Despite III-V semiconductors demonstrating extraordinary solar-to-hydrogen (STH) conversion efficiencies, high cost and poor stability greatly impede their practical implementation in photoelectrochemical (PEC) water splitting applications. Here, we present a simple and efficient strategy for III-V-based photoelectrodes that functionally and spatially decouples the light harvesting component of the device from the electrolysis part that eliminates parasitic light absorption, reduces the cost, and enhances the stability without any compromise in efficiency. The monolithically integrated PEC cell was fabricated by an epitaxial lift-off and transfer of inversely grown InGaP/GaAs to a robust Ni-substrate and the resultant photoanode exhibits an STH efficiency of ~9% with stability ~150 h. Moreover, with the ability to access both sides of the device, we constructed a fully-integrated, unassisted-wireless “artificial leaf” system with an STH efficiency of ~6%. The excellent efficiency and stability achieved herein are attributed to the light harvesting/catalysis decoupling scheme, which concurrently improves the optical, electrical, and electrocatalytic characteristics.

There is a significant gap between the internal and external efficiencies of conventional GaN light-emitting diodes (LEDs). The reason for this shortfall is the narrow escape cone for light in high refractive index semiconductors. In this letter, the $p$ -side-up $\mathrm{GaN}∕\text{sapphire}$ LEDs with surface textured indium tin oxide (ITO) widow layers were investigated using natural lithography with polystyrene spheres as the etching mask. Under optimum etching conditions, the surface roughness of the ITO film can reach 140 nm while the polystyrene sphere on the textured ITO surface is maintained at about 250–300 nm in diameter. The output power of the $\mathrm{ITO}∕\mathrm{GaN}$ LED with and without surface texturing is 10.9, and 8.5 mW at 20 mA, respectively. The LEDs fabricated using the surface-textured ITO produced an output power that exceeded that of the planar-surface LED by about 28% at 20 mA.

An approach to improve the defect density and internal quantum efficiency of near-ultraviolet emitters was proposed using a combination of epitaxial lateral overgrowth (ELOG) and patterned sapphire substrate (PSS) techniques. Especially, a complementary dot array pattern corresponding to the underlying PSS was used for the ELOG - Si O 2 mask design. Based on the transmission-electron-microscopy and etch-pit-density results, the ELOG ∕ Si O 2 ∕ Ga N ∕ PSS structure can reduce the defect density to a level of 10 5 cm − 2 . The internal quantum efficiency of the InGaN-based ELOG-PSS light-emitting diode(LED) sample showed three times in magnitude as compared with that of the conventional GaN/sapphire one. Under a 20 mA injection current, the output powers of ELOG-PSS, PSS, and conventional LED samples were measured to be 3.3, 2.9, and 2.5 mW , respectively. The enhanced output power could be due to a combination of the reduction in dislocation density (by ELOG) and improved light extraction efficiency (by PSS). Unlike the previous double ELOG approaches, the presented ELOG-PSS structure needs only one regrowth process and will have high potential in future high-quality ultraviolet emitters, even blue/green laser diode applications.

In this research, five sizes (100 × 100, 75 × 75, 50 × 50, 25 × 25, 10 × 10 µm²) of InGaN red micro-light emitting diode (LED) dies are produced using laser-based direct writing and maskless technology. It is observed that with increasing injection current, the smaller the size of the micro-LED, the more obvious the blue shift of the emission wavelength. When the injection current is increased from 0.1 to 1 mA, the emission wavelength of the 10 × 10 μm² micro-LED is shifted from 617.15 to 576.87 nm. The obvious blue shift is attributed to the stress release and high current density injection. Moreover, the output power density is very similar for smaller chip micro-LEDs at the same injection current density. This behavior is different from AlGaInP micro-LEDs. The sidewall defect is more easily repaired by passivation, which is similar to the behavior of blue micro-LEDs. The results indicate that the red InGaN epilayer structure provides an opportunity to realize the full color LEDs fabricated by GaN-based LEDs.