Thin-film thermocouple is widely used in temperature measurement because of its high temperature measurement accuracy and small size. In order to calibrate the temperature accurately with thin-film thermocouple, NiCr/NiSi thin-film thermocouple was prepared by magnetron sputtering according to the Seebeck effect. Through static calibration experiments, the Seebeck coefficient of K-wire thermocouple was found to be 39.23 μV/°C, while that of the NiCr/NiSi thin-film thermocouple was 38.89 μV/°C. Further experiments showed a Seebeck coefficient of 39.092 μV/°C for the NiCr/NiSi thin-film thermocouple, which verifies that the prepared thin-film thermocouple has good consistency and repeatability. Through the temperature measurement experiment of automobile engines, the highest stable working temperature of the engine is 107.9 °C, which further verifies that the prepared NiCr/NiSi thin-film thermocouple can have a sensitive dynamic response to temperature and high temperature measurement accuracy. Finally, the causes of experimental errors, the application prospect and existing problems of thin-film thermocouples are analyzed.

In the process of using thin-film thermocouples for contact measurement of the reaction temperature in proton exchange membrane fuel cells (PEMFC), the impact of thin-film thermocouple volume on the system’s reaction temperature field variation, reaction efficiency, and the lifespan of thermocouples under these conditions is not thoroughly studied. Using magnetron sputtering technology, NiCr/NiSi thin-film thermocouples (NiCr/NiSi TFTCs) with different junction sizes were fabricated on the proton exchange membrane (PEM). These NiCr/NiSi TFTCs exhibit excellent compactness, with thickness and planar dimensions in the micrometer range. When PEMFCs are equipped with built-in NiCr/NiSi TFTCs of different hot junction sizes, the time required for the system to reach a steady state varies with the size of the hot junction, with smaller hot junction sizes reaching a steady state more quickly. In a 500-h continuous operation test, the failure rates of NiCr/NiSi TFTCs also vary based on the hot junction size. Both smaller and larger hot junction sizes have relatively higher failure rates, whereas medium-sized junctions have a lower failure rate. These extensive and repetitive comparative experiments provide significant reference value for the size design of TFTCs operating inside PEMFCs, promoting both industrial production and scientific research.

This study presents the calibration methodology of NiCr-NiSi thin-film thermocouples and evaluates their application in real-time temperature monitoring and characterization of fuel cell thermal behavior. Experimental results reveal that the Seebeck coefficients of the NiCr-NiSi thin films remain stable after multiple calibration cycles, indicating good reliability and repeatability. Furthermore, the thermocouples demonstrate an ultrafast response time of less than 15 microseconds and reach thermal equilibrium within 200 microseconds under transient thermal inputs. These characteristics enable accurate and rapid temperature measurement of fuel cell plates up to 100 °C, which is critical for maintaining the safe and efficient operation of fuel cells.

In the new energy electric drive system, the thermal stability of IGBT, a core power device, significantly impacts the system’s overall performance. Accurate IGBT temperature measurement is crucial, but traditional methods face limitations in IGBT’s compact working space. Thin-film thermocouples, with their thin and light features, offer a new solution. In this study, Ni 90% Cr 10% and Ni 97% Si 3% thin-film thermocouples were prepared on polyimide substrates via magnetron sputtering. After calibration, the Seebeck coefficient of the thin-film thermocouple temperature sensors reached 40.23 μV/°C, and the repeatability error stabilized at about 0.3% as the temperature rose, showing good stability. Researchers studied factors affecting IGBT temperature. Thin-film thermocouples can accurately monitor IGBT module surface temperature under different conditions. Compared to K-type wire thermocouples, they measure slightly higher temperatures. As the control signal’s switching frequency increases, IGBT temperature first rises then falls; as the duty cycle increases, the temperature keeps rising. This is consistent with RAC’s junction temperature prediction theory, validating the feasibility of thin-film thermocouples for IGBT chip temperature measurement. Thin-film thermocouples have great application potential in power device temperature measurement and may be a key research direction, supporting the optimization and upgrading of new energy electric drive systems.