An important trend in electronics involves the development of materials, mechanical designs and manufacturing strategies that enable the use of unconventional substrates, such as polymer films, metal foils, paper sheets or rubber slabs. The last possibility is particularly challenging because the systems must accommodate not only bending but also stretching. Although several approaches are available for the electronics, a persistent difficulty is in power supplies that have similar mechanical properties, to allow their co-integration with the electronics. Here we introduce a set of materials and design concepts for a rechargeable lithium ion battery technology that exploits thin, low modulus silicone elastomers as substrates, with a segmented design in the active materials, and unusual ‘self-similar’ interconnect structures between them. The result enables reversible levels of stretchability up to 300%, while maintaining capacity densities of ~1.1 mAh cm⁻². Stretchable wireless power transmission systems provide the means to charge these types of batteries, without direct physical contact.

Multifunctional capability, flexible design, rugged lightweight construction and self-powered operation are desired attributes for electronics that directly interface with the human body or with advanced robotic systems. For these applications, piezoelectric materials, in forms that offer the ability to bend and stretch, are attractive for pressure/force sensors and mechanical energy harvesters. Here, we introduce a large area, flexible piezoelectric material that consists of sheets of electrospun fibres of the polymer poly[(vinylidenefluoride-co-trifluoroethylene]. The flow and mechanical conditions associated with the spinning process yield free-standing, three-dimensional architectures of aligned arrangements of such fibres, in which the polymer chains adopt strongly preferential orientations. The resulting material offers exceptional piezoelectric characteristics, to enable ultra-high sensitivity for measuring pressure, even at exceptionally small values (0.1 Pa). Quantitative analysis provides detailed insights into the pressure sensing mechanisms, and establishes engineering design rules. Potential applications range from self-powered micro-mechanical elements, to self-balancing robots and sensitive impact detectors.

Wearable Monitors: Advances in microelectronics have yielded high-quality devices that allow for intensive signal collection or transmission. S. Xu et al. (p. 70 ) show how to make a soft wearable system that is constructed like a stretchable circuit board, where the electronic components are bridged electrically by thin, meandering conducting traces that float in a highly visco-elastic polymer. A complete soft circuit capable of multisignal physiological sensing on skin was created, with potential for use in health monitoring or neonatal care.

Stretchable electronics provide a foundation for applications that exceed the scope of conventional wafer and circuit board technologies due to their unique capacity to integrate with soft materials and curvilinear surfaces. The range of possibilities is predicated on the development of device architectures that simultaneously offer advanced electronic function and compliant mechanics. Here we report that thin films of hard electronic materials patterned in deterministic fractal motifs and bonded to elastomers enable unusual mechanics with important implications in stretchable device design. In particular, we demonstrate the utility of Peano, Greek cross, Vicsek and other fractal constructs to yield space-filling structures of electronic materials, including monocrystalline silicon, for electrophysiological sensors, precision monitors and actuators, and radio frequency antennas. These devices support conformal mounting on the skin and have unique properties such as invisibility under magnetic resonance imaging. The results suggest that fractal-based layouts represent important strategies for hard-soft materials integration.

Popping materials and devices from 2D into 3D: Curved, thin, flexible complex three-dimensional (3D) structures can be very hard to manufacture at small length scales. Xu et al. develop an ingenious design strategy for the microfabrication of complex geometric 3D mesostructures that derive from the out-of-plane buckling of an originally planar structural layout (see the Perspective by Ye and Tsukruk). Finite element analysis of the mechanics makes it possible to design the two 2D patterns, which is then attached to a previously strained substrate at a number of points. Relaxing of the substrate causes the patterned material to bend and buckle, leading to its 3D shape. Science , this issue p. 154 ; see also p. 130