This paper deals with the possibility of obtaining zinc from waste galvanic sludge, which is formed during galvanic plating. The aim of the experimental and practical part was to obtain zinc after the leaching of galvanic sludge. Leaching was performed in sulfuric acid, nitric acid and hydrochloric acid at different temperatures and time intervals with the addition of oxidizing agents as hydrogen peroxide or ozone. A separation of the leach and filtrate using filtration followed. The leach was further processed by a precipitation of iron and other metals using various agents. After a further filtration, the electrolysis was performed in order to obtain pure zinc on the cathode at the electrical voltage of approximately 3.5 V. Leaching using a solution of sodium hydroxide or potassium hydroxide was also performed when the prior dissolving of a major part of zinc into the leach occurred, while iron and non-ferrous metals remained in the leaching residue. After the filtration of the leach, the electrolysis with a high zinc yield of a purity of more than 99% followed. This way seems to be an optimal one for building a semi-industrial line for galvanic sludge recycling. All the partial products, i.e., the leach, the leaching residue, the filtrate, the solid precipitate and the separated metal on the cathode were subjected to chemical analyses. The analyses results are presented in tables and graphs.

The aim of this study was to characterize a Zn-Mg type soldering alloy and direct soldering of SiC ceramics with a copper substrate. The Zn1.5Mg solder exerts a wider melting interval. The temperature of the eutectic reaction was 365 °C, and the liquidus temperature was 405 °C. The microstructure of the soldering alloy is comprised of a zinc matrix. Segregation of binary eutectics in the form of (Zn) + Mg₂Zn₁₁ lamellas occurred on the boundaries of Zn grains. Additionally, the presence of a MgZn₂ magnesium phase was observed in the solder matrix. The SiC/solder bond was formed due to magnesium distribution from solder to the boundary with SiC ceramics, where magnesium reacts with silicon, which is infiltered in SiC ceramics. By a mutual interaction, a new Mg₂Si phase is formed. An interaction between the molten zinc solder and Cu substrate occurred on the boundary of the Cu/substrate joint at the formation of a transition zone composed of two new phases, namely the γCu (Cu₅Zn₈) non-wettable phase type, approximately 30 µm wide, and a wettable (CuZn₄) phase type ε, approximately 12 µm wide. The average shear strength of a combined SiC/Cu joint fabricated using Zn1.5Mg solder was 44 MPa.

This paper examines the wettability and interactions between ceramic and composite materials soldered with Bi-based solder containing 11 wt.% of silver and 3 wt.% titanium using indirect electron beam soldering technology. The Bi11Ag3Ti solder, with a melting point of 402 °C, consisted of a bismuth matrix containing silver lamellae. Titanium, acting as an active element, positively influenced the interaction between the solder and the joined materials. SiC and Ni-SiC substrates were soldered at temperatures of 750 °C, 850 °C, and 950 °C. Measurements of wettability angles indicated that the lowest value (20°) was achieved with SiC substrates at 950 °C. A temperature of 750 °C appeared to be the least suitable for both substrates and was entirely unsuitable for Ni-SiC. It was also observed that the Bi11Ag3Ti solder wetted the SiC substrates more effectively than Ni-SiC substrates. The optimal working temperature for this solder was determined to be 950 °C. The shear strength of the joints soldered with the Bi11Ag3Ti alloy was 23.5 MPa for the Al₂O₃/Ni-SiC joint and 9 MPa for the SiC/Ni-SiC joint.

The manuscript explores the feasibility of recovering zinc and iron from waste galvanic sludge generated during galvanic plating processes. Galvanic sludge, characterized by elevated concentrations of heavy metals, represents a suitable candidate for hydrometallurgical recycling. The primary objective of the experimental and practical phases was to extract zinc and iron through the leaching of galvanic sludge. Leaching procedures were conducted using sulfuric acid at varying temperatures and time durations, augmented by the introduction of oxidizing agents such as hydrogen peroxide or ozone. Subsequent separation of the leach and filtrate was achieved through filtration. The leachate underwent additional processing involving the precipitation of iron and other metals, employing diverse agents. Following further filtration, electrolysis was employed to attain pure zinc on the cathode, utilizing an electrical voltage of approximately 3 V. Comprehensive chemical analyses were conducted on all intermediate products, including the leachate, leach liquor, filtrate, solid precipitate, and the separated metal on the cathode. The outcomes of these analyses are meticulously presented in tables and graphs.

This study investigates the potential application of Zn5Al1.5Mg1.5Ti active solder in ultrasonic soldering of Al₂O₃ ceramics and Cu substrates. The research explores the microstructural characteristics, phase composition, and mechanical properties of the solder and the resulting joints. Particular attention is given to the formation mechanisms of the solder–substrate bond and the role of ultrasound activation in enhancing wettability and bond strength. The study aimed to provide a deeper understanding of active soldering processes and their suitability for high-temperature applications. The findings contribute to advancing lead-free soldering technologies for electronic and structural applications.