SiC_f/SiC ceramic matrix composite (CMC), a hard and brittle material, faces significant challenges in efficient and high-quality processing of small-sized shapes. To address these challenges, the nanosecond laser was used to process micro-holes in the SiC_f/SiC CMC using a two-step drilling method, including laser pre-drilling in air and laser final-drilling with a water jet. The results of the single-parameter variation and optimized orthogonal experiments reveal that the optimal parameters for laser pre-drilling in air to process micro-holes are as follows: 1000 processing cycles, 0.7 mJ single-pulse energy, −4 mm defocus, 15 kHz pulse-repetition frequency, and 85% overlap rate. With these settings, a micro-hole with an entrance diameter of 343 μm and a taper angle of 1.19° can be processed in 100 s, demonstrating high processing efficiency. However, the entrance region exhibits spattering slags with oxidation, while the sidewall is covered by the recast layer with a wrinkled morphology and attached oxides. These effects are primarily attributed to the presence of oxygen, which enhances processing efficiency but promotes oxidation. For the laser final-drilling with a water jet, the balanced parameters for micro-hole processing are as follows: 2000 processing cycles, 0.6 mJ single-pulse energy, −4 mm defocus, 10 kHz pulse-repetition frequency, 85% overlap rate, and a 4.03 m/s water jet velocity. Using these parameters, the pre-drilled micro-hole can be finally processed in 96 s, yielding an entrance diameter of 423 μm and a taper angle of 0.36°. Due to the effective elimination of spattering slags and oxides by the water jet, the final micro-hole exhibits a clean sidewall with microgrooves, indicating high-quality micro-hole processing. The sidewall morphology could be ascribed to the different physical properties of SiC fiber and matrix, with steam explosion and cavitation erosion. This two-step laser drilling may provide new insights into the high-quality and efficient processing of SiC_f/SiC CMC with small-sized holes.

In the present study, the coaxial waterjet-assisted nanosecond laser drilling of micro-holes in C_f/SiC composites, coupled with nanosecond laser drilling in air for fabricating micro-holes with high aspect ratios, were investigated. The surface morphology, reaction products, and micro-hole shapes were thoroughly examined. The results reveal that, for the coaxial waterjet-assisted nanosecond laser drilling of micro-holes in the C_f/SiC composite, the increasing of waterjet velocity enhances the material removal rate and micro-hole depth, but reduces the micro-hole diameter and taper angle. The coaxial waterjet isolates the laser-ablated region and cools down the corresponding region rapidly, leading to the formation of a mixture of SiC, SiO₂, and Si on the surface. As the coaxial waterjet velocity increases, the morphology of residual surface products changes from a net-like structure to individual spheres. Coaxial waterjet-assisted nanosecond laser drilling, with a waterjet velocity of 9.61 m/s, achieves micro-holes with a good balance between efficiency and quality. For the fabrication of micro-holes with a high aspect ratio in C_f/SiC composites, micro-holes fabricated by nanosecond laser drilling in air exhibit obvious taper features, which should be ascribed to the combined effects of spattering slag, plasma, and energy dissipation. The application of coaxial waterjet-assisted nanosecond laser drilling on micro-holes fabricated by laser drilling in air effectively expands the hole diameter. The fabricated micro-holes have very small taper angles, with clean wall surfaces and almost no reaction products. This approach, combining nanosecond laser drilling in air followed by coaxial waterjet-assisted nanosecond laser drilling, offers a promising technique for fabricating high-quality micro-holes with high aspect ratios in C_f/SiC composites.

This study investigates the fabrication of blind holes in Inconel 718 alloy using a quasi-continuous wave (QCW) laser under varying pulse numbers. The geometric features, spatter formation, inner wall morphology, and microstructures of the drilled holes were systematically analyzed. Experimental results demonstrate that increasing the number of laser pulses from 1 to 13 significantly improves the hole depth, ranging from 565.09 to 3952.54 μm, achieving a maximum depth-to-diameter ratio of 9.5. Shallow holes exhibited optimal morphology with clean edges and smooth inner walls, whereas deeper holes displayed a composite structure consisting of inverted cone (upper), cylindrical (middle), and spindle-shaped (lower) sections. The thickness of the recast layer increased along the depth as the pulse numbers rose. Microstructural analysis revealed that the recast layer contained refined grains, with kernel average misorientation analysis indicating high residual stress within this layer. The hardness of the recast layer, measured at 2.13 GPa, was notably lower than that of the base material (4.49 GPa), primarily due to the depletion of the strengthening phase and the formation of the Laves phase. This work provides an in-depth understanding of the characteristics and mechanisms of QCW laser drilling in Inconel 718 alloy, offering valuable insights to optimize the laser processing parameters for industrial applications.