This study investigates the effect of focal plane variation using vibration in a femtosecond laser hole drilling process on Invar alloy fabrication quality for the production of fine metal masks (FMMs). FMMs are used in the red, green, blue (RGB) evaporation process in Active Matrix Organic Light-Emitting Diode (AMOLED) manufacturing. The taper angle of the hole is adjusted by attaching the objective lens to a micro-vibrator and continuously changing the focal plane position. Eight laser pulses were used to examine how the hole characteristics vary with the first focal plane’s position, where the first pulse is focused at an initial position and the focal planes of subsequent pulses move downward. The results showed that the hole taper angle can be controlled by varying the amplitude of the continuously operating vibrator during femtosecond laser hole machining. The taper angles were changed between 31.8° and 43.9° by adjusting the vibrator amplitude at a frequency of 100 Hz. Femtosecond laser hole drilling with controllable taper angles is expected to be used in the precision micro-machining of various smart devices.

The development of printing technologies has enabled the realization of electric circuit fabrication on a flexible substrate. However, the current technique remains restricted to single-layer patterning. In this paper, we demonstrate a fully solution-processable patterning approach for multi-layer circuits using a combined method of laser sintering and ablation. Selective laser sintering of silver (Ag) nanoparticle-based ink is applied to make conductive patterns on a heat-sensitive substrate and insulating layer. The laser beam path and irradiation fluence are controlled to create circuit patterns for flexible electronics. Microvia drilling using femtosecond laser through the polyvinylphenol-film insulating layer by laser ablation, as well as sequential coating of Ag ink and laser sintering, achieves an interlayer interconnection between multi-layer circuits. The dimension of microvia is determined by a sophisticated adjustment of the laser focal position and intensity. Based on these methods, a flexible electronic circuit with chip-size-package light-emitting diodes was successfully fabricated and demonstrated to have functional operations.

In this study, we explore the improvements in pattern quality that was obtained with a femtosecond laser with quasi-flat top beam profiles at the ablated edge of indium tin oxide (ITO) thin films for the patterning of optoelectronic devices. To ablate the ITO thin films, a femtosecond laser is used that has a wavelength and pulse duration of 1030 nm and 190 fs, respectively. The squared quasi-flat top beam is obtained from a circular Gaussian beam using slits with varying x-y axes. Then, the patterned ITO thin films are measured using both scanning electron and atomic force microscopes. In the case of the Gaussian beam, the ridge height and width are approximately 39 nm and 1.1 μm, respectively, whereas, when the quasi-flat top beam is used, the ridge height and width are approximately 7 nm and 0.25 μm, respectively.

The development of printing technologies has enabled the realization of electric circuit fabrication on flexible substrate. However, the current technique remains restricted to single-layer patterning. In this paper, we demonstrate a fully solution-processable patterning approach for multi-layer circuits using a combined method of laser sintering and ablation. Selective laser sintering of silver (Ag) nanoparticle-based ink is applied to make conductive patterns on a heat-sensitive substrate and insulating layer. The laser beam path and irradiation fluence are controlled to create circuit patterns for flexible electronics. Microvia drilling using femtosecond laser through the polyvinylphenol-film insulating layer by laser ablation, as well as sequential coating of Ag ink and laser sintering, achieves an interlayer interconnection between multi-layer circuits. The dimension of microvia is determined by a sophisticated adjustment of laser focal position and intensity. Based on these methods, the flexible electronic circuit with chip-size-package light-emitting diodes was successfully fabricated and demonstrated with functional operations.

The development of ink-based printing techniques has enabled the fabrication of electric circuits on flexible substrates. Previous studies have shown that the process method which uses a silver (Ag) precursor (AgCF₃COO) and electrospun poly(styrene-block-butadiene-block-styrene) (SBS) can yield patterns with high conductivity and stretchability. However, the only method to reduce the Ag precursor absorbed in SBS is chemical reduction using a toxic solution. Here, we developed a process to fabricate a high-conductivity pattern via laser reduction by photo-chemical reaction without toxic solutions. The Ag precursor was absorbed in electrospun SBS to form a composite layer (composite SBS) with modified properties, that could more effectively absorb the photon energy than SBS without the Ag precursor. We analyzed the properties of this material, such as its light absorption coefficient, heat conductivity, and the density of both SBS and composite SBS to allow comparison of the two materials by numerical simulation. In addition, we fabricated patterns on highly heat-sensitive substrates such as burning paper and a polyethylene terephthalate (PET) thin film, as the pattern can be implemented using very low laser energy. We expect the proposed approach to become a key technology for implementing user-designed circuits for wearable sensors and devices on various flexible substrates.