Copper (Cu) and tungsten (W) possess exceptional electrical and thermal conductivity properties, making them suitable candidates for applications such as interconnects and thermal conductivity enhancements. Solution-based additive manufacturing (SBAM) offers unique advantages, including patterning capabilities, cost-effectiveness, and scalability among the various methods for manufacturing Cu and W-based films and structures. In particular, SBAM material jetting techniques, such as inkjet printing (IJP), direct ink writing (DIW), and aerosol jet printing (AJP), present a promising approach for design freedom, low material wastes, and versatility as either stand-alone printers or integrated with powder bed-based metal additive manufacturing (MAM). Thus, this review summarizes recent advancements in solution-processed Cu and W, focusing on IJP, DIW, and AJP techniques. The discussion encompasses general aspects, current status, challenges, and recent research highlights. Furthermore, this paper addresses integrating material jetting techniques with powder bed-based MAM to fabricate functional alloys and multi-material structures. Finally, the factors influencing large-scale fabrication and potential prospects in this area are explored.

The objective of this study was to develop a strategy for miniaturizing heat exchangers (HXs) used for the thermal management of sorbent beds within adsorption refrigeration systems. The thermal mass of the microchannel heat exchanger (MCHX) designed and fabricated in this study is compared with that of commercially available tube-and-fin HXs. Efforts are made to quantify the overall effects of miniaturization on system coefficient of performance (COP) and specific cooling power (SCP). A thermal model for predicting the cycle time for desorption is developed, and experiments are used to quantify the effect of the intensified HX on overall system performance.