The present work aims to systematically investigate the influence of P content on the microstructure and texture evolution of oxygen-free copper during intermediate annealing and final cold rolling. The microstructure and texture evolution were studied by electron backscattered diffraction and transmission electron microscopy. With the addition of P, the grains refined and a large fraction of low angle grain boundaries (LAGBs) emerged after intermediate annealing. The texture transformed from pure metal type for pure Cu to the α-fiber texture which included brass and Goss texture as P was added. The recrystallization temperature increased with the addition of P, and refined grains after the final cold rolling process. The addition of elemental P would reduce the stacking fault energy, and then influence the transformation of the deformation and recrystallization texture of the copper. Accompanied by the evolution of the deformation texture, the recrystallization cubic texture {001} was suppressed and a strong {236} brass recrystallization texture emerged with the addition of elemental P after the intermediate annealing and subsequent final cold rolling process.

The effect of trace Bi impurities on the flow stress, microstructure evolution, and dynamic recrystallization (DRX) of the ultrahigh-purity copper was systematically investigated by a hot compression test at 600 °C. The results show that the peak stress of the ultrahigh-purity copper gradually decreases with increasing Bi content. Trace Bi impurities can refine the microstructure of ultrahigh-purity copper. However, the refinement effect of 50 wt ppm Bi is much more significant than that of 140 wt ppm Bi during the hot deformation. This effect is ascribed to the higher concentration of Bi at GBs, which induces severe GB cracks that reduces the driving force for the nucleation of DRX grains. In addition, the introduction of Bi inhibits the DRX of the ultrahigh-purity copper and transforms its DRX process from the discontinuous dynamic recrystallization (DDRX) to the coexistence of DDRX and continuous dynamic recrystallization (CDRX) mechanisms.

The Cu–Cr–Ni alloy is a key material for the manufacturing of connectors, which requires excellent resistance to stress relaxation. However, the inherent correlation among microstructure, texture, and properties is still unclear. In this study, we investigated the influence of calefaction and stress relaxation on the grain boundaries (GBs), textures, and properties of the Cu–Cr–Ni alloy. The results showed that calefaction and stress relaxation had opposite effects on GBs and textures. Calefaction led to a decrease in the proportion of low-angle grain boundaries (LAGBs), an increase in the Schmidt factor (SF) value of the grains, and a transition of texture from to . The grains with higher SF values were more susceptible to plastic deformation, which deteriorated the stress relaxation resistance. By comparison, stress relaxation led to an increase in the proportion of LAGBs, a decrease in SF values of the grains, and a transition of texture from to and . After stress relaxation, the variation trends of the GBs and textures were consistent with those of other plastic deformations, indicating that stress relaxation can be verified by the variations in GBs and textures. Our findings provide a theoretical basis for improvements in stress relaxation resistance of the Cu-based alloys used in connector industry.