For biomedical applications, smart materials that are used as sensors or actuators have to match some criteria, especially bio-compatibility and softness. Smart polymers are candidates that fulfill these two criteria. A sensitivity to compression is created by adding magnetic particles to a compressible foam polymer. A foam-based composite is fabricated for its small Poisson’s ratio, which enables significant compression, up to 50%. This large compression induces a change in its magnetic properties, which can be detected using coils. By setting the sensing coils as a compact array of 3 × 3, the sensor successfully detected and localized an applied deformation.

A novel surface activation technology for Cu-Cu bonding-based wafer-level vacuum packaging using hot-wire-generated atomic hydrogen treatment was developed. Vacuum sealing temperature at 300 °C was achieved by atomic hydrogen pre-treatment for Cu native oxide reduction, while 350 °C was needed by the conventional wet chemical oxide reduction procedure. A remote-type hot-wire tool was employed to minimize substrate overheating by thermal emission from the hot-wire. The maximum substrate temperature during the pre-treatment is lower than the temperature of Cu nano-grain re-crystallization, which enhances Cu atomic diffusion during the bonding process. Even after 24 h wafer storage in atmospheric conditions after atomic hydrogen irradiation, low-temperature vacuum sealing was achieved because surface hydrogen species grown by the atomic hydrogen treatment suppressed re-oxidation. Vacuum sealing yield, pressure in the sealed cavity and bonding shear strength by atomic hydrogen pre-treated Cu-Cu bonding are 90%, 5 kPa and 100 MPa, respectively, which are equivalent to conventional Cu-Cu bonding at higher temperature. Leak rate of the bonded device is less than 10⁻¹⁴ Pa m³ s⁻¹ order, which is applicable for practical use. The developed technology can contribute to low-temperature hermetic packaging.

A simple micro-machined pressure sensor, based on the stress-impedance (SI) effect, was fabricated herein using typical micro-fabrication technologies. To sense pressure, a 1-µm thin, soft magnetic metallic film of FeSiB was sputtered and used as a diaphragm. Its electrical response (impedance change) was measured under pressure in a frequency band from 5 to 500 MHz. A lumped-element equivalent electric circuit was used to separate the impedance of the soft magnetic metal from other parasitic elements. The impedance change clearly depended on the applied pressure. It was also shown that the impedance change could be explained by a change in relative permeability, according to the theory of the SI effect. The radial stress in the diaphragm and the relative permeability exhibited a linear relationship. At a measurement frequency of 200 MHz, the largest sensor response, with a gauge factor of 385.7, was found. It was in the same order as the conventional sensors. As the proposed device is very simple, it has the potential for application as a cheap pressure sensor.

We describe an original integration technological platform for the miniaturization of micromachined on-chip optical microscopes, such as the laser scanning confocal microscope. The platform employs the multi-wafer vertical integration approach, combined with integrated glass-based micro-optics as well as micro-electro-mechanical systems (MEMS) components, where the assembly uses the heterogeneous bonding and interconnecting technologies. Various heterogeneous components are disposed in vertically stacked building blocks (glass microlens, MEMS actuator, beamsplitter, etc.) in a minimum space. The platform offers the integrity and potential of MEMS microactuators integrated with micro-optics, providing miniaturized and low cost solutions to create micromachined on-chip optical microscopes.

In this article, the stress/stress sensing capability of FeSiB thin films is demonstrated and discussed. The sensing relies on the change in permeability by the application of stress, compressive and tensile, and the application of DC magnetic field. This susceptibility/permeability was tested by the exciting field (AC) being in the same direction with the applied stress. The susceptibility was shown to exhibit a maximal value at a given applied stress, the critical stress. Moreover, this maximal amplitude and position was changing with the application of an external DC magnetic field. For the DC field applied in the direction of the exciting field (AC) and longitudinal to the stress, the critical stress was shifted toward negative values and for the DC field applied perpendicularly, the critical stress was shifted toward larger positive values. This was experimentally demonstrated, and a model was constructed for a better understanding.