9 , h = 127 μm), using an MHMIC (Miniature Hybrid Microwave Integrated Circuits) fabrication process. The proposed structure is based on a modified shape of a gap-coupled patch element with curved radiating edges. For further analysis, the performances of the latter in terms of impedance bandwidth, gain and radiation efficiency were investigated and compared with a conventional structure of a rectangular gap-coupled patch antenna. The obtained results clearly show that the proposed gap-coupled array structure provides an improved bandwidth (7 %), and an enhanced gain (10.7 dB), while maintaining a reduced size (5.2 mm x 9.5 mm). All these benefits make it an attractive candidate for the future integrated millimeter-wave RF front-end circuits; it can, however, be connected directly to various MHMIC passive circuits, or active devices through using the wire bonding technology, on a standard thin-film alumina substrate.

23 August 2017 in Microwave and Optical Technology Letters
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Chaouki HANNACHIChaouki HANNACHI
Chaouki HANNACHI
BZB. Zouggari
B. Zouggari
RCRazvan I. Cojocaru
Razvan I. Cojocaru
TDT. Djerafi
T. Djerafi
STS. O. Tatu
S. O. Tatu