The escalating heat flux density and temperature in highly integrated microelectronic devices adversely affect their reliability and service life, making efficient thermal management crucial for stable operation. This study utilizes Galinstan liquid metal as the coolant to investigate the flow and heat transfer performance in microchannel heat sinks incorporating various turbulator configurations. It is revealed that for microchannels featuring expanded regions, turbulators that create highly symmetric flow fields are preferable due to improved flow distribution. The long teardrop-shaped turbulator provides the best heat transfer performance among all the investigated heat transfer enhancement structures. And this turbulator yields a 13.8–25.9% higher enhancement effectiveness compared to other configurations, at the expense of a 28–41% increase in pressure loss. However, the sudden cross-sectional expansion in the expanded region causes a significant reduction in fluid velocity. Consequently, microchannels with expanded regions and turbulators exhibit a higher bottom surface temperature than the original, straight microchannels, leading to an overall deterioration in heat transfer performance.