Over the last several years, a significant advancement in high-voltage electronic packaging techniques has paved the way for next-generation power electronics. However, controlling the thermal properties of these new packaging solutions is still a major challenge. The utilization of wide bandgap semiconductors such as SiC and GaN offers effective methods to minimize thermal inefficiencies caused by conduction losses through high-frequency switching topologies. Nevertheless, the need for high voltage in electrical systems continues to pose significant barriers, as heat generation remains one of the most significant obstacles to widespread implementation. The trend of electronics design miniaturization has driven the development of high-performance cooling concepts to address the needs of high-power-density systems. As a result, the design of effective cooling systems has emerged as a crucial aspect for successful implementation, requiring seamless integration with electronic packaging to achieve optimal performance. This review article explores various thermal management approaches demonstrated in electronic systems. This paper aims to provide a comprehensive overview of heat transfer enhancement techniques employed in electronics thermal management, focusing on core concepts. The review categorizes these techniques into concepts based on fin design, microchannel cooling, jet impingement, phase change materials, nanofluids, and hybrid designs. Recent advancements in high-power density devices, alongside innovative cooling systems such as phase change materials and nanofluids, demonstrate potential for enhanced heat dissipation in power electronics. Improved designs in finned heat sinks, microchannel cooling, and jet impingement techniques have enabled more efficient thermal management in high-density power electronics. By fixing key insights into one reference, this review serves as a valuable resource for researchers and engineers navigating the complex landscape of high-performance cooling for modern electronic systems.

Data centers consume hundreds of thousands of gallons of potable water daily through evaporative cooling towers while rejecting large quantities of low-grade waste heat to the atmosphere. This work proposes a cylindrical packed bed humidification-dehumidification (HDH) desalination tower that simultaneously rejects data center waste heat and produces freshwater from seawater, transforming a water-consuming cooling system into a water-producing one. A two-dimensional steady-state model governing coupled heat and mass transfer in a radial-flow packed bed is developed and validated against sector-shaped experimental data. The system is analyzed for a 1 MW heat rejection duty under ASHRAE 2% design conditions for Galveston, Texas, and a differential evolution algorithm is applied to determine the minimum-volume humidifier geometry, yielding a packed bed volume of 10.4 m3. Seasonal analysis across supply temperatures of 40°C, 50°C, and 60°C reveals a fundamental trade-off: the 40°C case maximizes freshwater cogeneration (up to 631 kg/hr in winter) while higher temperatures deliver superior heat rejection with significantly reduced pumping. Re-evaporation mechanisms that limit dehumidifier performance at elevated supply temperatures are identified and characterized through local mass transfer mapping.