Understanding the interfacial changes of wood during heat treatment can facilitate the improvement of the bonding and coating processes of heat-treated wood. Steam was used as the medium to modify Pinusmassoniana wood through heat treatment at 160, 180, 200, and 220 °C. Changes to the surface characteristics after heat treatment were characterized by Fourier transform-infrared spectroscopy (FT-IR), X-ray diffraction (XRD), scanning electron microscope (SEM) and contact angle measurement. The results showed that: (1) hemicelluloses were the first to experience degradation at 160 °C, and this degradation was the most intense at 200 °C. The cellulose started experiencing obvious degradation at 200 °C, while there was less degradation of lignin at this temperature. (2) Oxygen-containing groups like hydroxyl and carbonyl were gradually reduced as temperature increased with deepened color and passivated surface. (3) Cellulose crystallinity presented a variable trend of increasing–decreasing–increasing. (4) Surface porosity and roughness of Pinus massoniana wood both increased after heat treatment. (5) The Pinus massoniana wood interface turned from hydrophilic to hydrophobic, and 180 °C was a turning point for the wettability of the Pinus massoniana wood interface.

(1) A compound protectant was prepared using manganese chloride, phosphoric acid, boric acid and ammonium chloride, and then a veneer was immersed in the prepared protectant to prepare plywood in this paper. Great attention was paid to discussing influences of such protectant on fire resistance, decay resistance, anti-mold property and bonding performance of plywood. Results demonstrated that after protectant treatment, the plywood showed not only good fire resistance and smoke inhibition, but also strong char-formation ability, slow flame spreading, long time to ignition, small fire risk and high safety level. (2) The mass loss rates of plywood with protectant treatment after infection and erosion in wood-destroying Coriolus versicolor and Gloeophyllum trabeum were 19.73% and 17.27%, reaching the II-level corrosion grade. (3) There is not a significant difference with Aspergillus niger V.; however, it was possible to observe a strong difference with Trichoderma viride Pers. ex Fr., indicating that the protectant acted as a good anti-mold product for plywood. (4) The protectant influenced the bonding interface of wood and bonding conditions of the adhesive. The bonding strength of plywood was weakened, but it still met the requirements on bonding strength of GB/T 9846-2015. (5) The protectant changed the thermal decomposition and thermal degradation of plywood, inhibiting the generation of inflammable goods, blocking transmission of heats and lowering the thermal decomposition temperature of plywood. These promoted dehydrations and charring of wood and the generated carbon had a high thermal stability. (6) Compared with untreated plywood, the prepared protectant treatment significantly enhanced the fire resistance of plywood, reduced its biodegradability by wood-decaying fungi and showed good mold resistance.

In this research, a urea–formaldehyde (UF) resin was modified with nanocrystalline cellulose (NCC) and nanofibrillated cellulose (CNF), and the properties of the modified resin were comprehensively evaluated by combining the techniques of infrared spectroscopy (FTIR), X-ray diffraction (XRD), differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), and scanning electron microscopy (SEM). The results showed that (1) the introduction of NCC and CNF significantly changed the hydrogen bonding network of the UF resin, in which CNF enhanced the internal hydrogen bonding of the resin through its long-chain structure and elevated the cross-linking density. NCC increased the crystallinity of the resin, while CNF enhanced the overall performance of the resin by improving its dispersion. (2) The composite curing agent system significantly reduced the curing temperature of the resin, resulting in a more homogeneous and efficient curing reaction, and the CNF-modified UF exhibited better thermal stability. (3) The addition of NCC and CNF significantly improved the dry and water-resistant bonding strengths of the resins. In addition, the use of complex curing agent further enhanced the bonding strength, especially in the CNF-modified system; the addition of complex curing agent increased the dry bonding strength to 1.60 MPa, and the water-resistant bonding strength reached 1.13 MPa, which showed a stronger cross-linking network and structural stability. (4) The addition of NCC and CNF led to a significant reduction in the free formaldehyde content of UF resins, resulting in respective levels of 0.17% and 0.14%. For plywood bonded with the CNF-modified UF resin, formaldehyde emissions were measured at 0.35 mg/L, which were markedly lower than the 0.54 mg/L of the unmodified sample. This further highlights CNF’s effectiveness in minimizing formaldehyde release. (5) Overall, CNF is superior to NCC in improving the thermal stability, bonding strength, water resistance, formaldehyde release, and overall performance of the resin. The use of complex curing agents not only optimizes the curing process of the resin but also further enhances the modification effect, especially for CNF-modified resins, which show more significant performance advantages.

In order to improve the initial viscosity and stability of Camellia oleifera cake-protein adhesive, Camellia oleifera cake-protein was blended with defatted soybean protein (DSP), soybean protein isolate (SPI), and casein, followed by adhesive preparation through degradation and crosslinking methods. The performance of Camellia oleifera cake-protein adhesive was investigated by Fourier transform infrared spectroscopy (FT-IR), differential scanning calorimetry (DSC), scanning electron microscopic (SEM), and thermogravimetric (TG) and X-ray diffraction (XRD). The results showed that DSP, SPI, and casein likely promoted the effective degradation of Camellia oleifera cake-protein, and, thus, more active groups were formed in the system, accompanied by more reactivity sites. The prepared adhesive had a lower curing temperature, and higher initial viscosity and stability, but the storage time was shortened. Moreover, DSP, SPI, and casein, themselves, were degraded into peptide chains with lower molecular weights; thus, improving the overall flexibility of the adhesive, facilitating a better elastic contact and regular array between crosslinking products, and further strengthening the crosslinked structure and density of the products. After curing, a compact and coherent reticular structure was formed in the adhesive layer, with both bonding strength and water resistance being significantly improved. According to the results obtained, the next step will be to study the DSP-modified Camellia oleifera cake-protein adhesive in depth.