In the present research, an iterative numerical model is proposed to investigate the nanosecond pulsed laser ablation (PLA) mechanism of the DD6 single-crystal superalloy. In the numerical model, two subroutines are introduced to trace the moving boundary and update the thermal load. The iteration between the main governing equation and the two subroutines enables the PLA numerical simulation to consider material moving front and effect of comprehensive heat dissipation including thermal convection and radiation. The basic experimental results exhibit a good agreement with simulation results which indicates the good accuracy of the simulation model. Therefore, the PLA mechanism of the DD6 single-crystal superalloy is studied base on the improved iterative model, which indicates the evolution of temperature field, ablation zone morphology, formation of recast layer and heat-affected zone are closely related with time. The temperature of the laser spot center increases sharply at the first stage, reaching a maximum value of 5252 K, and then decreases gradually. The thermal dissipation postpones the ablation rate but promotes the formation of a recast layer and heat-affected zone. Due to the evaporation and thermal dissipation, the depth of the molten layer exhibits two rapid increasing stages. The comprehensive analysis of the PLA processing by the improved simulation model helps the understanding of the intrinsic mechanism, which would contribute to the further optimizing parameters of PLA fabrication of the DD6 single-crystal superalloy.

SiC_f/SiC ceramic matrix composite (CMC), a hard and brittle material, faces significant challenges in efficient and high-quality processing of small-sized shapes. To address these challenges, the nanosecond laser was used to process micro-holes in the SiC_f/SiC CMC using a two-step drilling method, including laser pre-drilling in air and laser final-drilling with a water jet. The results of the single-parameter variation and optimized orthogonal experiments reveal that the optimal parameters for laser pre-drilling in air to process micro-holes are as follows: 1000 processing cycles, 0.7 mJ single-pulse energy, −4 mm defocus, 15 kHz pulse-repetition frequency, and 85% overlap rate. With these settings, a micro-hole with an entrance diameter of 343 μm and a taper angle of 1.19° can be processed in 100 s, demonstrating high processing efficiency. However, the entrance region exhibits spattering slags with oxidation, while the sidewall is covered by the recast layer with a wrinkled morphology and attached oxides. These effects are primarily attributed to the presence of oxygen, which enhances processing efficiency but promotes oxidation. For the laser final-drilling with a water jet, the balanced parameters for micro-hole processing are as follows: 2000 processing cycles, 0.6 mJ single-pulse energy, −4 mm defocus, 10 kHz pulse-repetition frequency, 85% overlap rate, and a 4.03 m/s water jet velocity. Using these parameters, the pre-drilled micro-hole can be finally processed in 96 s, yielding an entrance diameter of 423 μm and a taper angle of 0.36°. Due to the effective elimination of spattering slags and oxides by the water jet, the final micro-hole exhibits a clean sidewall with microgrooves, indicating high-quality micro-hole processing. The sidewall morphology could be ascribed to the different physical properties of SiC fiber and matrix, with steam explosion and cavitation erosion. This two-step laser drilling may provide new insights into the high-quality and efficient processing of SiC_f/SiC CMC with small-sized holes.

The problems of the recast layer, oxide layer, and heat-affected zone (HAZ) in conventional laser machining seriously impact material properties. Coaxial waterjet-assisted laser scanning machining (CWALSM) can reduce the conduction and accumulation of heat in laser machining by the high specific heat capacity of water and can realize the machining of nickel-based special alloy with almost no thermal damage. With the developed experimental setup, the laser ablation threshold and drilling experiments of the K4002 nickel-based special alloy were carried out. The effects of various factors on the thermal damage thickness were studied with an orthogonal experiment. Experimental results have indicated that the ablation threshold of K4002 nickel-based special alloy by a single pulse is 4.15 J/cm². The orthogonal experiment results have shown that the effects of each factor on the thermal damage thickness are in the order of laser pulse frequency, waterjet speed, pulse overlap rate, laser pulse energy, and focal plane position. When the laser pulse energy is 0.21 mJ, the laser pulse frequency is 1 kHz, the pulse overlap is 55%, the focal plane position is 1 mm, and the waterjet speed is 6.98 m/s, no thermal damage machining can be achieved. In addition, a comparative experiment with laser drilling in the air was carried out under the same conditions. The results have shown that compared with laser machining in the air, the thermal damage thickness of CWALSM is smaller than 1 μm, and the hole taper is reduced by 106%. There is no accumulation and burr around the hole entrance, and the thermal damage thickness range is 0–0.996 μm. Furthermore, the thermal damage thickness range of laser machining in the air is 0.499–2.394 μm. It has also been found that the thermal damage thickness is greatest at the entrance to the hole, decreasing as the distance from the entrance increases.

In the present study, the coaxial waterjet-assisted nanosecond laser drilling of micro-holes in C_f/SiC composites, coupled with nanosecond laser drilling in air for fabricating micro-holes with high aspect ratios, were investigated. The surface morphology, reaction products, and micro-hole shapes were thoroughly examined. The results reveal that, for the coaxial waterjet-assisted nanosecond laser drilling of micro-holes in the C_f/SiC composite, the increasing of waterjet velocity enhances the material removal rate and micro-hole depth, but reduces the micro-hole diameter and taper angle. The coaxial waterjet isolates the laser-ablated region and cools down the corresponding region rapidly, leading to the formation of a mixture of SiC, SiO₂, and Si on the surface. As the coaxial waterjet velocity increases, the morphology of residual surface products changes from a net-like structure to individual spheres. Coaxial waterjet-assisted nanosecond laser drilling, with a waterjet velocity of 9.61 m/s, achieves micro-holes with a good balance between efficiency and quality. For the fabrication of micro-holes with a high aspect ratio in C_f/SiC composites, micro-holes fabricated by nanosecond laser drilling in air exhibit obvious taper features, which should be ascribed to the combined effects of spattering slag, plasma, and energy dissipation. The application of coaxial waterjet-assisted nanosecond laser drilling on micro-holes fabricated by laser drilling in air effectively expands the hole diameter. The fabricated micro-holes have very small taper angles, with clean wall surfaces and almost no reaction products. This approach, combining nanosecond laser drilling in air followed by coaxial waterjet-assisted nanosecond laser drilling, offers a promising technique for fabricating high-quality micro-holes with high aspect ratios in C_f/SiC composites.