The vulnerability of prominent silicon-based U-shaped Metal-Oxide-Semiconductor Field Effect Transistors (UMOSFET) to destructive radiation effects when operating in terrestrial atmospheric environments is addressed. It is known that secondary particles from nuclear reactions between atmospheric neutrons and the constituent materials of electronic devices can trigger Single-Event Burnout (SEB) destructive failure in power MOSFETs. The susceptibility of UMOSFETs to SEBs induced by atmospheric neutrons in accelerated tests are compared to that of similarly rated traditional Double-diffused MOSFET (DMOSFET) counterparts. Computational simulations are conducted to elucidate failure mechanisms and propose strategies to potentially enhance the survivability of next-generation UMOSFETs in high-reliability power systems operating on Earth.

In this work, measurements were taken to investigate the robustness of a GaN HEMT to TID by a 60CO Source. These results will be compared with a previous X-ray based work. The robustness was investigated through IxV curves and characteristic parameters of the irradiated device. The analysis included data acquired both from on- and off- state modes. The work concludes that the device is robust to TID, as it quickly recovered important parameters. Mainly, the on-state mode, which presented a better performance compared to the off-mode. An analogous behavior was seen for X-ray. Finally, the VTH values due to the TID, in this device is independent of the dose rate and the radiation source.

The trench gate or U-groove MOSFET (UMOSFET) has become widely adopted as a semiconductor device globally, gradually replacing the traditional vertical double-diffused MOSFET (DMOSFET) in many applications. Evaluating the reliability of UMOSFETs regarding neutron-induced radiation effects is crucial for understanding their response to ubiquitous atmospheric neutrons. This study presents comparative experimental and computational results of Single-Event Effects induced by monoenergetic fast neutrons in UMOS and DMOS power transistors. Experiments demonstrate that UMOSFETs exhibit premature particle-induced avalanche multiplication effects compared to similarly rated DMOSFETs, which may favor destructive radiation effects, such as Single-Event Burnout, when operating in the terrestrial radiation environment.

The U-shaped Metal-Oxide-Semiconductor Field-Effect Transistor (UMOS or trench FET) is one of the most widely used semiconductor power devices worldwide, increasingly replacing the traditional vertical double-diffused MOSFET (DMOSFET) in various applications due to its superior electrical performance. However, a detailed experimental comparison of ion-induced Single-Event Burnout (SEB) in similarly rated silicon (Si) UMOS and DMOS devices remains lacking. This study presents a comprehensive experimental comparison of ion-induced charge collection mechanisms and SEB susceptibility in similarly rated Si UMOS and DMOS devices. Charge collection mechanisms due to alpha particles from ²⁴¹Am radiation source are analyzed, and SEB cross sections induced by heavy ions from particle accelerators are directly compared. The implications of the unique gate structure of Si UMOSFETs on their reliability in harsh radiation environments are discussed based on technology computer-aided design (TCAD) simulations.

The vulnerability of prominent silicon-based U-shaped Metal-Oxide-Semiconductor Field Effect Transistors (UMOSFET) to destructive radiation effects when operating in terrestrial atmospheric environments is addressed. It is known that secondary particles from nuclear reactions between atmospheric neutrons and the constituent materials of electronic devices can trigger Single-Event Burnout (SEB) destructive failure in power MOSFETs. The susceptibility of UMOSFETs to SEBs induced by atmospheric neutrons in accelerated tests are compared to that of similarly rated traditional Double-diffused MOSFET (DMOSFET) counterparts. Computational simulations are conducted to elucidate failure mechanisms and propose strategies to potentially enhance the survivability of next-generation UMOSFETs in high-reliability power systems operating on Earth.