In pursuing advancing additive manufacturing (AM) techniques for 3D objects, this study combines AM techniques for bulk metal and polymer on a single platform for one-stop printing of multilayer 3D electronic circuits with two novel aspects. The first innovation involves the embedded integration of electronic circuits by printing low-resistance electrical traces from bulk metal into polymer channels. Cross-section grinding results reveal (92 ± 5)% occupancy of electrically conductive traces in polymer channels despite the different thermal properties of the two materials. The second aspect encompasses the possibility of printing vertical bulk metal vias up to 10 mm in height with the potential for expansion, interconnecting electrically conductive traces embedded in different layers of the 3D object. The work provides comprehensive 3D printing design guidelines for successfully integrating fully embedded electrically conductive traces and the interconnecting vertical bulk metal vias. A smooth and continuous workflow is also introduced, enabling a single-run print of functional multilayer embedded 3D electronics. The design rules and the workflow facilitate the iterative printing of two distinct materials, each defined by unique printing temperatures and techniques. Observations indicate that conductive traces using molten metal microdroplets show a 12-fold reduction in resistance compared to nanoparticle ink-based methods, meaning this technique greatly complements multi-material additive manufacturing (MM-AM). The work presents insights into the behavior of molten metal microdroplets on a polymer substrate when printed through the MM-AM process. It explores their characteristics in two scenarios: When they are deposited side-by-side to form conductive traces and when they are deposited out-of-plane to create vertical bulk metal vias. The innovative application of MM-AM to produce multilayer embedded 3D electronics with bulk metal and polymer demonstrates significant potential for realizing the fabrication of free-form 3D electronics.

Additive manufacturing (AM), so‐called 3D printing, has reshaped manufacturing technologies with attractive alternatives to the traditional centralized, subtractive‐based mass production. Further functionalities like multimaterial AM (MMAM) are essential for mainstream manufacturing. With MMAM of electrical traces, the traditional printed circuit board can be transformed to freeform 3D electronics using the entire volumetric space. Although research groups attempt MMAM for freeform 3D electronics, achieving easy integration of the electrical traces with high conductance into dielectric substrates in a streamlined and simplified process remains challenging. Herein, an in‐house developed printer, named Synkròtima, is demonstrated for one‐stop printing of 3D dielectric parts with fully embedded and structured conductive features via drop‐on‐demand printing of molten metal for the first time. Printed traces show 12 times lower electrical resistance of at 230 μm linewidth than the lines from conductive inks. Printed traces with 100 μm dot spacing reveal exemplary shape fidelity with a standard deviation of only 7 μm. Quantitative estimation of adhesion of metal traces to dielectric reveals a mean shear‐off force of 7.20 N which is half of what is obtained for reflow soldered electronics. Demonstrators with embedded functional electrical circuits, directly interconnected components, and 3D out‐of‐plane metal structures are printed via Synkròtima.

In this article, we explore multi-material additive manufacturing (MMAM) for conductive trace printing using molten metal microdroplets on polymer substrates to enhance digital signal transmission. Investigating microdroplet spread informs design rules for adjacent trace printing. We studied the effects of print distance on trace morphology and resolution, noting that printing distance showed almost no change in the printed trace pitch. Crosstalk interference between adjacent signal traces was analyzed across frequencies and validated both experimentally and through simulation; no crosstalk was visible for printed traces at input frequencies below 600 kHz. Moreover, we demonstrate printed trace reliability against thermal shock, whereby no discontinuation in conductive traces was observed. Our findings establish design guidelines for MMAM electronics, advancing digital signal transmission capabilities.