Polypropylene/graphite intercalation compound (PP/GIC) composites are prepared via melt mixing at three different temperatures (180, 200, and 220 °C). The dispersion of GICs in the composites is clearly improved due to the increased interlamellar spacing caused by in situ expansion of GICs at higher temperatures, which facilitates the intercalation of PP molecular chains into the GIC galleries. As a result, the PP/GIC composite with 10 wt% GICs prepared at 220 °C (PG220) presents a dielectric constant of about 1.3 × 10⁸ at 10³ Hz, which is about six orders higher than that of the composite prepared at 180 °C (PG180). Moreover, the thermal conductivity of the PG220 sample (0.63 Wm⁻¹K⁻¹) is 61.5% higher than that of the PG180 sample. The well-dispersed GICs accelerates the crystallization of PP by increasing the nucleation point and enhances the thermal stability of the composites. The PG220 sample shows a Young’s modulus that is about 21.2% higher than that of the PG180 samples. The results provide an efficient approach for fabricating polymer/GIC composites without complex exfoliation and dispersion processes.

Optical glass-microprism arrays are generally embossed at high temperatures, so an online cooling process is needed to remove thermal stress, but this make the cycle long and its equipment expensive. Therefore, the hot-embossing of a glass-microprism array at a low strain rate with reasonable embossing parameters was studied, aiming at reducing thermal stress and realizing its rapid microforming without online cooling process. First, the flow-field, strain-rate, and deformation behavior of glass microforming were simulated. Then, the low-cost microforming control device was designed, and the silicon carbide (SiC) die-core microgroove array was microground by the grinding-wheel microtip. Lastly, the effect of the process parameters on forming rate was studied. Results showed that the appropriate embossing parameters led to a low strain rate; then, the trapezoidal glass-microprism array could be formed without an online cooling process. The standard deviation of the theoretical and experimental forming rates was only 7%, and forming rate increased with increasing embossing temperature, embossing force, and holding duration, but cracks and adhesion occurred at a high embossing temperature and embossing force. The highest experimental forming rate reached 66.56% with embossing temperature of 630 °C, embossing force of 0.335 N, and holding duration of 12 min.

Maleic anhydride (MA) is introduced to fabricate poly(vinylidene fluoride)/expanded graphite (PVDF/EG) composites via one-step melt mixing. SEM micrographs and WAXD results have demonstrated that the addition of MA helps to exfoliate and disperse the EG well in the PVDF matrix by promoting the mobility of PVDF molecular chains and enhancing the interfacial adhesion between the EG layers and the PVDF. Thus, much higher thermal conductivities are obtained for the PVDF/MA/EG composites compared to the PVDF/EG composites that are lacking MA. For instance, The PVDF/MA/EG composite prepared with a mass ratio of 93:14:7 exhibits a high thermal conductivity of up to 0.73 W/mK. It is 32.7% higher than the thermal conductivity of the PVDF/EG composite that is prepared with a mass ratio of 93:7. Moreover, the introduction of MA leads to an increased melting peak temperature and crystallinity due to an increased nucleation site provided by the uniformly dispersed EG in the PVDF matrix. This study provides an efficient preparation method for PVDF/EG composites with a high thermal conductivity.