This research aimed to study a Bi–Ag–Mg soldering alloy and the direct soldering of Al₂O₃ ceramics and Ni–SiC composites. Bi11Ag1Mg solder has a broad melting interval, which mainly depends on the silver and magnesium content. The solder starts to melt at a temperature of 264 °C. Full fusion terminates at a temperature of 380 °C. The microstructure of the solder is formed by a bismuth matrix. The matrix contains segregated silver crystals and an Ag (Mg, Bi) phase. The average tensile strength of solder is 26.7 MPa. The boundary of the Al₂O₃/Bi11Ag1Mg joint is formed by the reaction of magnesium, which segregates in the vicinity of a boundary with a ceramic substrate. The thickness of the high-Mg reaction layer at the interface with the ceramic material was approximately 2 μm. The bond at the boundary of the Bi11Ag1Mg/Ni–SiC joint was formed due to the high silver content. At the boundary, there were also high contents of Bi and Ni, which suggests that there is a NiBi₃ phase. The average shear strength of the combined Al₂O₃/Ni–SiC joint with Bi11Ag1Mg solder is 27 MPa.

The aim of this study was to characterize a Sn-Ti solder alloy containing 6 wt.% SiC nanoparticles and evaluate its use for direct soldering of SiC ceramics to a copper (Cu) substrate. Soldering was performed with direct ultrasound activation. The average tensile strength of the solder alloy was 17.1 MPa. Differential Thermal Analysis (DTA) analysis revealed an apparent transition at 234 ℃, corresponding to a eutectic reaction within the Sn-Ti binary system, indicating structural changes in the solder. The solder matrix consisted primarily of pure tin, while titanium combined with SiC nanoparticles to form a TiC phase. The existence of this phase was confirmed by energy dispersive X-ray spectroscopy (EDX) and X-ray diffraction (XRD) analysis of the solder. The bond at the interface between the SiC ceramic substrate and the solder was formed through diffusion and chemical reactions. The XRD analysis of the fractured surface from the SiC side confirmed the formation of phases such as TiC, Ti₂Sn, CTi₂, CuSn, SiC, and Cu₆Sn₅; the TiC and CTi₂ phases resulted from the interaction of active Ti in the solder with the SiC ceramic surface. The bond at the Cu substrate interface formed due to the high solubility of tin in the solder and the formation of probable CuSnTi and CuSnTi3₅ phases, along with a mixture of Sn + η Cu₆Sn₅ solid solution. The average shear strength of the SiC/Cu joint, fabricated using SnTi3 solder with 6 wt.% SiC nanoparticles, was 21.5 MPa.

This study investigates the potential application of Zn5Al1.5Mg1.5Ti active solder in ultrasonic soldering of Al₂O₃ ceramics and Cu substrates. The research explores the microstructural characteristics, phase composition, and mechanical properties of the solder and the resulting joints. Particular attention is given to the formation mechanisms of the solder–substrate bond and the role of ultrasound activation in enhancing wettability and bond strength. The study aimed to provide a deeper understanding of active soldering processes and their suitability for high-temperature applications. The findings contribute to advancing lead-free soldering technologies for electronic and structural applications.

This paper examines the wettability and interactions between ceramic and composite materials soldered with Bi-based solder containing 11 wt.% of silver and 3 wt.% titanium using indirect electron beam soldering technology. The Bi11Ag3Ti solder, with a melting point of 402 °C, consisted of a bismuth matrix containing silver lamellae. Titanium, acting as an active element, positively influenced the interaction between the solder and the joined materials. SiC and Ni-SiC substrates were soldered at temperatures of 750 °C, 850 °C, and 950 °C. Measurements of wettability angles indicated that the lowest value (20°) was achieved with SiC substrates at 950 °C. A temperature of 750 °C appeared to be the least suitable for both substrates and was entirely unsuitable for Ni-SiC. It was also observed that the Bi11Ag3Ti solder wetted the SiC substrates more effectively than Ni-SiC substrates. The optimal working temperature for this solder was determined to be 950 °C. The shear strength of the joints soldered with the Bi11Ag3Ti alloy was 23.5 MPa for the Al₂O₃/Ni-SiC joint and 9 MPa for the SiC/Ni-SiC joint.

This study investigates the effect of SiC nanoparticle addition on the microstructure, interfacial reactions, and mechanical properties of Zn5Al3Ti active solder used for ultrasonic soldering of AlN ceramic to copper substrates. Composite solders containing 3 and 6 wt.% SiC nanoparticles were prepared and applied under flux-free ultrasonic soldering conditions. The solder alloys were evaluated by tensile testing, while the soldered joints were evaluated by shear strength testing. The solder microstructure and interfacial regions were characterized using SEM/EDS analysis. The results showed that the addition of SiC nanoparticles modified the microstructure of the Zn5Al3Ti solder and influenced the mechanical performance of the ceramic/metal joints. Among the investigated systems, the AlN/Zn5Al3Ti + 6 wt.% SiC/Cu joint exhibited the highest shear strength, reaching approximately 101 MPa. SEM/EDS observations revealed the formation of compact multilayered interfacial regions, including possible Cu–Zn intermetallic phases at the Cu/solder interface and Al–Ti–Zn-based reaction products near the solder/AlN interface. The improved joint performance may be attributed to the combined effect of SiC-induced microstructural modification, the presence of Si-containing particles, and the formation of compact metallurgical bonds. The results indicate that Zn5Al3Ti solder modified with 6 wt.% SiC nanoparticles is a promising material for producing strong AlN/Cu joints under the applied ultrasonic soldering conditions.

The aim of this research was to study the interaction and solderability of Al₂O₃ ceramics and Ni-SiC composite by use of an active solder type Bi11Ag1.5Ti1Mg. The chemical composition of the solder is 86.5 wt% Bi, 11 wt% Ag, 1.5 wt% Ti, 1 wt% Mg. Soldering was performed by ultrasonic activation. This solder has a wide melting interval with the initial melting temperature of 263 ℃, what corresponds to the eutectic reaction. The liquidus temperature of this solder was determined at 437 ℃. The bond between the ceramic and the solder is formed by the interaction of the active metals Bi, Ag and Mg with the surface of the substrate Al₂O₃. The thickness of the Mg reaction layer at the interface was approximately 0.8 μm. The bond at the interface between Ni-SiC and solder was formed due to the interaction of the active metals Bi, Ag, Mg and Ti. Feasibility of Bi11Ag1.5Ti1Mg solder was assessed on the basis of analyses of joint boundaries and joint shear strength measurements. The average shear strength of Al₂O₃/Bi11Ag1.5Ti1Mg/Ni-SiC joint was 54 MPa.