This paper investigates the changes in the interface organization and properties of 0.10 mm Pd/Al composite wires annealed at different temperatures. The optimum comprehensive performance of the material was obtained after annealing at 300 °C for 120 s. Its tensile strength, conductivity and elongation are 140.61 MPa, 46.82%IACS and 14.89%, respectively. Scanning electron microscopy (SEM) and transmission electron microscopy (TEM) were used to observe the intermetallic compounds on the interface. The annealing temperature and the formation heat of intermetallic compounds determine the categories and evolution of intermetallic compounds. When the thickness of the intermetallic layer is more than 1 μm, it has a serious effect on the electrical conductivity and elongation of the materials.

The effect of cold rolled reductions on microstructure and mechanical properties of TiNi alloys was investigated by means of tension test and TEM. From the results it can be determined that when the annealing temperature reached 550℃, the recrystallization and grain growth began to occur after the cold deformation, and the tensile strength of the alloy decreased greatly and the elongation was more than 50%. The stress platform of stress-strain curves was decided by cold deformation and annealing temperature, which meets the Clasusius-Clapeyron equation. When the alloy rolled above 37%, large deformation energy storage is conducive to the occurrence of recrystallization. The microstructure evolves form recovery to nucleation of amorphous structures, recrystallization and grain growth as the rising of annealing temperature.