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This paper describes an event-driven tactile sensing system including 100 CMOS-MEMS integrated 3-axis force sensors of 2.7 mm square footprint for providing robot tactile sensation. The system has the following features: (1) the event-driven function of the CMOS LSI integrated in the sensor can reduce the number of stimulated sensors, (2) the stimulated sensors send data packets on a shared differential bus line of 90 cm by asynchronous serial communication, and (3) the data collision avoidance and adaptation functions of the sensor enable multiple sensors to be stimulated simultaneously. According to the event-driven function, the sensor sends data packets only when the digital sensing value is over a set threshold. The collision avoidance function detects data collisions, stops sending data, and avoids further collisions. The adaptation function varies the time interval between data packets and reduces the bus occupation by a specific sensor. These functions make the sensor autonomous to some extent that can judge whether and when to send data packets. The sensor in the system can operate at a data sending rate of 1 Mbps, 2 Mbps, 4 Mbps, or 8 Mbps by configurations. When 100 sensors with the same function settings are stimulated, almost the same amount of data packets are received from each sensor. As the data rate changing from 1 Mbps to 8 Mbps, the average sampling frequency of the 100 sensors is about 36.87 Hz, 73.00 Hz, 142.99 Hz, and 274.28 Hz with the data packet format of 244 bits.
Chenzhong Shao; Hideki Hirano; Hiroshi Miyaguchi; Munetaka Nomoto; Masanori Muroyama; Shuji Tanaka. Event-Driven Tactile Sensing System Including 100 CMOS-MEMS Integrated 3-Axis Force Sensors Based on Asynchronous Serial Bus Communication. IEEE Sensors Journal 2020, 20, 10159 -10169.
AMA StyleChenzhong Shao, Hideki Hirano, Hiroshi Miyaguchi, Munetaka Nomoto, Masanori Muroyama, Shuji Tanaka. Event-Driven Tactile Sensing System Including 100 CMOS-MEMS Integrated 3-Axis Force Sensors Based on Asynchronous Serial Bus Communication. IEEE Sensors Journal. 2020; 20 (17):10159-10169.
Chicago/Turabian StyleChenzhong Shao; Hideki Hirano; Hiroshi Miyaguchi; Munetaka Nomoto; Masanori Muroyama; Shuji Tanaka. 2020. "Event-Driven Tactile Sensing System Including 100 CMOS-MEMS Integrated 3-Axis Force Sensors Based on Asynchronous Serial Bus Communication." IEEE Sensors Journal 20, no. 17: 10159-10169.
Covering a whole surface of a robot with tiny sensors which can measure local pressure and transmit the data through a network is an ideal solution to give an artificial skin to robots to improve a capability of action and safety. The crucial technological barrier is to package force sensor and communication function in a small volume. In this paper, we propose the novel device structure based on a wafer bonding technology to integrate and package capacitive force sensor using silicon diaphragm and an integrated circuit separately manufactured. Unique fabrication processes are developed, such as the feed-through forming using a dicing process, a planarization of the Benzocyclobutene (BCB) polymer filled in the feed-through and a wafer bonding to stack silicon diaphragm onto ASIC (application specific integrated circuit) wafer. The ASIC used in this paper has a capacitance measurement circuit and a digital communication interface mimicking a tactile receptor of a human. We successfully integrated the force sensor and the ASIC into a 2.5 × 2.5 × 0.32.5×2.5×0.3 mm die and confirmed autonomously transmitted packets which contain digital sensing data with the linear force sensitivity of 57,640 Hz/N and 10 mN of data fluctuation. A small stray capacitance of 1.33 pF is achieved by use of 10 μm thick BCB isolation layer and this minimum package structure.
Mitsutoshi Makihata; Masanori Muroyama; Shuji Tanaka; Takahiro Nakayama; Yutaka Nonomura; Masayoshi Esashi. Design and Fabrication Technology of Low Profile Tactile Sensor with Digital Interface for Whole Body Robot Skin. Sensors 2018, 18, 2374 .
AMA StyleMitsutoshi Makihata, Masanori Muroyama, Shuji Tanaka, Takahiro Nakayama, Yutaka Nonomura, Masayoshi Esashi. Design and Fabrication Technology of Low Profile Tactile Sensor with Digital Interface for Whole Body Robot Skin. Sensors. 2018; 18 (7):2374.
Chicago/Turabian StyleMitsutoshi Makihata; Masanori Muroyama; Shuji Tanaka; Takahiro Nakayama; Yutaka Nonomura; Masayoshi Esashi. 2018. "Design and Fabrication Technology of Low Profile Tactile Sensor with Digital Interface for Whole Body Robot Skin." Sensors 18, no. 7: 2374.
For installing many sensors in a limited space with a limited computing resource, the digitization of the sensor output at the site of sensation has advantages such as a small amount of wiring, low signal interference and high scalability. For this purpose, we have developed a dedicated Complementary Metal-Oxide-Semiconductor (CMOS) Large-Scale Integration (LSI) (referred to as “sensor platform LSI”) for bus-networked Micro-Electro-Mechanical-Systems (MEMS)-LSI integrated sensors. In this LSI, collision avoidance, adaptation and event-driven functions are simply implemented to relieve data collision and congestion in asynchronous serial bus communication. In this study, we developed a network system with 48 sensor platform LSIs based on Printed Circuit Board (PCB) in a backbone bus topology with the bus length being 2.4 m. We evaluated the serial communication performance when 48 LSIs operated simultaneously with the adaptation function. The number of data packets received from each LSI was almost identical, and the average sampling frequency of 384 capacitance channels (eight for each LSI) was 73.66 Hz.
Chenzhong Shao; Shuji Tanaka; Takahiro Nakayama; Yoshiyuki Hata; Masanori Muroyama. Electrical Design and Evaluation of Asynchronous Serial Bus Communication Network of 48 Sensor Platform LSIs with Single-Ended I/O for Integrated MEMS-LSI Sensors. Sensors 2018, 18, 231 .
AMA StyleChenzhong Shao, Shuji Tanaka, Takahiro Nakayama, Yoshiyuki Hata, Masanori Muroyama. Electrical Design and Evaluation of Asynchronous Serial Bus Communication Network of 48 Sensor Platform LSIs with Single-Ended I/O for Integrated MEMS-LSI Sensors. Sensors. 2018; 18 (1):231.
Chicago/Turabian StyleChenzhong Shao; Shuji Tanaka; Takahiro Nakayama; Yoshiyuki Hata; Masanori Muroyama. 2018. "Electrical Design and Evaluation of Asynchronous Serial Bus Communication Network of 48 Sensor Platform LSIs with Single-Ended I/O for Integrated MEMS-LSI Sensors." Sensors 18, no. 1: 231.
Assistant robots need a tactile sensing system. We propose a tactile sensor head with a nerve-net sensing system which measures force, temperature and heat flow with a heater simultaneously on a robot finger. For accurate heat flow measurements, it is necessary to stabilize the contact conditions between the sensor head and an object. A sensor stick which consists of the sensor head and an actuator was fabricated to control applied force. Heat flow measurements in three materials of different thermal conductivities such as polyethylene, glass and Aluminum were made with the sensor stick. As a result, three materials were discriminated clearly by heat flow peak values, saturations values and time constants. The tactile sensor stick with temperature measurement and force control is useful to discriminate materials of objects.
Hayato Tsuchiya; Keito Oshima; Yusuke Suganuma; Masanori Muroyama; Yutaka Nonomura. Heat Flow Measurement by A Force and Thermal Sensor Stick for Robots with A Nerve-Net LSI Chip. Proceedings 2018, 2, 808 .
AMA StyleHayato Tsuchiya, Keito Oshima, Yusuke Suganuma, Masanori Muroyama, Yutaka Nonomura. Heat Flow Measurement by A Force and Thermal Sensor Stick for Robots with A Nerve-Net LSI Chip. Proceedings. 2018; 2 (13):808.
Chicago/Turabian StyleHayato Tsuchiya; Keito Oshima; Yusuke Suganuma; Masanori Muroyama; Yutaka Nonomura. 2018. "Heat Flow Measurement by A Force and Thermal Sensor Stick for Robots with A Nerve-Net LSI Chip." Proceedings 2, no. 13: 808.
This paper reports a 3-axis fully integrated differential capacitive tactile sensor surface-mountable on a bus line. The sensor integrates a flip-bonded complementary metal-oxide semiconductor (CMOS) with capacitive sensing circuits on a low temperature cofired ceramic (LTCC) interposer with Au through vias by Au-Au thermo-compression bonding. The CMOS circuit and bonding pads on the sensor backside were electrically connected through Au bumps and the LTCC interposer, and the differential capacitive gap was formed by an Au sealing frame. A diaphragm for sensing 3-axis force was formed in the CMOS substrate. The dimensions of the completed sensor are 2.5 mm in width, 2.5 mm in length, and 0.66 mm in thickness. The fabricated sensor output coded 3-axis capacitive sensing data according to applied 3-axis force by three-dimensional (3D)-printed pins. The measured sensitivity was as high as over 34 Count/mN for normal force and 14 to 15 Count/mN for shear force with small noise, which corresponds to less than 1 mN. The hysteresis and the average cross-sensitivity were also found to be less than 2% full scale and 11%, respectively.
Muroyama Masanori; Masanori Muroyama; Takahiro Nakayama; Yoshiyuki Hata; Yutaka Nonomura; Shuji Tanaka. 3-Axis Fully-Integrated Capacitive Tactile Sensor with Flip-Bonded CMOS on LTCC Interposer. Sensors 2017, 17, 2451 .
AMA StyleMuroyama Masanori, Masanori Muroyama, Takahiro Nakayama, Yoshiyuki Hata, Yutaka Nonomura, Shuji Tanaka. 3-Axis Fully-Integrated Capacitive Tactile Sensor with Flip-Bonded CMOS on LTCC Interposer. Sensors. 2017; 17 (11):2451.
Chicago/Turabian StyleMuroyama Masanori; Masanori Muroyama; Takahiro Nakayama; Yoshiyuki Hata; Yutaka Nonomura; Shuji Tanaka. 2017. "3-Axis Fully-Integrated Capacitive Tactile Sensor with Flip-Bonded CMOS on LTCC Interposer." Sensors 17, no. 11: 2451.
Yoshiyuki Hata; Yutaka Nonomura; Yoshiteru Omura; Takahiro Nakayama; Motohiro Fujiyoshi; Hirofumi Funabashi; Teruhisa Akashi; Masanori Muroyama; Shuji Tanaka. Quad-seesaw-electrode type 3-axis tactile sensor with low nonlinearities and low cross-axis sensitivities. Sensors and Actuators A: Physical 2017, 266, 24 -35.
AMA StyleYoshiyuki Hata, Yutaka Nonomura, Yoshiteru Omura, Takahiro Nakayama, Motohiro Fujiyoshi, Hirofumi Funabashi, Teruhisa Akashi, Masanori Muroyama, Shuji Tanaka. Quad-seesaw-electrode type 3-axis tactile sensor with low nonlinearities and low cross-axis sensitivities. Sensors and Actuators A: Physical. 2017; 266 ():24-35.
Chicago/Turabian StyleYoshiyuki Hata; Yutaka Nonomura; Yoshiteru Omura; Takahiro Nakayama; Motohiro Fujiyoshi; Hirofumi Funabashi; Teruhisa Akashi; Masanori Muroyama; Shuji Tanaka. 2017. "Quad-seesaw-electrode type 3-axis tactile sensor with low nonlinearities and low cross-axis sensitivities." Sensors and Actuators A: Physical 266, no. : 24-35.
Robot tactile sensation can enhance human–robot communication in terms of safety, reliability and accuracy. The final goal of our project is to widely cover a robot body with a large number of tactile sensors, which has significant advantages such as accurate object recognition, high sensitivity and high redundancy. In this study, we developed a multi-sensor system with dedicated Complementary Metal-Oxide-Semiconductor (CMOS) Large-Scale Integration (LSI) circuit chips (referred to as “sensor platform LSI”) as a framework of a serial bus-based tactile sensor network system. The sensor platform LSI supports three types of sensors: an on-chip temperature sensor, off-chip capacitive and resistive tactile sensors, and communicates with a relay node via a bus line. The multi-sensor system was first constructed on a printed circuit board to evaluate basic functions of the sensor platform LSI, such as capacitance-to-digital and resistance-to-digital conversion. Then, two kinds of external sensors, nine sensors in total, were connected to two sensor platform LSIs, and temperature, capacitive and resistive sensing data were acquired simultaneously. Moreover, we fabricated flexible printed circuit cables to demonstrate the multi-sensor system with 15 sensor platform LSIs operating simultaneously, which showed a more realistic implementation in robots. In conclusion, the multi-sensor system with up to 15 sensor platform LSIs on a bus line supporting temperature, capacitive and resistive sensing was successfully demonstrated.
Chenzhong Shao; Shuji Tanaka; Takahiro Nakayama; Yoshiyuki Hata; Travis Bartley; Yutaka Nonomura; Masanori Muroyama. A Tactile Sensor Network System Using a Multiple Sensor Platform with a Dedicated CMOS-LSI for Robot Applications. Sensors 2017, 17, 1974 .
AMA StyleChenzhong Shao, Shuji Tanaka, Takahiro Nakayama, Yoshiyuki Hata, Travis Bartley, Yutaka Nonomura, Masanori Muroyama. A Tactile Sensor Network System Using a Multiple Sensor Platform with a Dedicated CMOS-LSI for Robot Applications. Sensors. 2017; 17 (9):1974.
Chicago/Turabian StyleChenzhong Shao; Shuji Tanaka; Takahiro Nakayama; Yoshiyuki Hata; Travis Bartley; Yutaka Nonomura; Masanori Muroyama. 2017. "A Tactile Sensor Network System Using a Multiple Sensor Platform with a Dedicated CMOS-LSI for Robot Applications." Sensors 17, no. 9: 1974.
In this study, a simulation analysis of a miniaturized electron optics for the Multi-Column Massively Parallel Electron Beam Writing system is demonstrated. Analytical evaluation of space charge effect with prototype Massively Parallel Electron Beam Writing (MPEBW) system showed 2.86 nm blur in radius occurs on each beam with a convergence half angle of 3 mrad. The angle of each beam was increased to 10 mrad to reduce the space charge effect, the coulomb blur amount can be kept to less than 1 nm in radius. However, there was limitation to increasing the angle due to a spherical aberration. Since the beam current density from the electron emitter array in the prototype MPEBW system was 100 μA/cm2 and the total beam current was 1μA with 100×100 array of 10μm square emitter, the influence of coulomb blur was small. By contrast, considerably increasing the number of beams and the beam current are planned in near future in MPEBW. The coulomb blur and other aberrations will not be controlled by merely adjusting the beam convergence angle. In order to increase total beam current, miniaturized electron optics have been designed for Multi-beam+Multi-column system. Reduction lens in the designed miniaturized electron optics with crossover free to reduce the influence of coulomb repulsion with narrow convergence half angle. Unlike conventional methods, the electron beams as principal rays do not intersect at one point, so even if the beam becomes extremely narrow, the coulomb repulsion effect does not increase at the crossover area. The reduction of the entire size of parallel beams in the designed electron optics was confirmed by simulation software. The simulation results showed that least confusion disk of 6.5 nm size was obtained at the beam convergence half angles of 3 mrad corresponding to the incident beam of ±0.1 mrad divergence angle. It showed that the miniaturized electron optics was suitable for 10 nm order EB writing. The crossover free electron optics of the miniaturized electron optics is possible due to dispersing the intersection points of the principal rays by a combination of a concentric electron optics and a tapered lens electrode of the reduction lens. © (2017) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Akira Kojima; Naokatsu Ikegami; Hiroshi Miyaguchi; Takashi Yoshida; Ryutaro Suda; Shinya Yoshida; Masanori Muroyama; Kentaro Totsu; Masayoshi Esashi; Nobuyoshi Koshida. Simulation analysis of a miniaturized electron optics of the massively parallel electron-beam direct-write (MPEBDW) for multi-column system. Emerging Patterning Technologies 2017, 10144, 101440 .
AMA StyleAkira Kojima, Naokatsu Ikegami, Hiroshi Miyaguchi, Takashi Yoshida, Ryutaro Suda, Shinya Yoshida, Masanori Muroyama, Kentaro Totsu, Masayoshi Esashi, Nobuyoshi Koshida. Simulation analysis of a miniaturized electron optics of the massively parallel electron-beam direct-write (MPEBDW) for multi-column system. Emerging Patterning Technologies. 2017; 10144 ():101440.
Chicago/Turabian StyleAkira Kojima; Naokatsu Ikegami; Hiroshi Miyaguchi; Takashi Yoshida; Ryutaro Suda; Shinya Yoshida; Masanori Muroyama; Kentaro Totsu; Masayoshi Esashi; Nobuyoshi Koshida. 2017. "Simulation analysis of a miniaturized electron optics of the massively parallel electron-beam direct-write (MPEBDW) for multi-column system." Emerging Patterning Technologies 10144, no. : 101440.
This study has opened a possibility to fabricate through silicon vias (TSV) in a LSI wafer available by commercial multi-project wafer (MPW) service and integrate the LSI and MEMS by wafer bonding. 300 μm deep Cu annular type TSV were fabricated in a TSMC 0.18 μm CMOS LSI MPW cut into 4" diameter. The developed TSV process managed mechanically fragile property of the laser-ablated MPW by low stress TEOS PECVD SiO2 backfilling, surface planarization, temporally wafer support etc. The LSI and MEMS were integrated by Au-Au thermocompression bonding at 300°C, and the completed device worked via the TSV as designed. “Tohoku TSV CMOS-MEMS platform” presented in this paper gives many chances for cost-effective development of surface-mountable CMOS-integrated MEMS.
Yukio Suzuki; Hideyuki Fukushi; Masanori Muroyama; Yoshiyuki Hata; Takahiro Nakayama; Rakesh Chand; Hideki Hirano; Yutaka Nonomura; Hirofumi Funabashi; Shuji Tanaka. 300 μm Deep through silicon via in laser-ablated CMOS multi-project wafer for cost-effective development of integrated MEMS. 2017 IEEE 30th International Conference on Micro Electro Mechanical Systems (MEMS) 2017, 744 -748.
AMA StyleYukio Suzuki, Hideyuki Fukushi, Masanori Muroyama, Yoshiyuki Hata, Takahiro Nakayama, Rakesh Chand, Hideki Hirano, Yutaka Nonomura, Hirofumi Funabashi, Shuji Tanaka. 300 μm Deep through silicon via in laser-ablated CMOS multi-project wafer for cost-effective development of integrated MEMS. 2017 IEEE 30th International Conference on Micro Electro Mechanical Systems (MEMS). 2017; ():744-748.
Chicago/Turabian StyleYukio Suzuki; Hideyuki Fukushi; Masanori Muroyama; Yoshiyuki Hata; Takahiro Nakayama; Rakesh Chand; Hideki Hirano; Yutaka Nonomura; Hirofumi Funabashi; Shuji Tanaka. 2017. "300 μm Deep through silicon via in laser-ablated CMOS multi-project wafer for cost-effective development of integrated MEMS." 2017 IEEE 30th International Conference on Micro Electro Mechanical Systems (MEMS) , no. : 744-748.
Tactile sensing is required for assistant robots. A new stacked sensor head was proposed which detects forces and thermal sensations with a nerve-net LSI chip. To measure temperatures and heat flows, the sensor head required a thin and small heater to heat up the sensor head. The features of the polyimide heater are compact, low heat capacity, low power consumption and ease of attaching it to the LSI chip. The polyimide heater consisted of Au 10 nm/Cu 200 nm/Cr 20 nm thickness layers on a polyimide film. The surface of the sensor head heated up to 60 °C by the polyimide heater with 0.3 W. By the Cu thin film polyimide heater, the small stacked sensor head with the nerve-net LSI chip is enable to detect forces, temperatures, and heat flows, simultaneously.
Yusuke Suganuma; Minoru Sasaki; Takahiro Nakayama; Masanori Muroyama; Yutaka Nonomura. Cu Thin Film Polyimide Heater for Nerve-Net Tactile Sensor. Proceedings 2017, 1, 303 .
AMA StyleYusuke Suganuma, Minoru Sasaki, Takahiro Nakayama, Masanori Muroyama, Yutaka Nonomura. Cu Thin Film Polyimide Heater for Nerve-Net Tactile Sensor. Proceedings. 2017; 1 (4):303.
Chicago/Turabian StyleYusuke Suganuma; Minoru Sasaki; Takahiro Nakayama; Masanori Muroyama; Yutaka Nonomura. 2017. "Cu Thin Film Polyimide Heater for Nerve-Net Tactile Sensor." Proceedings 1, no. 4: 303.
This paper describes a MEMS-CMOS integrated tactile sensor for surface mounting on a flexible and stretchable bus line. The sensor is featured by the following configurations; (1) A sensing diaphragm is formed on a CMOS substrate by backside etching, and (2) the CMOS substrate is flip-bonded to a special low temperature cofired ceramic (LTCC) substrate with Au through vias. The flipped CMOS substrate and the LTCC substrate were electrically and mechanically connected using Au–Au bonding, which also formed differential capacitive gaps. The structure and fabrication process are simple compared with the existing surface-mountable MEMS-CMOS integrated sensors. Bendable and stretchable bus lines were fabricated by etching metal, which is deposited on a polyimide substrate and the outer shape is then determined by laser cutting. The bus line with a silicone protection coat is capable of stretching up to 50%. The sensors covered with silicone worked even under 10% stretching of the bus line. The tactile sensors mounted on the surface of the flexible bus line were characterized in terms of force sensitivity. Also, smart functions such as threshold and adaptation operations and the configuration of sensor parameters were demonstrated.
Sho Asano; Masanori Muroyama; Travis Bartley; Takahiro Kojima; Takahiro Nakayama; Ui Yamaguchi; Hitoshi Yamada; Yutaka Nonomura; Yoshiyuki Hata; Hirofumi Funabashi; Shuji Tanaka. Surface-mountable capacitive tactile sensors with flipped CMOS-diaphragm on a flexible and stretchable bus line. Sensors and Actuators A: Physical 2016, 240, 167 -176.
AMA StyleSho Asano, Masanori Muroyama, Travis Bartley, Takahiro Kojima, Takahiro Nakayama, Ui Yamaguchi, Hitoshi Yamada, Yutaka Nonomura, Yoshiyuki Hata, Hirofumi Funabashi, Shuji Tanaka. Surface-mountable capacitive tactile sensors with flipped CMOS-diaphragm on a flexible and stretchable bus line. Sensors and Actuators A: Physical. 2016; 240 ():167-176.
Chicago/Turabian StyleSho Asano; Masanori Muroyama; Travis Bartley; Takahiro Kojima; Takahiro Nakayama; Ui Yamaguchi; Hitoshi Yamada; Yutaka Nonomura; Yoshiyuki Hata; Hirofumi Funabashi; Shuji Tanaka. 2016. "Surface-mountable capacitive tactile sensors with flipped CMOS-diaphragm on a flexible and stretchable bus line." Sensors and Actuators A: Physical 240, no. : 167-176.
Hiroshi Miyaguchi; Masanori Muroyama; Shinya Yoshida; Naokatsu Ikegami; Akira Kojima; Shuji Tanaka; Masayoshi Esashi. Development of a 17×17 Parallel Electron Beam Lithography System. IEEJ Transactions on Sensors and Micromachines 2016, 136, 413 -419.
AMA StyleHiroshi Miyaguchi, Masanori Muroyama, Shinya Yoshida, Naokatsu Ikegami, Akira Kojima, Shuji Tanaka, Masayoshi Esashi. Development of a 17×17 Parallel Electron Beam Lithography System. IEEJ Transactions on Sensors and Micromachines. 2016; 136 (9):413-419.
Chicago/Turabian StyleHiroshi Miyaguchi; Masanori Muroyama; Shinya Yoshida; Naokatsu Ikegami; Akira Kojima; Shuji Tanaka; Masayoshi Esashi. 2016. "Development of a 17×17 Parallel Electron Beam Lithography System." IEEJ Transactions on Sensors and Micromachines 136, no. 9: 413-419.
This paper reports a 3-axis MEMS-CMOS integrated tactile sensor for surface-mounting on a flexible bus line. This 3-axis sensor uses a bran-new CMOS LSI with capacitive sensing circuit and other extended functionalities (e.g. configurability and a robust clock data recovery algorithm). The sensor is composed of a flip-bonded CMOS substrate with a sensing diaphragm and a special low temperature co-fired ceramics (LTCC) substrate with vias. These substrates are electrically and mechanically connected by Au-Au bonding, forming sealed differential capacitive gaps. The completed sensor outputs coded 3-axis digital signals according to applied 3-axis force with small cross-sensitivity and hysteresis.
Sho Asano; Masanori Muroyama; Travis Bartley; Takahiro Nakayama; Ui Yamaguchi; Hitoshi Yamada; Yoshiyuki Hata; Yutaka Nonomura; Shuji Tanaka. 3-Axis fully-integrated surface-mountable differential capacitive tactile sensor by CMOS flip-bonding. 2016 IEEE 29th International Conference on Micro Electro Mechanical Systems (MEMS) 2016, 850 -853.
AMA StyleSho Asano, Masanori Muroyama, Travis Bartley, Takahiro Nakayama, Ui Yamaguchi, Hitoshi Yamada, Yoshiyuki Hata, Yutaka Nonomura, Shuji Tanaka. 3-Axis fully-integrated surface-mountable differential capacitive tactile sensor by CMOS flip-bonding. 2016 IEEE 29th International Conference on Micro Electro Mechanical Systems (MEMS). 2016; ():850-853.
Chicago/Turabian StyleSho Asano; Masanori Muroyama; Travis Bartley; Takahiro Nakayama; Ui Yamaguchi; Hitoshi Yamada; Yoshiyuki Hata; Yutaka Nonomura; Shuji Tanaka. 2016. "3-Axis fully-integrated surface-mountable differential capacitive tactile sensor by CMOS flip-bonding." 2016 IEEE 29th International Conference on Micro Electro Mechanical Systems (MEMS) , no. : 850-853.
Making the best use of the characteristic features in nanocrystalline Si (nc-Si) ballistic hot electron source, an alternative lithographic technology is presented based on two approaches: physical excitation in vacuum and chemical reduction in solutions. The nc-Si cold cathode is composed of a thin metal film, an nc-Si layer, an n+-Si substrate, and an ohmic back contact. Under a biased condition, energetic electrons are uniformly and directionally emitted through the thin surface electrodes. In vacuum, this emitter is available for active-matrix drive massive parallel lithography. Arrayed 100×100 emitters (each emitting area: 10×10 μm2) are fabricated on a silicon substrate by a conventional planar process, and then every emitter is bonded with the integrated driver using through-silicon-via interconnect technology. Another application is the use of this emitter as an active electrode supplying highly reducing electrons into solutions. A very small amount of metal-salt solutions is dripped onto the nc-Si emitter surface, and the emitter is driven without using any counter electrodes. After the emitter operation, thin metal and elemental semiconductors (Si and Ge) films are uniformly deposited on the emitting surface. Spectroscopic surface and compositional analyses indicate that there are no significant contaminations in deposited thin films.
Nobuyoshi Koshida; Akira Kojima; Naokatsu Ikegami; Ryutaro Suda; Mamiko Yagi; Junichi Shirakashi; Hiroshi Miyaguchi; Masanori Muroyama; Shinya Yoshida; Kentaro Totsu; Masayoshi Esashi. Development of ballistic hot electron emitter and its applications to parallel processing: active-matrix massive direct-write lithography in vacuum and thin-film deposition in solutions. Journal of Micro/Nanolithography, MEMS, and MOEMS 2015, 14, 031215 -031215.
AMA StyleNobuyoshi Koshida, Akira Kojima, Naokatsu Ikegami, Ryutaro Suda, Mamiko Yagi, Junichi Shirakashi, Hiroshi Miyaguchi, Masanori Muroyama, Shinya Yoshida, Kentaro Totsu, Masayoshi Esashi. Development of ballistic hot electron emitter and its applications to parallel processing: active-matrix massive direct-write lithography in vacuum and thin-film deposition in solutions. Journal of Micro/Nanolithography, MEMS, and MOEMS. 2015; 14 (3):031215-031215.
Chicago/Turabian StyleNobuyoshi Koshida; Akira Kojima; Naokatsu Ikegami; Ryutaro Suda; Mamiko Yagi; Junichi Shirakashi; Hiroshi Miyaguchi; Masanori Muroyama; Shinya Yoshida; Kentaro Totsu; Masayoshi Esashi. 2015. "Development of ballistic hot electron emitter and its applications to parallel processing: active-matrix massive direct-write lithography in vacuum and thin-film deposition in solutions." Journal of Micro/Nanolithography, MEMS, and MOEMS 14, no. 3: 031215-031215.
Making the best use of the characteristic features in nanocrystalline Si (nc-Si) ballistic hot electron source, the alternative lithographic technology is presented based on the two approaches: physical excitation in vacuum and chemical reduction in solutions. The nc-Si cold cathode is a kind of metal-insulator-semiconductor (MIS) diode, composed of a thin metal film, an nc-Si layer, an n+-Si substrate, and an ohmic back contact. Under a biased condition, energetic electrons are uniformly and directionally emitted through the thin surface electrodes. In vacuum, this emitter is available for active-matrix drive massive parallel lithography. Arrayed 100×100 emitters (each size: 10×10 μm2, pitch: 100 μm) are fabricated on silicon substrate by conventional planar process, and then every emitter is bonded with integrated complementary metal-oxide-semiconductor (CMOS) driver using through-silicon-via (TSV) interconnect technology. Electron multi-beams emitted from selected devices are focused by a micro-electro-mechanical system (MEMS) condenser lens array and introduced into an accelerating system with a demagnification factor of 100. The electron accelerating voltage is 5 kV. The designed size of each beam landing on the target is 10×10 nm2 in square. Here we discuss the fabrication process of the emitter array with TSV holes, implementation of integrated ctive-matrix driver circuit, the bonding of these components, the construction of electron optics, and the overall operation in the exposure system including the correction of possible aberrations. The experimental results of this mask-less parallel pattern transfer are shown in terms of simple 1:1 projection and parallel lithography under an active-matrix drive scheme. Another application is the use of this emitter as an active electrode supplying highly reducing electrons into solutions. A very small amount of metal-salt solutions is dripped onto the nc-Si emitter surface, and the emitter is driven without using any counter electrodes. After the emitter operation, thin metal (Cu, Ni, Co, and so on) and elemental semiconductors (Si and Ge) films are uniformly deposited on the emitting surface. Spectroscopic surface and compositional analyses indicate that there are no significant contaminations in deposited thin films. The implication is that ballistic hot electrons injected into solutions with appropriate kinetic energies induce preferential reduction of positive ions in solutions with no by-products followed by atom migration, nuclei formation, and the subsequent thin film growth. The availability of this technique for depositing thin SiGe films is also demonstrated by using a mixture solution. When patterned fine emission windows are formed on the emitter surface, metal and semiconductor wires array are directly deposited in parallel.
N. Koshida; A. Kojima; N. Ikegami; R. Suda; M. Yagi; J. Shirakashi; T. Yoshida; Hiroshi Miyaguchi; Masanori Muroyama; H. Nishino; S. Yoshida; M. Sugata; Kentaro Totsu; M. Esashi. Development of ballistic hot electron emitter and its applications to parallel processing: active-matrix massive direct-write lithography in vacuum and thin films deposition in solutions. Alternative Lithographic Technologies VII 2015, 9423, 942313 .
AMA StyleN. Koshida, A. Kojima, N. Ikegami, R. Suda, M. Yagi, J. Shirakashi, T. Yoshida, Hiroshi Miyaguchi, Masanori Muroyama, H. Nishino, S. Yoshida, M. Sugata, Kentaro Totsu, M. Esashi. Development of ballistic hot electron emitter and its applications to parallel processing: active-matrix massive direct-write lithography in vacuum and thin films deposition in solutions. Alternative Lithographic Technologies VII. 2015; 9423 ():942313.
Chicago/Turabian StyleN. Koshida; A. Kojima; N. Ikegami; R. Suda; M. Yagi; J. Shirakashi; T. Yoshida; Hiroshi Miyaguchi; Masanori Muroyama; H. Nishino; S. Yoshida; M. Sugata; Kentaro Totsu; M. Esashi. 2015. "Development of ballistic hot electron emitter and its applications to parallel processing: active-matrix massive direct-write lithography in vacuum and thin films deposition in solutions." Alternative Lithographic Technologies VII 9423, no. : 942313.
Hiroshi Miyaguchi; Masanori Muroyama; Shinya Yoshida; Naokatsu Ikegami; Akira Kojima; Ryosuke Kaneko; Kentaro Totsu; Shuji Tanaka; Nobuyoshi Koshida; Masayoshi Esashi. An LSI for Massive Parallel Electron Beam Lithography: Its Design and Evaluation. IEEJ Transactions on Sensors and Micromachines 2015, 135, 374 -381.
AMA StyleHiroshi Miyaguchi, Masanori Muroyama, Shinya Yoshida, Naokatsu Ikegami, Akira Kojima, Ryosuke Kaneko, Kentaro Totsu, Shuji Tanaka, Nobuyoshi Koshida, Masayoshi Esashi. An LSI for Massive Parallel Electron Beam Lithography: Its Design and Evaluation. IEEJ Transactions on Sensors and Micromachines. 2015; 135 (10):374-381.
Chicago/Turabian StyleHiroshi Miyaguchi; Masanori Muroyama; Shinya Yoshida; Naokatsu Ikegami; Akira Kojima; Ryosuke Kaneko; Kentaro Totsu; Shuji Tanaka; Nobuyoshi Koshida; Masayoshi Esashi. 2015. "An LSI for Massive Parallel Electron Beam Lithography: Its Design and Evaluation." IEEJ Transactions on Sensors and Micromachines 135, no. 10: 374-381.
Naokatsu Ikegami; Akira Kojima; Hiroshi Miyaguchi; Takashi Yoshida; Shinya Yoshida; Masanori Muroyama; Masanori Sugata; Nobuyoshi Koshida; Kentaro Totsu; Masayoshi Esashi. Review of Development and Performance Evaluation of Active-matrix Nanocrystalline Si Electron Emitter Array for Massively Parallel Electron Beam Direct-write Lithography. IEEJ Transactions on Sensors and Micromachines 2015, 135, 221 -229.
AMA StyleNaokatsu Ikegami, Akira Kojima, Hiroshi Miyaguchi, Takashi Yoshida, Shinya Yoshida, Masanori Muroyama, Masanori Sugata, Nobuyoshi Koshida, Kentaro Totsu, Masayoshi Esashi. Review of Development and Performance Evaluation of Active-matrix Nanocrystalline Si Electron Emitter Array for Massively Parallel Electron Beam Direct-write Lithography. IEEJ Transactions on Sensors and Micromachines. 2015; 135 (6):221-229.
Chicago/Turabian StyleNaokatsu Ikegami; Akira Kojima; Hiroshi Miyaguchi; Takashi Yoshida; Shinya Yoshida; Masanori Muroyama; Masanori Sugata; Nobuyoshi Koshida; Kentaro Totsu; Masayoshi Esashi. 2015. "Review of Development and Performance Evaluation of Active-matrix Nanocrystalline Si Electron Emitter Array for Massively Parallel Electron Beam Direct-write Lithography." IEEJ Transactions on Sensors and Micromachines 135, no. 6: 221-229.
We report an advanced type of LSI-based amperometric sensor array with an effective light shield. We have developed a large-scale integrated (LSI) complementary metal-oxide semiconductor (CMOS)-based amperometric sensor array system called “Bio-LSI” as a platform for electrochemical bio-imaging and multi-point biosensing with 400 measurement points. In this study, we newly developed a Bio-LSI chip with a light-shield structure and a mode-selectable function with the aim of extending the application range of Bio-LSI. The light shield created by the top metal layer of the LSI chip significantly reduces the noise generated by the photocurrent, whose value is less than 1% of the previous Bio-LSI without the light shield. The mode-selectable function enables the individual operation of 400 electrodes in off, electrometer, V1, and V2 mode. The off-mode cuts the electrode from the electric circuit. The electrometer-mode reads out the electrode potential. The V1-mode and the V2-mode set the selected sensor electrode at two different independent voltages and read out the current. We demonstrated the usefulness of the mode-selectable function. First, we displayed a dot picture based on the redox reactions of 2.0 mM ferrocenemethanol at 400 electrodes by applying two different independent voltages using the V1 and V2 modes. Second, we carried out a simultaneous detection of O 2 and H 2 O 2 using the V1 and V2 modes. Third, we used the off and V1 modes for the modification of the osmium-polyvinylpyridine gel polymer containing horseradish peroxidase (Os-HRP) at the selected electrodes, which act as sensors for H 2 O 2 . These results confirm that the advanced version of Bio-LSI is a promising tool that can be applied to a wide range of analytical fields.
Kumi Y. Inoue; Masahki Matsudaira; Masanori Nakano; Kosuke Ino; Chika Sakamoto; Yusuke Kanno; Reyushi Kubo; Ryota Kunikata; Atsushi Kira; Atsushi Suda; Ryota Tsurumi; Toshihito Shioya; Shinya Yoshida; Masanori Muroyama; Tomohiro Ishikawa; Hitoshi Shiku; Shiro Satoh; Masayoshi Esashi; Tomokazu Matsue. Advanced LSI-based amperometric sensor array with light-shielding structure for effective removal of photocurrent and mode selectable function for individual operation of 400 electrodes. Lab on a Chip 2014, 15, 848 -856.
AMA StyleKumi Y. Inoue, Masahki Matsudaira, Masanori Nakano, Kosuke Ino, Chika Sakamoto, Yusuke Kanno, Reyushi Kubo, Ryota Kunikata, Atsushi Kira, Atsushi Suda, Ryota Tsurumi, Toshihito Shioya, Shinya Yoshida, Masanori Muroyama, Tomohiro Ishikawa, Hitoshi Shiku, Shiro Satoh, Masayoshi Esashi, Tomokazu Matsue. Advanced LSI-based amperometric sensor array with light-shielding structure for effective removal of photocurrent and mode selectable function for individual operation of 400 electrodes. Lab on a Chip. 2014; 15 (3):848-856.
Chicago/Turabian StyleKumi Y. Inoue; Masahki Matsudaira; Masanori Nakano; Kosuke Ino; Chika Sakamoto; Yusuke Kanno; Reyushi Kubo; Ryota Kunikata; Atsushi Kira; Atsushi Suda; Ryota Tsurumi; Toshihito Shioya; Shinya Yoshida; Masanori Muroyama; Tomohiro Ishikawa; Hitoshi Shiku; Shiro Satoh; Masayoshi Esashi; Tomokazu Matsue. 2014. "Advanced LSI-based amperometric sensor array with light-shielding structure for effective removal of photocurrent and mode selectable function for individual operation of 400 electrodes." Lab on a Chip 15, no. 3: 848-856.
Yoshihiro Nakano; Masanori Muroyama; Mitsutoshi Makihata; Shuji Tanaka; Sakae Matsuzaki; Hitoshi Yamada; Takahiro Nakayama; Ui Yamaguchi; Yutaka Nonomura; Motohiro Fujiyoshi; Masayoshi Esashi. A Simulated Network System Prototype for Development of a Networked Tactile Sensor System with Integrated MEMS-LSI Tactile Sensors. IEEJ Transactions on Sensors and Micromachines 2012, 132, 288 -295.
AMA StyleYoshihiro Nakano, Masanori Muroyama, Mitsutoshi Makihata, Shuji Tanaka, Sakae Matsuzaki, Hitoshi Yamada, Takahiro Nakayama, Ui Yamaguchi, Yutaka Nonomura, Motohiro Fujiyoshi, Masayoshi Esashi. A Simulated Network System Prototype for Development of a Networked Tactile Sensor System with Integrated MEMS-LSI Tactile Sensors. IEEJ Transactions on Sensors and Micromachines. 2012; 132 (9):288-295.
Chicago/Turabian StyleYoshihiro Nakano; Masanori Muroyama; Mitsutoshi Makihata; Shuji Tanaka; Sakae Matsuzaki; Hitoshi Yamada; Takahiro Nakayama; Ui Yamaguchi; Yutaka Nonomura; Motohiro Fujiyoshi; Masayoshi Esashi. 2012. "A Simulated Network System Prototype for Development of a Networked Tactile Sensor System with Integrated MEMS-LSI Tactile Sensors." IEEJ Transactions on Sensors and Micromachines 132, no. 9: 288-295.
Masanori Muroyama; Mitsutoshi Makihata; Yoshihiro Nakano; Sakae Matsuzaki; Hitoshi Yamada; Ui Yamaguchi; Takahiro Nakayama; Yutaka Nonomura; Motohiro Fujiyoshi; Shuji Tanaka; Masayoshi Esashi. Development of an LSI for Tactile Sensor Systems on the Whole-Body of Robots. IEEJ Transactions on Sensors and Micromachines 2011, 131, 302 -309.
AMA StyleMasanori Muroyama, Mitsutoshi Makihata, Yoshihiro Nakano, Sakae Matsuzaki, Hitoshi Yamada, Ui Yamaguchi, Takahiro Nakayama, Yutaka Nonomura, Motohiro Fujiyoshi, Shuji Tanaka, Masayoshi Esashi. Development of an LSI for Tactile Sensor Systems on the Whole-Body of Robots. IEEJ Transactions on Sensors and Micromachines. 2011; 131 (8):302-309.
Chicago/Turabian StyleMasanori Muroyama; Mitsutoshi Makihata; Yoshihiro Nakano; Sakae Matsuzaki; Hitoshi Yamada; Ui Yamaguchi; Takahiro Nakayama; Yutaka Nonomura; Motohiro Fujiyoshi; Shuji Tanaka; Masayoshi Esashi. 2011. "Development of an LSI for Tactile Sensor Systems on the Whole-Body of Robots." IEEJ Transactions on Sensors and Micromachines 131, no. 8: 302-309.