Changlin Liu

Prof. Changlin Liu

Department of Industrial and Systems Engineering, The Hong Kong Polytechnic University, Hong Kong 999077, China
orcid

Research Focus & Metrics

Academic Career Length

21Years (2006-Present)

(Calculated once Scilit publication data is synced: current year − year of first publication + 1)

Representative Publications

View All Publications
22 December 2022 in International Journal of Mechanical Sciences
Verified
Journal Article
Closed access
Changlin LiuChanglin Liu
Changlin Liu
STSuet To
Suet To
XSXuexiang Sheng
Xuexiang Sheng
JXJianfeng Xu
Jianfeng Xu

21 April 2021 in Discover Nano
Verified
Journal Article
Open access
PDF file
Changlin LiuChanglin Liu
Changlin Liu
WHWenbin He
Wenbin He
JCJianning Chu
Jianning Chu
JZJianguo Zhang
Jianguo Zhang
XCXiao Chen
Xiao Chen
JXJianfeng Xu
Jianfeng Xu
In this paper, molecular dynamics simulations are carried out to investigate the cutting mechanism during the hybrid machining process combined the thermal and vibration assistants. A modified cutting model is applied to study the material removal behavior and subsurface damage formation in one vibration cycle. The results indicate that during the hybrid machining process, the dominant material removal mechanism could transform from extrusion to shearing in a single vibration cycle. With an increase of the cutting temperature, the generation and propagation of cracks are effectively suppressed while the swelling appears when the dominant material removal mechanism becomes shearing. The formation mechanism of the subsurface damage in one vibration cycle can be distinct according to the stress distribution. Moreover, the generation of the vacancies in workpiece becomes apparent with increasing temperature, which is an important phenomenon in hybrid machining process.

2 March 2022 in International Journal of Mechanical Sciences
Verified
Journal Article
Closed access
Changlin LiuChanglin Liu
Changlin Liu
WXWanting Xu
Wanting Xu
JZJianguo Zhang
Jianguo Zhang
JXJunfeng Xiao
Junfeng Xiao
XCXiao Chen
Xiao Chen
JXJianfeng Xu
Jianfeng Xu

1 November 2021 in Materials Science in Semiconductor Processing
Verified
Journal Article
Closed access
Changlin LiuChanglin Liu
Changlin Liu
JZJianguo Zhang
Jianguo Zhang
JZJunjie Zhang
Junjie Zhang
JCJianning Chu
Jianning Chu
XCXiao Chen
Xiao Chen
JXJianfeng Xu
Jianfeng Xu

8 June 2021 in The International Journal of Advanced Manufacturing Technology
Verified
Journal Article
Closed access
PDF file
Changlin LiuChanglin Liu
Changlin Liu
JCJianning Chu
Jianning Chu
JZJianguo Zhang
Jianguo Zhang
JZJunjie Zhang
Junjie Zhang
XCXiao Chen
Xiao Chen
JXJianfeng Xu
Jianfeng Xu

6 June 2020 in The International Journal of Advanced Manufacturing Technology
Verified
Journal Article
Closed access
PDF file
Changlin LiuChanglin Liu
Changlin Liu
JZJianguo Zhang
Jianguo Zhang
JZJunjie Zhang
Junjie Zhang
XCXiao Chen
Xiao Chen
JXJunfeng Xiao
Junfeng Xiao
JXJianfeng Xu
Jianfeng Xu