In the context of the global energy structure transformation, concentrated solar power (CSP) technology has gained significant attention. Its future trajectory is oriented towards the construction of ultra-high temperature (700–1000 °C) power plants, aiming to enhance thermoelectric conversion efficiency and economic competitiveness. Chloride molten salts, serving as a crucial heat transfer and storage medium in the third-generation CSP system, offer numerous advantages. However, they are highly corrosive to metal materials. This paper provides a comprehensive review of the corrosion behaviors of stainless steels and high-temperature alloys in molten salts. It analyzes the impacts of factors such as temperature and oxygen, and it summarizes various corrosion types, including intergranular corrosion and hot corrosion, along with their underlying mechanisms. Simultaneously, it presents an overview of the types, characteristics, impurity effects, and purification methods of molten salts used for high-temperature heat storage and heat transfer. Moreover, it explores novel technologies such as alternative molten salts, solid particles, gases, liquid metals, and the carbon dioxide Brayton cycle, as well as research directions for improving material performance, like the application of nanoparticles and surface coatings. At present, the corrosion of metal materials in high-temperature molten salts poses a significant bottleneck in the development of CSP. Future research should prioritize the development of commercial alloy materials resistant to chloride molten salt corrosion and conduct in-depth investigations into related influencing factors. This will provide essential support for the advancement of CSP technology.

In the present study, molecular dynamics simulations were employed to investigate the effect of strain rate on the plastic deformation mechanism of nanocrystalline 316 L stainless-steel, wherein there was an average grain of 2.5–11.5 nm at room temperature. The results showed that the critical grain size was 7.7 nm. Below critical grain size, grain boundary activation was dominant (i.e., grain boundary sliding and grain rotation). Above critical grain size, dislocation activities were dominant. There was a slight effect that occurred during the plastic deformation mechanism transition from dislocation-based plasticity to grain boundaries, as a result of the stress rate on larger grain sizes. There was also a greater sensitive on the strain rate for smaller grain sizes than the larger grain sizes. We chose samples of 316 L nanocrystalline stainless-steel with mean grain sizes of 2.5, 4.1, and 9.9 nm. The values of strain rate sensitivity were 0.19, 0.22, and 0.14, respectively. These values indicated that small grain sizes in the plastic deformation mechanism, such as grain boundary sliding and grain boundary rotation, were sensitive to strain rates bigger than those of the larger grain sizes. We found that the stacking fault was formed by partial dislocation in all samples. These stacking faults were obstacles to partial dislocation emission in more sensitive stress rates. Additionally, the results showed that mechanical properties such as yield stress and flow stress increased by increasing the strain rate.

Molecular dynamics simulations were conducted to study the mechanical properties of nanocrystalline 316L stainless steel under tensile load. The results revealed that the Young’s modulus increased with increasing grain size below the critical average grain size. Two grain size regions were identified in the plot of yield stress. In the first region, corresponding to grain sizes above 7.7 nm, the yield stress decreased with increasing grain size and the dominant deformation mechanisms were deformation twinning and extended dislocation. In the second region, corresponding to grain sizes below 7.7 nm, the yield stress decreased rapidly with decreasing grain size and the dominant deformation mechanisms were grain boundary sliding and also grain rotation. The yield strength and Young’s modulus were both found to decrease with increasing temperature, which increased the interatomic distance and thereby decreased the interatomic bonding force.

Introducing nano-twins into electrolytic copper foil is an effective method to enhance strength and toughness. While pulse electrodeposition enables the easier preparation of high-density nano-twin copper, large-scale industrial production mainly relies on direct current electrodeposition. Therefore, systematically studying the effects of electroplating parameters on the microstructure and mechanical properties of direct current electrodeposited copper foil is crucial. In this paper, we discuss the effects of pH value, C_CuSO4, and J_k on the microstructure and mechanical properties of electroplated copper foils at room temperature. The results show that copper foils exhibit stronger (220)_Cu preferred orientation on the M surface than on the S surface with changes in pH value, C_CuSO4, and J_k. When the pH value is 2.5, the C_CuSO4 is between 70 and 90 g/L, and the J_k is within the range of 70–90 mA/cm², the prepared copper foil has better compactness and no obvious pinhole-like defects. Particularly, the copper foil electroplated with a pH value of 2.5, a C_CuSO4 of 80 g/L, and a J_k of 80 mA/cm² consists of equiaxed and columnar grains, featuring small grain size, uniform distribution, and a dense structure, resulting in excellent mechanical properties.