Nowadays, the flurry of autonomous vehicles is in full swing regarding light detection and ranging (LiDAR) and depth perception. For such visual perception, light plays an important role. We human beings recognize and distinguish surrounding details when the eye focuses light on the retina. For the LiDAR system, pulsed lasers are employed to measure the relevant range. Thus, appropriate light sources with high performance are in urgent demand. Auspiciously, a revolutionary semiconductor laser technology, namely the photonic-crystal surface-emitting laser (PCSEL), emerges over the past two decades. PCSEL exhibits not only a symmetric beam profile with narrow beam divergence but also a high-power operation with controllability. Therefore, it may be the holy grail for an ultracompact time-of-flight (ToF) LiDAR system. Hereupon, comprehensive analyses of PCSEL-relevant scientific publications and patent documents are conducted. We thereby review the development progress of PCSEL technology. Moreover, a systematic simulation is performed, providing real-time visualization of relevant point clouds with different beam divergence. PCSEL technology with unprecedented merits indeed turns a new leaf and a paradigm shift in LiDAR application is ongoing. It is believed that a lens-free and adjustment-free ultracompact apparatus in simplicity can be expected.
In this research, we compared the performance of commercial μ-LEDs and three-layered staggered QW μ-LED arrays. We also investigated the self-heating effect. We proposed a green micro-resonant cavity light-emitting diode (µ-RCLED) that consists of a three-layer staggered InGaN with multiple quantum wells (MQWs), a bottom layer of nanoporous n-GaN distributed Bragg reflectors (DBRs), and a top layer of Ta2O5/SiO2 DBRs. We systematically performed simulations of the proposed µ-RCLEDs. For the InGaN MQWs with an input current of 300 mA, the calculated wavefunction overlaps are 8.8% and 18.1% for the regular and staggered structures, respectively. Furthermore, the staggered MQWs can reduce the blue-shift of electroluminescence from 10.25 nm, obtained with regular MQWs, to 2.25 nm. Due to less blue-shift, the output power can be maintained even at a high input current. Conversely, by employing 6.5 pairs of Ta2O5/SiO2 DBRs stacks, the full width at half maximum (FWHM) can be significantly reduced from 40 nm, obtained with ordinary µ-LEDs, to 0.3 nm, and a divergence angle smaller than 60° can be obtained. Our simulation results suggest that the µ-RCLEDs can effectively resolve the wavelength instability and color purity issues of conventional µ-LEDs.
In this work, we demonstrated the thermal analysis of different flip-chip bonding designs for high power GaN HEMT developed for power electronics applications, such as power converters or photonic driver applications, with large gate periphery and chip size, as well as an Au metal heat-spreading layer deposited on top of a planarized dielectric/passivation layer above the active region. The Au bump patterns can be designed with high flexibility to provide more efficient heat dissipation from the large GaN HEMT chips to an AlN package substrate heat sink with no constraint in the alignment between the HEMT cells and the thermal conduction bumps. Steady-state thermal simulations were conducted to study the channel temperatures of GaN HEMTs with various Au bump patterns at different levels of current and voltage loadings, and the results were compared with the conventional face-up GaN die bonding on an AlN package substrate. The simulations were started from a single finger isolated HEMT cell and then extended to multiple fingers HEMT cells (total gate width > 40 mm) to investigate the “thermal cross-talk” effect from neighboring devices. Thermal analysis of the GaN HEMT under pulse operation was also performed to better reflect the actual conditions in power conversion or pulsed laser driver applications. Our analysis provides a combinational assessment of power GaN HEMT dies under a working condition (e.g., 1MHz, 25% duty cycle) with different flip chip packaging schemes. The analysis indicated that the channel temperature rise (∆T) of a HEMT cell in operation can be reduced by 44~46% by changing from face-up die bonding to a flip-chip bonding scheme with an optimized bump pattern design.
In this work, an InGaN-based, green micro-photonic crystal-light-emitting-diode (µ-PCLED), which incorporates a nanoporous, GaN-distributed Bragg reflector (DBR) to form a Fabry–Perot (FP) cavity, was fabricated and characterized. Simulations for the µ-PCLED’s optical features were systematically performed and analyzed. Numerical results revealed that the p-GaN photonic crystal (PC) with a filling factor of 0.3 is beneficial for improving the coupling constants of the first- and second-order Bragg diffractions. In addition, based on the product of quantum well (QW) and PC confinement factors, four to six pairs of InGaN QWs should be the preferable design. In order to achieve single-wavelength emission and small full-width at half-maximum (FWHM), the thickness of the n-GaN layer was controlled to be thinner than 920 nm, leading to more than 20 nm wavelength separation between two adjacent FP modes. Experimentally, the fabricated InGaN-based µ-PCLED with a mesa diameter of 30 µm can emit 545 nm green light with FWHM of about 10 nm and negligible blue-shift of about 3 nm in spontaneous emission under the injection current of 1 to 10 mA. Our simulation and experimental results demonstrate that the p-GaN PC design can effectively resolve the wavelength instability issue.
Photonic-crystal surface-emitting lasers have many promising properties over traditional semiconductor lasers and are regarded as the next-generation laser sources. However, the minimum achievable lasing threshold of PCSELs is still several times larger than that of VCSELs, and limiting its applications especially if the required power is small. Here, we propose a new design that reduces the gain region in the lateral plane by using selective quantum-well intermixing to reduce the threshold current of PCSELs. By performing theoretical calculations, we confirmed that the threshold current can be lowered by a factor of two to three while keeping the PCSEL’s advantage of small divergence angle.