Under the dual impetus of environmental regulations and reliability requirements, the Pb–free/Pb hybrid assembly process in aerospace-grade ball grid array (BGA) components has become an unavoidable industrial imperative. However, constrained process compatibility during single or multiple reflow protocols amplifies structural heterogeneity in solder joints and accelerates dynamic microstructural evolution, thereby elevating interfacial reliability risks at solder joint interfaces. This paper systematically investigated phase composition, grain dimensions, thickness evolution, and crystallographic orientation patterns of interfacial intermetallic compounds (IMCs) in hybrid micro-solder joints under multiple reflows, employing electron backscatter diffraction (EBSD), scanning electron microscopy (SEM), and energy-dispersive X-ray spectroscopy (EDX). The result shows that the first reflow induces prismatic Cu₆Sn₅ grain formation driven by Pb aggregation zones and elevated Cu concentration gradients. Surface-protruding fine grains significantly increase kernel average misorientation (KAMave) of 0.68° while minimizing crystallographic orientation preference density (PF_max) of 15.5. Higher aspect ratios correlate with elongated grain morphology, consequently elevating grain size of 5.3 μm and IMC thickness of 5.0 μm. Subsequent reflows fundamentally alter material dynamics: Pb redistribution transitions from clustered to randomized spatial configurations, while grains develop pronounced in-plane orientation preferences that reciprocally influence Sn crystal alignment. The second reflow produces scallop-type grains with minimized dimensions of 4.0 μm and a thickness of 2.1 μm, with a KAMave of 0.37° and PF_max of 20.5. The third reflow initiates uniform growth of scalloped grains of 7.0 μm with a stable population density, whereas the fifth reflow triggers a semicircular grain transformation of 9.1 μm through conspicuous coalescence mechanisms. This work elucidates multiple reflow IMC growth mechanisms in Pb–free/Pb hybrid solder joints, providing critical theoretical and practical insights for optimizing hybrid technologies and reliability management strategies in high-reliability aerospace electronics.

The fatigue pitting model based on the minimum oil film thickness does not consider the influence of tooth surface roughness and residual stress, which limits the accuracy of predicting the fatigue pitting of the model. Micro pitting often initiates on the surface due to large external loads. Therefore, it is urgent to propose a new-micro pitting bearing capacity model based on gear surface integrity parameters. This paper studied a new fatigue pitting model considering surface integrity subjected to polishing processes. This model thoroughly analyzes the effects of teeth surface roughness dynamically on the oil film pressure and explores the complex mechanism of residual stress in the near-surface stress field of the gear teeth. The new model can more accurately simulate the micro-pitting bearing capacity under actual operating conditions by introducing teeth surface roughness and residual stress, and the prediction reliability of gear steel is greatly improved. This improved model provides a solid theoretical basis and technical support for optimizing gear transmission systems, accurate diagnosis of micro-pitting defects, and in-depth theoretical research in related fields.

This study examines interfacial intermetallic compound (IMC) growth in Pb-free/Pb mixed assemblies comprising 450 µm SAC305 solder balls and Cu pads printed with a 0.12 mm layer of Sn63Pb37 solder paste. Samples were reflowed at peak temperatures of 200, 220, 240, and 260 °C, with the time above 217 °C fixed at 40 s. Scanning electron microscopy, energy-dispersive X-ray spectroscopy, and electron backscatter diffraction were used to characterize the interfacial composition, morphology, layer thickness, grain size, and kernel average misorientation (KAM). The IMC layer thickened from 1.5 µm at 200 °C to 6.0 µm at 260 °C, while KAM_ave increased from 0.36° to 0.59°. At 220 °C, the IMC thickness changed only slightly to 1.6 µm, accompanied by local Pb and Ag enrichment. At 240 °C, the IMC thickness increased sharply to 4.7 µm and KAM_ave increased to 0.55°, together with larger Cu₆Sn₅ grains and localized coarsening. At 260 °C, the IMC thickness reached 6.0 µm and KAM_ave reached 0.59°, while Pb-rich regions became more pronounced and the Ag content decreased markedly, indicating substantial interfacial solute redistribution and increasingly heterogeneous IMC growth. The results link the reflow temperature to changes in interfacial chemistry, and microstructure and can help define a suitable process window for Pb-free/Pb mixed assembly.