The Cu–20 wt% Ag alloy wire rod was prepared using three-chamber vacuum cold mold vertical continuous up-casting followed by multi-pass continuous drawing. The evolution of microstructure, mechanical property, and electrical property of the Cu–20 wt% Ag alloy wire during multi-pass continuous drawing was studied. After multi-pass continuous drawing, the continuous network eutectic structure in the longitudinal section of the as-casted rod was gradually drawn into long fibers that approximately parallel to the axial direction, while the space of the continuous network eutectic structure in the transverse section is getting smaller and smaller. Both the preferred orientation of copper and silver grains are (1,1,1). With the increase of drawing strain ( η ), the tensile strength of Cu–20 wt% Ag alloy wire gradually increases while the elongation gradually decreases. When the diameter is drawn to 0.02 mm ( η = 11.94), the tensile strength of the alloy is 1,682 MPa and elongation is 2.0%. The relationship between tensile strength, elongation, and diameter conforms to Allometric and Boltzmann functions, respectively.

The present work aims to systematically investigate the influence of P content on the microstructure and texture evolution of oxygen-free copper during intermediate annealing and final cold rolling. The microstructure and texture evolution were studied by electron backscattered diffraction and transmission electron microscopy. With the addition of P, the grains refined and a large fraction of low angle grain boundaries (LAGBs) emerged after intermediate annealing. The texture transformed from pure metal type for pure Cu to the α-fiber texture which included brass and Goss texture as P was added. The recrystallization temperature increased with the addition of P, and refined grains after the final cold rolling process. The addition of elemental P would reduce the stacking fault energy, and then influence the transformation of the deformation and recrystallization texture of the copper. Accompanied by the evolution of the deformation texture, the recrystallization cubic texture {001} was suppressed and a strong {236} brass recrystallization texture emerged with the addition of elemental P after the intermediate annealing and subsequent final cold rolling process.

The impact of introducing trace transition elements on the thermal stability and conductivity of pure copper was examined through metallographic microscopy (OM), transmission electron microscopy (TEM), and electrical conductivity measurements; the interaction between trace transition element and trace impurity element S in the matrix was analyzed. The results show that the addition of trace Ti and trace Cr, Ni, and Ag elements significantly enhances the thermal stability of the pure copper grain size. After high-temperature treatment at 900 °C/30 min, the grain sizes of Cu, Cu-Ti-S, and Cu-Cr-Ni-Ag-S were measured and found to be 200.24 μm, 83.83 μm, and 31.08 μm, respectively, thus establishing a thermal stability ranking of Cu-Cr-Ni-Ag-S > Cu-Ti-S > Cu. Furthermore, the conductivities of pure copper remain high even after the addition of trace transition elements, with recorded values for Cu, Cu-Ti-S, and Cu-Cr-Ni-Ag-S of 100.7% IACS, 100.2% IACS, and 98.5% IACS, respectively. The enhancement of thermal stability is primarily attributed to the pinning effect of the TiS and CrS phases, as well as the solid solution dragging of Ni and Ag elements. Trace Ti and Cr elements can react with S impurities to form a hexagonal-structure TiS phase and monoclinic-structure CrS phase, which are non-coherent with the matrix. Notably, the CrS phase is smaller than the TiS phase. In addition, the precipitation of these compounds also reduces the scattering of free electrons by solute atoms, thereby minimizing their impact on the alloy’s conductivity.