By combining electrical, physical, and transport/atomistic modeling results, this study identifies critical conductive filament (CF) features controlling TiN/HfO₂/TiN resistive memory (RRAM) operations. The leakage current through the dielectric is found to be supported by the oxygen vacancies, which tend to segregate at hafnia grain boundaries. We simulate the evolution of a current path during the forming operation employing the multiphonon trap-assisted tunneling (TAT) electron transport model. The forming process is analyzed within the concept of dielectric breakdown, which exhibits much shorter characteristic times than the electroforming process conventionally employed to describe the formation of the conductive filament. The resulting conductive filament is calculated to produce a non-uniform temperature profile along its length during the reset operation, promoting preferential oxidation of the filament tip. A thin dielectric barrier resulting from the CF tip oxidation is found to control filament resistance in the high resistive state. Field-driven dielectric breakdown of this barrier during the set operation restores the filament to its initial low resistive state. These findings point to the critical importance of controlling the filament cross section during forming to achieve low power RRAM cell switching.

Resistive switching (RS) phenomenon in the HfO₂ dielectric has been indirectly observed at device level in previous studies using metal-insulator-metal structures, but its origin remains unclear. In this work, using the enhanced conductive atomic force microscope (ECAFM), we have been able to obtain in situ direct observation of RS with nanometric resolution. The ECAFM measurements reveal that the conductive filaments exhibiting the RS are primarily formed at the grain boundaries, which were shown exhibiting especially low breakdown voltage due to their intrinsic high density of the oxygen vacancies.

Overcoming challenges associated with implementation of resistive random access memory technology for non-volatile information storage requires identifying the material characteristics responsible for resistive switching. In order to connect the switching phenomenon to the nano-scale morphological features of the dielectrics employed in memory cells, we applied the enhanced conductive atomic force microscopy technique for in situ analysis of the simultaneously collected electrical and topographical data on HfO₂ stacks of various degrees of crystallinity. We demonstrate that the resistive switching is a local phenomenon associated with the formation of a conductive filament with a sufficiently small cross-section, which is determined by the maximum passing current. Switchable filament is found to be formed at the dielectric sites where the forming voltages were sufficiently small, which, in the case of the stoichiometric HfO₂, is observed exclusively at the grain boundary regions representing low resistant conductive paths through the dielectric film.

A conductive atomic force microscope (C-AFM) has been used to investigate the degradation and breakdown of ultrathin (<6 nm) films of ${\mathrm{SiO}}_{\mathrm{2}}$ at a nanometric scale. Working on bare gate oxides, the conductive tip of the C-AFM allows the electrical characterization of nanometric areas. Due to the extremely small size of the analyzed areas, several features, which are not registered during macroscopic tests, are observed. In particular, before the oxide breakdown, switchings between different conduction states and sudden changes of conductivity have been measured, which have been related to the prebreakdown noise observed in conventional metal–oxide–semiconductor structures. Moreover, similar switchings have been also measured after the oxide breakdown, which have been related to the opening or closure of conduction channels between the electrodes. The C-AFM has also allowed the determination of the areas in which the degradation and breakdown take place. The results have shown that, although degradation takes place in areas of few hundreds of ${\mathrm{nm}}^{\mathrm{2}},$ breakdown is laterally propagated to neighbor spots, affecting areas of thousands of ${\mathrm{nm}}^{\mathrm{2}}.$ The size of the affected area has been found to be strongly related to the hardness of the breakdown event. The phenomenology observed with the C-AFM provides experimental evidence of the local nature of the degradation and breakdown processes in ultrathin ${\mathrm{SiO}}_{\mathrm{2}}$ films. Therefore, the C-AFM is a powerful tool to analyze the microscopic physics of these phenomena at the same dimensional scale at which they take place.