The paper reports research on the implementation of green aspects into the latest industrial revolution called Industry 4.0 and proposes the design of a business readiness level model for Industry 4.0. The analysis is based on the available maturity models for Industry 4.0, which are investigated to determine whether and to what extent they fulfil the ‘green’ trends by their name, content or specialized dimensions. This analysis was initiated over recent years, by a strong interest in integrating the elements and principles of Industry 4.0 into enterprises, together with an increased interest in achieving carbon neutral production and society in the coming decades, including recent EU Green Deal documents. The first part of the paper describes the basic requirements of the Industry 4.0, new digital strategies and green agreements. The major parts of the paper provide an analysis of current maturity and readiness models for Industry 4.0 together with specification, design and development of a readiness model for companies to implement Industry 4.0 with respect to green aspects. The final part of the paper provides an evaluation based on questionnaire survey with discussion, conclusions and avenues for future research.

Purpose: The purpose of this paper is to find an optimum between the quantity of solder paste and the desired properties of the soldered joint. A reduction of solder paste quantity is recognized as an opportunity to save money. On the other hand, the quantity of solder paste significantly influences the final properties of the soldered joint. The purpose is also to design recommendations for manufacturers of electronic assemblies. Design/methodology/approach: The processing of the paper was initiated by a literature review. The expert analysis was the next step. The result of analysis was a fishbone diagram. Subsequently, the experiment was designed. Seven types and three volume of solder pastes and two aperture shapes of the stencil were used. The measured parameters were mechanical strength, electrical resistance, voids area and intermetallic compound (IMC) thicknesses. The results of the experiment were evaluated and recommendations for practice were defined. Findings: The carried out research has confirmed the influence of solder paste quantity on the shear strength, electrical resistance, voids area and IMC thickness of solder joint. The article presents the results achieved for solders Sn42Bi58, Sn42Bi57.6Ag0.4, SnAg3.0Cu0.5, SnCu0.7Ag1.0NiGe, SnAg3.5Bi0.5In8.0 and Sn62.5Pb36.5Ag1.0. Reduction of solder paste quantity down to 74 per cent (i.e. one quarter of quantity) decreases mechanical shear strength less than 10 per cent. Recommendations relating to the optimal reduction of solder paste quantity have been designed for each solder paste. Originality/value: Contribution of the paper is impact assessment of solder paste quantity on the properties of the soldered joint. It was carried out a large number of experiments and measurements which verify this effect. Such a comprehensive overview of the results is not yet available in the literature. Recommendations for manufacturers of electronic assemblies are also the benefit of article.

Production companies are adopting new methods for the improvement of their managing production processes. The cost, quality and time are still key important attributes for process improvement. This is reason why the Business Process Management (BPM) is the core of management in different areas, e.g., quality management, sustainability management. The new technologies based on Internet of Things and Services, SMART solutions, and the concept Industry 4.0 are opening new possibilities of BPM implementation. This theoretical paper deals with a review of new trends in BPM and a presentation of the possibilities of core technologies for Industry 4.0 in phases of BPM applications.

The paper describes the effect of the solder profile on the formation of an intermetallic layer in the solder composition of 57.6% Bi-42% Sn-0.4% Ag. Soldered joints were made by soldering of chip resistors of 1206 size with different soldering reflow profiles. Solder pads on the PCB are made of copper therefore they mainly make Cu ₆ Sn ₅ IMC. This layer has an effect on the mechanical strength of the soldered joint. Samples are measured by using the shear strength test. The thickness of the IMC layer is measured by Confocal Laser Scanning Microscope. IMC layer thickness grows with greater delivered energy into the joint during soldering.

This paper deals with the effect of the solder profile and multiple reflow cycles on intermetallic compound (IMC) creation. Soldered joints between PCB and 1206 size chip resistors were made from SAC 305 or SnBi solder alloy. Samples were reflowed one to six times with one of the two different soldering profiles for each soldering alloys. The thickness and composition of IMC layers were measured and observed with a scanning electron microscope. The growing of IMC layers thickness was observed. The results are presented depending on greater value of heating factor and number of reflow cycles. The shear forces for the components were measured and the fracture interfaces were inspected.

This paper describes the influence of the cure schedule on the shear strength of the joint glued by EPO-TEK® H20S and 8331S. This work also describes the influence of solder alloy types on the shear strength of the solder joint. Joints were made by soldering and gluing of chip resistors 1206, 0805 and 0603 with different temperature profiles on rigid and flexible substrates. For soldering profiles were calculated heating factors. These profiles have an effect on the mechanical strength of the joint. Samples are measured after curing/soldering process by using shear strength test.