We report on experimental studies of NH3 adsorption/desorption on graphene surfaces. The study employs bottom-gated graphene field effect transistors supported on Si/SiO2 substrates. Detection of NH3 occurs through the shift of the source-drain resistance maximum ('Dirac peak') with the gate voltage. The observed shift of the Dirac peak toward negative gate voltages in response to NH3 exposure is consistent with a small charge transfer (f approximately 0.068 +/- 0.004 electrons per molecule at pristine sites) from NH3 to graphene. The desorption kinetics involves a very rapid loss of NH3 from the top surface and a much slower removal from the bottom surface at the interface with the SiO2 that we identify with a Fickian diffusion process.

We have studied the intrinsic doping level and gate hysteresis of graphene-based field effect transistors (FETs) fabricated over Si/SiO(2) substrates. It was found that the high p-doping level of graphene in some as-prepared devices can be reversed by vacuum degassing at room temperature or above depending on the degree of hydrophobicity and/or hydration of the underlying SiO(2) substrate. Charge neutrality point (CNP) hysteresis, consisting of the shift of the charge neutrality point (or Dirac peak) upon reversal of the gate voltage sweep direction, was also greatly reduced upon vacuum degassing. However, another type of hysteresis, consisting of the change in the transconductance upon reversal of the gate voltage sweep direction, persists even after long-term vacuum annealing at 200 °C, when SiO(2) surface-bound water is expected to be desorbed. We propose a mechanism for this transconductance hysteresis that involves water-related defects, formed during the hydration of the near-surface silanol groups in the bulk SiO(2), that can act as electron traps.