High-performance multifunctional EMI shielding composite fabricated by low-cost method is increasingly required. Herein, novel EMI shielding nanocomposite laminates, consisting of composite prepreg of carbon fiber/epoxy resin/carbon nanotube film, were manufactured by facile electric heating of carbon nanotube film. The results indicated that composite with excellent specific shielding effectiveness of 0.07 dB/μm, 47 dB cm³/g and metamaterial properties can be designed by composite prepreg, and the primary shielding mechanism of it was reflection loss, along with interface polarization loss and conductive loss, which was superior to lots of shielding materials including carbon nanotube-based, carbon black-based, carbon nanofiber-based and graphene-based materials reported previously. Meanwhile, highly required excellent properties, including the thermostability with initial decomposition temperature up to 300 °C, hydrophobicity over contact angle of 115°, corrosion resistance of the composite with metal-free modification, and function as structural laminate compared with previous studies were demonstrated, which suggested tremendous potentials of the multifunctional EMI shielding composites in harsh environment.

To investigate the effect of equal channel angular pressing (ECAP) on the deformation of Ti-6Al-4V alloy at a higher temperature, hot compression tests were conducted on alloys having two different initial microstructures (the original alloy (Pre-ECAP) and ECAP-deformed alloy (Post-ECAP)). Post-ECAP, the alloy showed a higher degree of dynamic softening during the hot deformation process due to its finer grain size and higher distortion energy. The flow stress of Post-ECAP alloy was higher than the Pre-ECAP alloy at 500 °C when $\dot{\epsilon }=0.003{\mathrm{s}}^{-1}$. However, the stress of the Post-ECAP alloy decreased rapidly with increasing temperature and strain rate, until the stress value was much lower than that of Pre-ECAP at 700 °C when $\dot{\epsilon }=0.03{\mathrm{s}}^{-1}$. The value of the dynamic softening coefficient revealed that the dynamic softening behavior of Post-ECAP was more pronounced than that of Pre-ECAP in the hot compression deformation process. The main dynamic softening mechanism of Pre-ECAP is dynamic recovery, while the dynamic recrystallization process plays a more important role in the deformation process of Post-ECAP alloy. The microstructures observation results showed that dynamic recrystallization was more likely to occur to Post-ECAP alloys under the same deformation condition. Almost fully dynamic recrystallization had occurred in the deformation process of Post-ECAP at 700 °C and a strain rate of $\dot{\epsilon }=0.01{\mathrm{s}}^{-1}$. The grains of Post-ECAP alloys were further refined. The Post-ECAP alloy exhibits better plastic deformation at temperatures higher than 600 °C due to its significant dynamic recrystallization.