Human-centricity, sustainability, and resilience are the core pillars of the Industry 5.0 concept. The human-centric perspective emphasizes the development of socio-technical systems designed to enhance human health, safety, and well-being while fostering sustainable practices that benefit society at large. This paper presents a systematic literature review to identify the key characteristics of human-centered work environments. The findings reveal growing interest in human factors and ergonomics, with notable gaps in cognitive ergonomics requiring further attention. Beyond ensuring safety and health, human-centric systems must address cognitive workload and well-being to maintain productivity, efficiency, and motivation, which are closely tied to a company’s market performance. This study provides valuable insights for both scientific and industrial stakeholders, outlining the principles and requirements essential for the effective implementation of human-centric systems.
3 August 2021 in International Journal of Computer Integrated Manufacturing
The paper reports research on the implementation of green aspects into the latest industrial revolution called Industry 4.0 and proposes the design of a business readiness level model for Industry 4.0. The analysis is based on the available maturity models for Industry 4.0, which are investigated to determine whether and to what extent they fulfil the ‘green’ trends by their name, content or specialized dimensions. This analysis was initiated over recent years, by a strong interest in integrating the elements and principles of Industry 4.0 into enterprises, together with an increased interest in achieving carbon neutral production and society in the coming decades, including recent EU Green Deal documents. The first part of the paper describes the basic requirements of the Industry 4.0, new digital strategies and green agreements. The major parts of the paper provide an analysis of current maturity and readiness models for Industry 4.0 together with specification, design and development of a readiness model for companies to implement Industry 4.0 with respect to green aspects. The final part of the paper provides an evaluation based on questionnaire survey with discussion, conclusions and avenues for future research.
This paper deals with the issue of digital predictive maintenance and its application to selected equipment, focusing on a case study of climate chambers. The study analyzed the current state of maintenance of these devices, performed cost calculations, and evaluated the possible risks. Based on these analyses, a procedure for the implementation of predictive maintenance was proposed, which could lead to the reduction of the identified risks and the optimization of the costs associated with the maintenance of the equipment. The paper provides a comprehensive overview of digital predictive maintenance that includes a theoretical framework, a case study, and an implementation methodology, thus contributing to a deeper understanding of the benefits and challenges associated with this area.
In an era where electronic waste is a growing concern, this paper introduces a groundbreaking recycling and reuse methodology for SMD chip components in e-textiles, promising a sustainable future for the electronics industry. Our innovative technique harnesses a UV-curable acrylic adhesive to conductively affix SMD components onto the electrically conductive paths in the textile stretchable ribbons. In the method, the SMD component is pressed onto the conductive paths and fixed in the direct intimate contact with the mentioned adhesive. These joints can be easily detached at the end of their lifecycle. This process not only conserves raw materials and minimizes waste but also significantly cuts production costs. Through realized experimentation, we demonstrate that the electrical resistance of reused joints remains stable, showing no substantial degradation when compared to new joints, even after salt spray ageing. This finding confirms that the performance of reused components is on par with new ones (at least when used twice), thus ensuring reliability in practical applications. While the method's applicability varies across different component types, it is advantageous, particularly for high-value parts or those in short supply. Engage with our full article to explore how this technique can improve component lifecycle management and pave the way for a more sustainable electronics landscape.