LiNbO₃ plays a significant role in modern integrated photonics because of its unique properties. One of the challenges in modern integrated photonics is reducing chip production cost. Today, the most widespread yet expensive method to fabricate thin films of LiNbO₃ is the smart cut method. The high production cost of smart-cut chips is caused by the use of expensive equipment for helium implantation. A prospective method to reduce the cost of photonic integrated circuits is to use sputtered thin films of lithium niobite, since sputtering technology does not require helium implantation equipment. The purpose of this review is to assess the feasibility of applying sputtered LiNbO₃ thin films in integrated photonics. This work compares sputtered LiNbO₃ thin films and those fabricated by widespread methods, including the smart cut method, liquid-phase epitaxy, chemical vapor deposition, pulsed laser deposition, and molecular-beam epitaxy.