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Tao Wang
State Key Laboratory of Electronic Thin Films and Integrated Devices, School of Electronic Science and Engineering, University of Electronic Science and Technology of China (UESTC), Chengdu, 610054, PR China

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Journal article
Published: 24 June 2021 in Sensors and Actuators A: Physical
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Diaphragm-based Surface acoustic wave (SAW) pressure sensors are of great interest to fulfill high-pressure sensing requirements in industrial and commercial applications. These sensors are developed with a thick diaphragm, can endure considerable pressure but adversely result in low sensitivity and affect device accuracy. The trade-off between diaphragm thickness and sensitivity is the major problem in designing pressure sensors for high-pressure sensing ranges. This work proposed a highly sensitive pressure sensor design based on one port SAW resonator with AlN/Mo/SOI multilayer structure. The sensor utilizes a 50 μm thick rectangular diaphragm and has been fabricated with simple microfabrication techniques, making it cost-effective and easy to implement in pressure sensing equipment. Finite element analysis (FEA) has been performed for analyzing diaphragm to locate IDTs based on bending, uniformity of stress distribution and induced strain type. The developed sensor exhibits good performance characteristics, including high sensitivity (up to 129.17 ppm/MPa), wide pressure sensing range (up to 2 MPa), and good repeatability with linear behavior for applied pressure range. Additionally, this work has presented a novel approach to enhance pressure sensitivity based on increased velocity without compromising sensing range. The obtained sensitivity has been enhanced up to 228.46 ppm/MPa by modifying the primarily developed sensor design such that the SAW propagation direction becomes parallel to the induced strain direction. With the proposed novel concept, the sensitivity has been significantly improved by 76.87 % compared to the primarily developed sensor. Besides improved sensitivity, the modified sensor also shows the best repeatability and linearity. All these performance characteristics pave the way to make this design a good choice for high-pressure sensing applications.

ACS Style

Maria Muzamil Memon; Shuliang Pan; Jiang Wan; Tao Wang; Wanli Zhang. Highly sensitive thick diaphragm-based surface acoustic wave pressure sensor. Sensors and Actuators A: Physical 2021, 331, 112935 .

AMA Style

Maria Muzamil Memon, Shuliang Pan, Jiang Wan, Tao Wang, Wanli Zhang. Highly sensitive thick diaphragm-based surface acoustic wave pressure sensor. Sensors and Actuators A: Physical. 2021; 331 ():112935.

Chicago/Turabian Style

Maria Muzamil Memon; Shuliang Pan; Jiang Wan; Tao Wang; Wanli Zhang. 2021. "Highly sensitive thick diaphragm-based surface acoustic wave pressure sensor." Sensors and Actuators A: Physical 331, no. : 112935.

Journal article
Published: 10 March 2021 in Journal of Thermal Science and Engineering Applications
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Recently, the development trend of multi-module and multi-function in electronic microsystems makes the ever-increasing heat flux problem more serious. In this study, a highly efficient integrated single-phase microchannel cooler with four heat sources is presented for handling the challenges from both workings independently of all electronic modules and the high heat flux. Both numerical and experimental studies are conducted. By optimizing the structural design and the fabricated process, the presented microchannel cooler has outstanding cooling performance, which contains desired fluid flow distribution, pressure drop, heat transfer, and combination thereof. Results reveal uniform coolant flow dissipates four individual heaters independently, and their maximal temperature difference below 4 °C. Beyond this, high heat flux removal (707.6 W/cm2) is realized with an extremely low coolant flowrate (45 ml/min), and the maximum temperature rise is less than 60 °C. This study provides a referable solution for the thermal management of multi-module heat sources and high heat flux in compact electronic microsystems.

ACS Style

Jiejun Wang; Tao Wang; Qiuyan Li; Yiming Li; Chuangui Wu; Wanli Zhang. A Highly Efficient Integrated Silicon-Microchannel Cooler for Multi-Module Electronic Microsystems: Model Design, Optimization, and Performance Validation. Journal of Thermal Science and Engineering Applications 2021, 13, 1 -38.

AMA Style

Jiejun Wang, Tao Wang, Qiuyan Li, Yiming Li, Chuangui Wu, Wanli Zhang. A Highly Efficient Integrated Silicon-Microchannel Cooler for Multi-Module Electronic Microsystems: Model Design, Optimization, and Performance Validation. Journal of Thermal Science and Engineering Applications. 2021; 13 (5):1-38.

Chicago/Turabian Style

Jiejun Wang; Tao Wang; Qiuyan Li; Yiming Li; Chuangui Wu; Wanli Zhang. 2021. "A Highly Efficient Integrated Silicon-Microchannel Cooler for Multi-Module Electronic Microsystems: Model Design, Optimization, and Performance Validation." Journal of Thermal Science and Engineering Applications 13, no. 5: 1-38.

Journal article
Published: 24 March 2020 in Sensors
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In this paper we demonstrate a novel acoustic wave pressure sensor, based on an aluminum nitride (AlN) piezoelectric thin film. It contains an integrated vacuum cavity, which is micro-fabricated using a cavity silicon-on-insulator (SOI) wafer. This sensor can directly measure the absolute pressure without the help of an external package, and the vacuum cavity gives the sensor a very accurate reference pressure. Meanwhile, the presented pressure sensor is superior to previously reported acoustic wave pressure sensors in terms of the temperature drift. With the carefully designed dual temperature compensation structure, a very low temperature coefficient of frequency (TCF) is achieved. Experimental results show the sensor can measure the absolute pressure in the range of 0 to 0.4 MPa, while the temperature range is from 20 °C to 220 °C with a TCF of −14.4 ppm/°C. Such a TCF is only about half of that of previously reported works.

ACS Style

Tao Wang; ZhengJie Tang; Huamao Lin; Kun Zhan; Jiang Wan; Shihao Wu; Yuandong Gu; Wenbo Luo; Wanli Zhang. A Low Temperature Drifting Acoustic Wave Pressure Sensor with an Integrated Vacuum Cavity for Absolute Pressure Sensing. Sensors 2020, 20, 1788 .

AMA Style

Tao Wang, ZhengJie Tang, Huamao Lin, Kun Zhan, Jiang Wan, Shihao Wu, Yuandong Gu, Wenbo Luo, Wanli Zhang. A Low Temperature Drifting Acoustic Wave Pressure Sensor with an Integrated Vacuum Cavity for Absolute Pressure Sensing. Sensors. 2020; 20 (6):1788.

Chicago/Turabian Style

Tao Wang; ZhengJie Tang; Huamao Lin; Kun Zhan; Jiang Wan; Shihao Wu; Yuandong Gu; Wenbo Luo; Wanli Zhang. 2020. "A Low Temperature Drifting Acoustic Wave Pressure Sensor with an Integrated Vacuum Cavity for Absolute Pressure Sensing." Sensors 20, no. 6: 1788.

Article
Published: 26 August 2019 in Rare Metals
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A multilayer (Ti/Pt/Cr/Au) resistive temperature sensor was proposed and investigated to precisely measure the temperature characteristic in microfluidic devices. The Ti/Pt/Cr/Au sensor was fabricated by direct current (DC) sputtering, vacuum evaporation and liftoff process. The thermal annealing test was conducted in the temperature range of 200–800 °C for obtaining an appropriate property of the multilayer. Based on the experimental results, 400 °C was selected as the experimental annealing temperature for the Ti/Pt/Cr/Au layer. The redistribution of structural imperfections and recrystallization promote the density and adhesion of multilayer during the annealing process. With the annealing temperature rising, the annealing process leads to through-thickness migration of chromium and partial depletion of the adhesive layer. The Ti also diffuses into the Pt, which makes the interface disappear. Nevertheless, the layer remains continuous. The temperature coefficient of resistance (TCR) of the sensors was investigated through the microfluidic testing system. The excellent stability and sensitivity of the Ti/Pt/Cr/Au thin-film temperature sensor are verified. Furthermore, the capability of the Ti/Pt/Cr/Au thin-film temperature sensor detecting the sudden temperature change caused by bubble effect is very meaningful to the microfluidic devices.

ACS Style

Jie-Jun Wang; Tao Wang; Chuan-Gui Wu; Wen-Bo Luo; Yao Shuai; Wang-Li Zhang. Highly precise Ti/Pt/Cr/Au thin-film temperature sensor embedded in a microfluidic device. Rare Metals 2019, 40, 195 -201.

AMA Style

Jie-Jun Wang, Tao Wang, Chuan-Gui Wu, Wen-Bo Luo, Yao Shuai, Wang-Li Zhang. Highly precise Ti/Pt/Cr/Au thin-film temperature sensor embedded in a microfluidic device. Rare Metals. 2019; 40 (1):195-201.

Chicago/Turabian Style

Jie-Jun Wang; Tao Wang; Chuan-Gui Wu; Wen-Bo Luo; Yao Shuai; Wang-Li Zhang. 2019. "Highly precise Ti/Pt/Cr/Au thin-film temperature sensor embedded in a microfluidic device." Rare Metals 40, no. 1: 195-201.

Accepted manuscript
Published: 11 October 2018 in Journal of Micromechanics and Microengineering
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The research and development of piezoelectric valve-less micropumps have become an increasingly popular topic for decades. A high efficient valve-less micropump is necessary to delivery liquids for microfluidic control system. Study on the flow mechanism in the valve-less micropump may help to further improve the pumping efficiency. In this letter, a dynamic finite element model to investigate the mechanism of valve-less micropump with diffuser/nozzle has been conducted. The simulation result shows that flow performance of valve-less micropump is not only depend on the diffuser/nozzle but also related to the entire structure. When fluid flows through the nozzle, the chamber connecting to the nozzle end is considered as a diffuser with angle of 180°. This diffuser locates in jet flow region, where the high velocity fluid generates vortex in the interfacial area of nozzle and chamber. Such vortex works as a "virtual valve", which can block the reflux and result in unidirectional flow. Besides, the vortex degree is tightly related to fluid velocity, which is determined by the input voltage. When input voltage larger than the threshold voltage(20V), the "virtual valve" is activated, and the flow rate of micropump increase with input voltage rapidly. The simulation analysis conclusions are verified by experiment results. Experimental results demonstrate that the maximum flow rate of 5.4 ml/min is finally obtained, which is comparable to a typical valve micropump.

ACS Style

Tao Wang; Jian He; Chunquan An; Jiejun Wang; Lu Lv; Wenbo Luo; Chuangui Wu; Yao Shuai; Wanli Zhang; Chengkuo Lee. Study of the vortex based virtual valve micropump. Journal of Micromechanics and Microengineering 2018, 28, 125007 .

AMA Style

Tao Wang, Jian He, Chunquan An, Jiejun Wang, Lu Lv, Wenbo Luo, Chuangui Wu, Yao Shuai, Wanli Zhang, Chengkuo Lee. Study of the vortex based virtual valve micropump. Journal of Micromechanics and Microengineering. 2018; 28 (12):125007.

Chicago/Turabian Style

Tao Wang; Jian He; Chunquan An; Jiejun Wang; Lu Lv; Wenbo Luo; Chuangui Wu; Yao Shuai; Wanli Zhang; Chengkuo Lee. 2018. "Study of the vortex based virtual valve micropump." Journal of Micromechanics and Microengineering 28, no. 12: 125007.

Journal article
Published: 10 May 2018 in Sensors
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The temperature fluctuation in a single-phase microchannel heat sink (MCHS) is investigated using the integrated temperature sensors with deionized water as the coolant. Results show that the temperature fluctuation in single phase is not negligible. The causes of the temperature fluctuation are revealed based on both simulation and experiment. It is found that the inlet temperature fluctuation and the gas bubbles separated out from coolant are the main causes. The effect of the inlet temperature fluctuation is global, where the temperatures at different locations change simultaneously. Meanwhile, the gas bubble effect is localized where the temperature changes at different locations are not synchronized. In addition, the relation between temperature fluctuation and temperature gradient is established. The temperature fluctuation increases with the temperature gradient accordingly.

ACS Style

Tao Wang; Jiejun Wang; Jian He; Chuangui Wu; Wenbo Luo; Yao Shuai; Wanli Zhang; Chengkuo Lee. Investigation of the Temperature Fluctuation of Single-Phase Fluid Based Microchannel Heat Sink. Sensors 2018, 18, 1498 .

AMA Style

Tao Wang, Jiejun Wang, Jian He, Chuangui Wu, Wenbo Luo, Yao Shuai, Wanli Zhang, Chengkuo Lee. Investigation of the Temperature Fluctuation of Single-Phase Fluid Based Microchannel Heat Sink. Sensors. 2018; 18 (5):1498.

Chicago/Turabian Style

Tao Wang; Jiejun Wang; Jian He; Chuangui Wu; Wenbo Luo; Yao Shuai; Wanli Zhang; Chengkuo Lee. 2018. "Investigation of the Temperature Fluctuation of Single-Phase Fluid Based Microchannel Heat Sink." Sensors 18, no. 5: 1498.

Journal article
Published: 19 January 2018 in Sensors
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A micro-channel heat sink is a promising cooling method for high power integrated circuits (IC). However, the understanding of such a micro-channel device is not sufficient, because the tools for studying it are very limited. The details inside the micro-channels are not readily available. In this letter, a micro-channel heat sink is comprehensively studied using the integrated temperature sensors. The highly sensitive thin film temperature sensors can accurately monitor the temperature change in the micro-channel in real time. The outstanding heat dissipation performance of the micro-channel heat sink is proven in terms of maximum temperature, cooling speed and heat resistance. The temperature profile along the micro-channel is extracted, and even small temperature perturbations can be detected. The heat source formed temperature peak shifts towards the flow direction with the increasing flow rate. However, the temperature non-uniformity is independent of flow rate, but solely dependent on the heating power. Specific designs for minimizing the temperature non-uniformity are necessary. In addition, the experimental results from the integrated temperature sensors match the simulation results well. This can be used to directly verify the modeling results, helping to build a convincing simulation model. The integrated sensor could be a powerful tool for studying the micro-channel based heat sink.

ACS Style

Tao Wang; Jiejun Wang; Jian He; Chuangui Wu; Wenbo Luo; Yao Shuai; Wanli Zhang; Xiancai Chen; Jian Zhang; Jia Lin. A Comprehensive Study of a Micro-Channel Heat Sink Using Integrated Thin-Film Temperature Sensors. Sensors 2018, 18, 299 .

AMA Style

Tao Wang, Jiejun Wang, Jian He, Chuangui Wu, Wenbo Luo, Yao Shuai, Wanli Zhang, Xiancai Chen, Jian Zhang, Jia Lin. A Comprehensive Study of a Micro-Channel Heat Sink Using Integrated Thin-Film Temperature Sensors. Sensors. 2018; 18 (1):299.

Chicago/Turabian Style

Tao Wang; Jiejun Wang; Jian He; Chuangui Wu; Wenbo Luo; Yao Shuai; Wanli Zhang; Xiancai Chen; Jian Zhang; Jia Lin. 2018. "A Comprehensive Study of a Micro-Channel Heat Sink Using Integrated Thin-Film Temperature Sensors." Sensors 18, no. 1: 299.