This paper reports an LNO surface acoustic wave (SAW) resonator based on a shear horizontal mode with high operating frequency over 3 GHz, large electromechanical coupling of 33.54%, Q factor of 380, and a relatively good figure of merit (FOM) of 127. Combing crystal-ion-slicing (CIS) technology with a room temperature bonding method, a 4-inch single crystalline LNO thin film on silicon is prepared successfully. The influence of damaged LNO film on crystalline quality and SAW performance is comprehensively analyzed. After totally removing the damaged layer, the electromechanical coupling and Q factor is significantly improved. The high-performance SAW resonator possesses the potential to meet the requirements of SAW filters for the fifth-generation (5G) communication in terms of high frequency, large bandwidth, and a high-quality factor.
To solve the problem of filter bandwidth in 5G communication, it is urgent to develop an acoustic resonator with a large effective electromechanical coupling coefficient (Keff2). In this paper, the dependence between the resonance area and the performance of the bulk acoustic wave (BAW) resonator is studied. The solidly mounted resonators (SMRs) based on 43° Y cut lithium niobate (LN) were fabricated by the wafer transfer technique. The on-chip inductor was integrated with the BAW resonator through a pad electrode. Resonators with different resonant areas were fabricated and tested. Finite element modeling (FEM) simulation of acoustic resonators and electromagnetic (EM) simulation of layout were carried out, respectively. The Modified Butterworth Van Dyke (MBVD) model was used to analyze the results, and simulation of the Mason model was adopted. The results show that the dependency relationship between the resonant area and the effective electromechanical coupling coefficient can be induced by on-chip inductance. In the resonant area range of 20 × 20 μm2~160 × 160 μm2, the Keff2 increases from 11.97% to 43.28%.