Recently, nanosilver pastes have emerged as one of the most promising high temperature bonding materials for high frequency and high power applications, which provide an effective lead-free electronic packaging solution instead of high-lead and gold-based solders. Although nanosilver pastes can be sintered at lower temperature compared to bulk silver, applications of nanosilver pastes are limited by long-term sintering time (20–30 min), relative high sintering temperature (>250 °C), and applied external pressure, which may damage chips and electronic components. Therefore, low temperature rapid sintering processes that can obtain excellent nanosilver joints are anticipated. In this regard, we present a review of recent progress in the rapid sintering of nanosilver pastes. Preparation of nanosilver particles and pastes, mechanisms of nanopastes sintering, and different rapid sintering processes are discussed. Emphasis is placed on the properties of sintered joints obtained by different sintering processes such as electric current assisted sintering, spark plasma sintering, and laser sintering, etc. Although the research on rapid sintering processes for nanosilver pastes has made a great breakthrough over the past few decades, investigations on mechanisms of rapid sintering, and the performance of joints fabricated by pastes with different compositions and morphologies are still far from enough.

Due to the harsh working environments up to 600 °C, the exploration of high-temperature interconnection materials is significantly important for high-power devices. In this study, a hybrid paste including Cu@Ag core-shell microparticles (MPs) and Ag nanoparticles (NPs) was designed to achieve Cu-Cu bonding. The Cu@Ag MPs exhibited excellent oxidation stability in an air atmosphere with the Ag layer coating on the Cu core. Ag NPs fill the pores among the Cu@Ag MPs and reduce the sintering temperature of the hybrid paste. The Cu-hybrid paste-Cu joints were formed via electromagnetic induction heating within approximately 15 s. When sintered at 26 kW, the shear strength of the joint reached 48 MPa, the porosity decreased to 0.73%, and the resistivity was down to 13.25 μΩ·cm. Furthermore, a possible interconnection mechanism at the contact interface between the Cu substrate and the sintered hybrid paste was proposed, which is related to the melting point of metal particles and the effect of magnetic eddy currents. This fast bonding technology inspires a new approach to interconnection for high-power devices under high operation temperatures.

In this paper, we have investigated a laser-assisted fast nano-Ag sintering process for die attach in power electronic applications. The effects of laser power, irradiation time, and load on microstructure and shear performance of the bonded samples are presented. Moreover, samples sintered by a hotplate were also studied as a comparison. The results indicate that the die-attach process using the nano-Ag material can be realized within 1 min in the laser-assisted sintering method. In general, better shear strength was obtained with increasing laser power, irradiation time, and load. The shear strength of samples irradiated by 2-5 min of laser beam was comparable to that of the samples sintered on the hotplate for 80 min.