Using a newly developed tool head with an additional rotational axis and a wire feed, wires can be directly processed in the fused filament fabrication (FFF) process. Thus, electrical structures such as conductive paths, coils, heating elements, or sensors can be integrated into polymer parts. However, the accuracy of the wire deposition in curved sections of the print track is insufficient. To improve the wire position, a geometric correction model was set up, converted into G-code, and validated using test prints for different wire parameters. For this, a sample of printed arcs was evaluated regarding wire position and embedding quality using various visual methods. This also determined the optimal cooling time for the model. The process parameters extrusion coefficient and feed were then varied to identify optimal process parameters for a stable and at the same time efficient process. By varying the wire (copper, constantan) and polymer material (PLA, PETG), the model was checked for general validity. It was found that the position of the ø 0.2 mm wire can be improved with the correction model. Different sets of parameters can be found that enable good quality of embedding and wire position.

Adhesive joints typically require high safety factors, as their mechanical performance is highly sensitive to environmental and manufacturing variations. Health monitoring can reduce these safety factors by continuously assessing the condition of the joint. While intrinsic and extrinsic sensing approaches exist, they are often based on periodic inspection or manual sensor integration, which limits their suitability for continuous in-service monitoring. This study investigates a novel sensor placement using additively manufactured strain sensors deposited by jet dispensing across the adhesive gap. Tensile lap-shear specimens were fabricated using CFRP (carbon-fiber-reinforced plastic) laminate, an epoxy adhesive, and silver-ink strain sensors placed internally within the joint and externally across the adhesive gap. Mechanical testing revealed that externally printed sensors produced an average resistance change of 65.3% near the failure stress of the adhesive joint, an order of magnitude higher than sensors embedded within the adhesive layer with 6.6% average resistance change. However, the average coefficient of variation increased as well, from 7.6% for internal to 32.6% for external. This sensor response exceeds reported environmentally induced variations in printed sensors and thus represents a promising candidate for condition monitoring. Further work is required to demonstrate actual damage detection capabilities and assess long-term stability under environmental and cyclic loading conditions.