A lightweight flexible thermally stable composite is fabricated by combining silica nanofiber membranes (SNM) with MXene@c-MWCNT hybrid film. The flexible SNM with outstanding thermal insulation are prepared from tetraethyl orthosilicate hydrolysis and condensation by electrospinning and high-temperature calcination; the MXene@c-MWCNT_x:y films are prepared by vacuum filtration technology. In particular, the SNM and MXene@c-MWCNT_6:4 as one unit layer (SMC₁) are bonded together with 5 wt% polyvinyl alcohol (PVA) solution, which exhibits low thermal conductivity (0.066 W m⁻¹ K⁻¹) and good electromagnetic interference (EMI) shielding performance (average EMI SE_T, 37.8 dB). With the increase in functional unit layer, the overall thermal insulation performance of the whole composite film (SMC_x) remains stable, and EMI shielding performance is greatly improved, especially for SMC₃ with three unit layers, the average EMI SE_T is as high as 55.4 dB. In addition, the organic combination of rigid SNM and tough MXene@c-MWCNT_6:4 makes SMC_x exhibit good mechanical tensile strength. Importantly, SMC_x exhibit stable EMI shielding and excellent thermal insulation even in extreme heat and cold environment. Therefore, this work provides a novel design idea and important reference value for EMI shielding and thermal insulation components used in extreme environmental protection equipment in the future.

With the rapid development of electronic technology and the integration of electronic chips, electromagnetic wave pollution and thermal management have become two critical issues hindering the growth of electronic equipment. Traditional polymer-based electronic packaging materials have very low thermal conductivity and almost no electromagnetic wave absorption ability. Therefore, the development of polymer-based composites with efficient electromagnetic wave absorption and thermally conductive performances is currently a hot research topic in the field of microelectronic packaging. At present, the addition of thermally conductive and dielectric (magnetic) fillers to the polymer matrix is an effective way to solve this problem. In this review, firstly, we briefly introduce the mechanism of action of electromagnetic wave absorbing materials and thermally conductive materials, respectively. Then, we list the relevant representative fillers which can be used in electromagnetic wave absorption and thermal management and summarize the current research progress of these materials. Finally, we present the current challenges facing the field and prospects for future development. Graphical Abstract In this review, we give a detailed overview of the research progress on the microwave absorption and thermally conductive properties of the composites with different fillers and microstructures.

With the continuous exploration of the extreme environment in space, strong space radiation and extreme high temperature environment have brought great challenges to the research work of astronauts. This study effectively created the SiO₂/SWCNT@Ni composite film with electromagnetic shielding and thermal insulation performances by a high-temperature carbon reduction process utilizing the SiO₂ nanofiber, the poly(vinyl alcohol) (PVA) solution of single-walled carbon nanotubes (SWCNT), and Ni(NO₃)₂ as raw ingredients. The adaptable SiO₂ nanofiber membrane was synthesized by sol–gel and electrospinning methods utilizing tetraethyl n-silicate hydrolysis precursors as the primary ingredients. At a result, when the content of SWCNT content is 9 wt%, the average EMI SE_T of SiO₂/SWCNT₉@Ni is 39.4 dB, and the thermal conductivity measures 0.0405 W/m·K. In addition, SiO₂/SWCNT₉@Ni shows a good flame-retardant performance. Consequently, this research holds significant reference value in the field of manned spaceflight. Graphical abstract SiO₂/SWCNT@Ni composite film with sandwich structure has excellent electromagnetic shielding and thermal insulation performances.