The corrosion resistance of FeCoNiCr high-entropy alloy deposits was investigated upon being prepared by current electrodeposition. The coatings were co-deposited in an electrolyte of an aqueous ferrous, cobalt, nickel, and chromium sulfates solution. Energy dispersive spectrometry analysis demonstrated that all four elements were co-deposited successfully. At the same time, the results from SEM indicate that the surface of the coating exhibits a granular morphology, with uniform density and no presence of cracks, with sizes ranging from 500 nm to 5 μm. Furthermore, X-ray diffraction patterns enunciated that the as-deposited coatings were amorphous. The polarization curves of the FeCoNiCr high-entropy alloy coating were measured by an electrochemical workstation in 3.5 wt.% NaCl, 1 mol·L⁻¹ H₂SO₄ and 1 mol·L⁻¹ NaOH solutions. The results revealed that the coating exhibited excellent corrosion resistance. The corrosion mechanism of the FeCoNiCr high-entropy alloy coating was analyzed in different environments. Moreover, the scratch testing method was employed to determine the alloy adhesion on the substrate, with higher values obtained for the FeCoNiCr alloy.

As electronic packaging technology advances towards miniaturization and integration, the issue of electromigration (EM) in lead-free solder joints has become a significant factor affecting solder joint reliability. In this study, a Sn-3.0Ag-0.5Cu (SAC305) alloy was used as the base, and different Bi content alloys, SAC305-xBi (x = 0, 0.5, 0.75, 1.0 wt.%), were prepared for tensile strength, hardness, and wetting tests. Copper wire was used to prepare EM test samples, which were subjected to EM tests at a current density of approximately 0.6 × 10⁴ A/cm² for varying durations. The interface microstructure of the SAC305-xBi alloys after the EM test was observed using an optical microscope. The results showed that the 0.5 wt.% Bi alloy exhibited the highest ultimate tensile strength and microhardness, improving by 33.3% and 11.8% compared to SAC305, respectively, with similar fracture strain. This alloy also displayed enhanced wettability. EM tests revealed the formation of Cu₆Sn₅ and Cu₃Sn intermetallic compounds (IMCs) at both the cathode and anode interfaces of the solder alloy. The addition of Bi inhibited the diffusion rate of Sn in Cu₆Sn₅, resulting in similar total IMC thickness at the anode interface across different Bi contents under the same test conditions. However, the total IMC thickness at the cathode interface decreased and stabilized with increasing EM time, with the SAC305-0.75Bi alloy demonstrating the best resistance to EM.