Introduction: This study aimed to characterise the effects of ketosis on milk yield and composition and digestive capacity in transition dairy cows. Material and Methods: Seven ketotic and seven healthy cows were housed in individual stalls for six days. Samples of plasma, milk, refused total mixed ration, and faeces were collected, and the blood biochemical parameters, milk yield and composition, dry matter intake, and faecal dry matter (FDM) production were determined. Results: Compared with healthy cows, the ketotic cows had significantly higher concentrations of milk fat and citrate, but lower levels of milk protein and lactose. The cows exhibited a need for acid detergent fibre in forage and better digestion of neutral detergent fibre, starch, crude protein, and phosphorus than healthy cows, but more fat and gross energy were excreted in their faeces. Ketotic cows had higher energy-corrected milk yields and lower FDM than healthy cows. Conclusion: Lower feed intake coinciding with the requirement to maintain high milk production is considered to be the cause of ketosis in dairy cows. Ketotic cows exhibited lower dry matter fat digestion.

Fatty liver is a common metabolic disorder of dairy cows during the transition period. Historically, the diagnosis of fatty liver has involved liver biopsy, biochemical or histological examination of liver specimens, and ultrasonographic imaging of the liver. However, more convenient and noninvasive methods would be beneficial for the diagnosis of fatty liver in dairy cows. The plasma metabolic profiles of dairy cows with fatty liver and normal (control) cows were investigated to identify new biomarkers using (1)H nuclear magnetic resonance. Compared with the control group, the primary differences in the fatty liver group included increases in β-hydroxybutyric acid, acetone, glycine, valine, trimethylamine-N-oxide, citrulline, and isobutyrate, and decreases in alanine, asparagine, glucose, γ-aminobutyric acid glycerol, and creatinine. This analysis revealed a global profile of endogenous metabolites, which may present potential biomarkers for the diagnosis of fatty liver in dairy cows.

Laser speckle has a negative effect on laser projectors, so reducing laser speckle is crucial for the development of laser projector displays. We primarily focus on studying the laser speckle contrast of laser projector displays and the mechanism for reducing speckle. Based on the theory of decreasing temporal and spatial coherence of laser light, this report derives the complete formula for calculating speckle contrast in a laser projector display and provides detailed calculation procedures. According to the comprehensive formula, the primary factors influencing speckle contrast encompass wavelength, spectrum, angles of incidence or observation of lasers, the roughness of the screen surface, the number of independent speckle patterns generated by a moving diffuser, and the number of resolution elements within one eye resolution element in the projector lens. Various methods have been used in the projection engine to suppress speckle, and the main factors for reducing speckle have been verified through theoretical calculations and experimental verification. At a testing distance of 700 mm and with an F-number of 41.7 for the detector lens, the RGB laser speckle contrasts were measured to be 9.1%, 7.3%, and 10.4%, respectively, which aligns well with the results obtained from theoretical calculations. Meanwhile, the speckle contrast of the white field was also measured, yielding a result of 5.6%. The speckle contrast becomes imperceptible when the viewing distance exceeds 2000 mm in our projection system.

Near-field bowing a laser diode bar (i.e., the “SMILE” effect) degrades the laser beam brightness, adversely affecting optical coupling and beam shaping. Due to thermally induced stress during the bonding process, the emitters in a laser diode array (LDA) are vertically displaced, which causes the SMILE effect. The mismatch between the coefficients of thermal expansion of an LDA (GaAs with 6.4 ppm/K) and a heat sink (Cu with 16.4 ppm/K) is a large obstacle in the LDA bonding process, because it provokes thermal stress and a large SMILE value, resulting in a larger divergence angle and a wider line after focusing and collimation. In this paper, the changes in stress and strain (SMILE value) and their effects on the laser bar as a function of the copper-tungsten (CuW) submount thickness were theoretically and experimentally studied. The finite element modeling simulations and experimental results show that the compression stress on the laser bar decreases with increasing CuW submount thickness because the CuW submount works as a buffer layer and can absorb stress. However, the laser bar out-of-plane strain (SMILE value) is approximately zero when the LDA is directly bonded onto the heat sink without a submount; the SMILE value is maximized when the CuW submount thickness is increased to approximately one half or 44% of the heat sink. Beyond that, the SMILE value decreases with increasing CuW submount thickness.

In this paper, the packaging-induced stresses are theoretically calculated by modeling multilayered structures for different packaging structures. We report a method to measure the packaging-induced stress of a laser diode array (LDA) by comparing the emission wavelength of the single emitter located in the middle of a laser bar before and after packaging. The wavelength is tested under a low duty cycle (50 μs/10 Hz, DC 0.05%) to eliminate the thermal effect to wavelength shifting. Experimental calculation results for the packaging-induced stress of LDAs are in good agreement with the theoretical calculations and simulation results. For a GaAs laser bar, we find the packaging stresses are compression stresses, which make the emission wavelength blue-shift in terms of $1.09\times {10}^{-2}\mathrm{nm}/\mathrm{MPa}$. We propose a mapping of packaging-induced stress distribution in laser bars on a microscopic scale by considering the emission spectra of each emitter in a laser bar. Compared to single-emitter resolved photo-current or micro-photoluminescence measurements, as proposed by other authors, we offer a much easier tool to test and map the distribution of packaging-induced stress in laser bars.

Due to thermal stress, each emitter in a semiconductor laser bar or array is vertically displaced along the p-n junction; the result is that each emitter is not in a line, called near-field nonlinearity. Near-field nonlinearity along a laser bar (also known as “SMILE” effect) degrades the laser beam brightness, which causes an adverse effect on optical coupling and beam shaping. A large SMILE value causes a large divergence angle after collimation and a wider line after collimation and focusing. We simulate the factors affecting the SMILE value of a high-power diode laser array on a microchannel cooler (MCC). According to the simulation results, we have fabricated a series of laser bars bonded on MCCs with lower SMILE value. After simulation and experiment analysis, we found the key factor to affect SMILE is the deformation of the thin MCC because of the distribution of strain and stress in it. We also decreased the SMILE value of 1-cm-wide full bar AuSn bonded on MCCs from 12 to 1 μm by balancing force on MCC to minimize the deformation.