Tong An received her B.E. degree in safety engineering from Beijing University of Technology, Beijing, China, in 2006, her M.E. degree in solids mechanics from Beijing University of Technology, Beijing, China, in 2009, and her Ph.D. degree in engineering mechanics from the Beijing University of Technology, Beijing, China, 2014. She is currently an Associate Professor with the Institute of Electronics Packaging Technology and Reliability, Beijing University of Technology. Her current research interests include reliability of power semiconductor devices, thermomechanical modeling, failure mechanisms of electronic packaging, and micro- and macro-mechanical behaviors of packaging materials.