Wearable and implantable BioMEMSs (biomedical microelectromechanical systems) have transformed modern healthcare by enabling continuous, personalized, and minimally invasive monitoring, diagnostics, and therapy. Wearable BioMEMSs have advanced rapidly, encompassing a diverse range of biosensors, bioelectronic systems, drug delivery platforms, and motion tracking technologies. These devices enable non-invasive, real-time monitoring of biochemical, electrophysiological, and biomechanical signals, offering personalized and proactive healthcare solutions. In parallel, implantable BioMEMS have significantly enhanced long-term diagnostics, targeted drug delivery, and neurostimulation. From continuous glucose and intraocular pressure monitoring to programmable drug delivery and bioelectric implants for neuromodulation, these devices are improving precision treatment by continuous monitoring and localized therapy. This review explores the materials and technologies driving advancements in wearable and implantable BioMEMSs, focusing on their impact on chronic disease management, cardiology, respiratory care, and glaucoma treatment. We also highlight their integration with artificial intelligence (AI) and the Internet of Things (IoT), paving the way for smarter, data-driven healthcare solutions. Despite their potential, BioMEMSs face challenges such as regulatory complexities, global standardization, and societal determinants. Looking ahead, we explore emerging directions like multifunctional systems, biodegradable power sources, and next-generation point-of-care diagnostics. Collectively, these advancements position BioMEMS as pivotal enablers of future patient-centric healthcare systems.

Lithography is crucial to semiconductor manufacturing, enabling the production of smaller, more powerful electronic devices. This review explores the evolution, principles, and advancements of key lithography techniques, including extreme ultraviolet (EUV) lithography, electron beam lithography (EBL), X-ray lithography (XRL), ion beam lithography (IBL), and nanoimprint lithography (NIL). Each method is analyzed based on its working principles, resolution, resist materials, and applications. EUV lithography, with sub-10 nm resolution, is vital for extending Moore’s Law, leveraging high-NA optics and chemically amplified resists. EBL and IBL enable high-precision maskless patterning for prototyping but suffer from low throughput. XRL, using synchrotron radiation, achieves deep, high-resolution features, while NIL provides a cost-effective, high-throughput method for replicating nanostructures. Alignment marks play a key role in precise layer-to-layer registration, with innovations enhancing accuracy in advanced systems. The mask fabrication process is also examined, highlighting materials like molybdenum silicide for EUV and defect mitigation strategies such as automated inspection and repair. Despite challenges in resolution, defect control, and material innovation, lithography remains indispensable in semiconductor scaling, supporting applications in integrated circuits, photonics, and MEMS/NEMS devices. Various molecular strategies, mechanisms, and molecular dynamic simulations to overcome the fundamental lithographic limits are also highlighted in detail. This review offers insights into lithography’s present and future, aiding researchers in nanoscale manufacturing advancements.

This report presents the design and simulation of a MEMS based In-plane Lorentz Force Magnetometer (I-LFM), simulated for 8 um UV-LIGA technology using FEM tool of COMSOL Multiphysics 4.3b. Designed I-LFM was simulated in the magnetic field range varied from 1 μJT to 100μJT. The proposed structure composed of a comb drive actuator, configured such that the fingers overlap with each other to generate capacitive coupling for its actuation. The magnetic field can be detected in Z-axis by this comb drive structure. The device was excited by supplying the sinusoidal current with the frequency equivalent to resonance frequency of the device at its first mode i.e. 12.047 kHz. In order to achieve the maximum mechanical output, the device was operated at the resonant frequency. Simulations based results shows a good linearity in the magnetic field range of 1 μJT to 100 μJT with a high quality factor of 130.

This paper presents the design and simulation of a MEMS Capacitive Magnetometer using FEM (Finite Element Method) tool COMSOL Multiphysics 4.3b and results from this simulation are closely matched with analytically calculated results. A comb drive structure is used for actuation purpose which operates at resonant frequency of device is 11.791 kHz to achieve maximum displacement. A magnetic field in z-axis can be detected by this comb drive structure. Quality factor of MEMS capacitive magnetometer obtained is 18 and it has good linear response in the magnetic field range of 100 µT.