The corrosion resistance of FeCoNiCr high-entropy alloy deposits was investigated upon being prepared by current electrodeposition. The coatings were co-deposited in an electrolyte of an aqueous ferrous, cobalt, nickel, and chromium sulfates solution. Energy dispersive spectrometry analysis demonstrated that all four elements were co-deposited successfully. At the same time, the results from SEM indicate that the surface of the coating exhibits a granular morphology, with uniform density and no presence of cracks, with sizes ranging from 500 nm to 5 μm. Furthermore, X-ray diffraction patterns enunciated that the as-deposited coatings were amorphous. The polarization curves of the FeCoNiCr high-entropy alloy coating were measured by an electrochemical workstation in 3.5 wt.% NaCl, 1 mol·L⁻¹ H₂SO₄ and 1 mol·L⁻¹ NaOH solutions. The results revealed that the coating exhibited excellent corrosion resistance. The corrosion mechanism of the FeCoNiCr high-entropy alloy coating was analyzed in different environments. Moreover, the scratch testing method was employed to determine the alloy adhesion on the substrate, with higher values obtained for the FeCoNiCr alloy.

The recent progress in the strategies for the preparation of 2D inorganic non-conductive materials and their and application in alkali metal-based batteries is summarized in this review.

As electronic packaging technology advances towards miniaturization and integration, the issue of electromigration (EM) in lead-free solder joints has become a significant factor affecting solder joint reliability. In this study, a Sn-3.0Ag-0.5Cu (SAC305) alloy was used as the base, and different Bi content alloys, SAC305-xBi (x = 0, 0.5, 0.75, 1.0 wt.%), were prepared for tensile strength, hardness, and wetting tests. Copper wire was used to prepare EM test samples, which were subjected to EM tests at a current density of approximately 0.6 × 10⁴ A/cm² for varying durations. The interface microstructure of the SAC305-xBi alloys after the EM test was observed using an optical microscope. The results showed that the 0.5 wt.% Bi alloy exhibited the highest ultimate tensile strength and microhardness, improving by 33.3% and 11.8% compared to SAC305, respectively, with similar fracture strain. This alloy also displayed enhanced wettability. EM tests revealed the formation of Cu₆Sn₅ and Cu₃Sn intermetallic compounds (IMCs) at both the cathode and anode interfaces of the solder alloy. The addition of Bi inhibited the diffusion rate of Sn in Cu₆Sn₅, resulting in similar total IMC thickness at the anode interface across different Bi contents under the same test conditions. However, the total IMC thickness at the cathode interface decreased and stabilized with increasing EM time, with the SAC305-0.75Bi alloy demonstrating the best resistance to EM.

In the Al-Fe binary system, the Al₁₃Fe₃ phase as well as the Al₁₃Fe₄ phase has similar icosahedral building blocks like those appearing in quasicrystals. Therefore, it is of vital importance to clarify the formation process of these two phases. Coexistence of the Al₁₃Fe₃ and Al₁₃Fe₄ phases was discovered from the educts obtained with a nominal atomic ratio of Al/Fe of 9:2 by high-pressure sintering for the first time. Firstly, single crystal X-ray diffraction (SXRD) combined with a scanning electron microscope (SEM) with energy dispersive X-ray spectroscopy (EDX) measurement capabilities were adopted to determine the detailed crystal structures of both phases, which were sharply refined with regard to Al₁₃Fe₃ and Al₁₃Fe₄. Secondly, the orientation relationship between Al₁₃Fe₃ and Al₁₃Fe₄ was directly deduced from the SXRD datasets and the coexistence structure model was consequently constructed. Finally, seven pairs of parallel atomic planes and their unique orientation relations were determined from the reconstructed reciprocal space precession images. In addition, the real space structure model of the intergrowth crystal along with one kind of interfacial atomic structure were constructed from the determined orientation relations between two phases.

A new fabrication process without preform manufacturing has been developed for carbon short fiber (CSF) reinforced various aluminum matrix composites. And their mechanical and thermal properties were evaluated. Electroless Ni plating was conducted on the CSF for improving wettability between the carbon fiber (CF) and aluminum. It was confirmed that pores in Ni plated CSF/Al and Al alloy matrix composites prepared by applied pressure, 0.8 MPa, had some imperfect infiltration regions between the CF/CF and CF/matrix in all composites. However, pores size in the region between the CF/CF and CF/matrix to use the A336 matrix was about 1 µm. This size is smaller than that of other aluminum-based composites. Vickers hardness of Ni plated CSF/A1070, A356 alloy, and A336 alloy composites were higher as compared to matrix. However, the A1070 pure aluminum matrix composite had the highest hardness improvement. The Ultimate tensile strength of the A1070 and A356 aluminum matrix composite was increased due to carbon fiber compared to only aluminum, but the Ultimate tensile strength of the A336 aluminum matrix composite was rather lowered due to the highest content of Si precipitate and large size of Al₃Ni compounds. The Thermal Conductivity of Ni plated CSF/A1070 composite has the highest value (167.1 W·m⁻¹·K⁻¹) as compared to composites.