Absorbing infrared radiation efficiently is important for critical applications such as thermal imaging and infrared spectroscopy. Common infrared absorbing materials are not standard in Si VLSI technology. We demonstrate ultra-broadband mid-infrared absorbers based purely on silicon. Broadband absorption is achieved by the combined effects of free carrier absorption, and vibrational and plasmonic absorption resonances. The absorbers, consisting of periodically arranged silicon gratings, can be fabricated using standard optical lithography and deep reactive ion etching techniques, allowing for cost-effective and wafer-scale fabrication of micro-structures. Absorption wavebands in excess of 15 micrometers (5–20 μm) are demonstrated with more than 90% average absorptivity. The structures also exhibit broadband absorption performance even at large angles of incidence (θ = 50°), and independent of polarization.

Self aligned nano patterning of TiO₂using area selective atomic area deposition.

Nanoscale materials often have stochastic material properties due to a random distribution of material defects and an insufficient number of defects to ensure a consistent average mechanical response. Current methods to measure the mechanical properties employ MEMS-based actuators. The nanoscale specimens are typically mounted manually onto the load platform, so the boundary conditions have random variations, complicating the experimental measurement of the intrinsic stochasticity of the material properties. Here we show methods for monolithic integration of a nanoscale specimen co-fabricated with the loading platform. The nanoscale specimen is gold with dimensions of ∼40 nm thickness, 350 ± 50 nm width, and 7 μm length and the loading platform is an interdigitated electrode electrostatic actuator. The experiment is performed in a scanning electron microscope and digital image correlation is employed to measure displacements to determine stress and strain. The ultimate tensile strength of the nanocrystalline nanoscale specimen approaches 1 GPa, consistent with measurements made by other nanometer scale sample characterization methods on other material samples at the nanometer scale, as well as gold samples at the nanometer scale. The batch-compatible microfabrication method can be used to create nominally identical nanoscale specimens and boundary conditions for a broad range of materials.

Si nanowire (NW) stacks are fabricated by utilizing the scalloping effect of inductively coupled plasma deep reactive ion etching. When two etch windows are brought close enough, scallops from both sides will ideally meet along the dividing centerline of the windows turning the separating material column into an array of vertically stacked strings. Upon further thinning of these NW precursors by oxidation followed by oxide etching, Si NWs with diameters ranging from 50 nm to above 100 nm are obtained. The pattern of NWs is determined solely by photolithography. Various geometries ranging from T-junctions to circular coils are demonstrated in addition to straight NWs along specific crystallographic orientations. The number of NWs in a stack is determined by the number of etch cycles utilized. Due to the precise lithographic definition of NW location and orientation, the technique provides a convenient batch-compatible tool for the integration of NWs with MEMS. This aspect is demonstrated with a microgripper, where an electrostatic actuation mechanism is simultaneously fabricated with the accompanying NW end-effectors. Mechanical integrity of the NW-MEMS bond and the manipulation capability of the gripper are demonstrated. Overall, the proposed technique exhibits a batch-compatible approach to the issue of micronanointegration.