The mechanical characteristics of electrochemically deposited copper coatings have been examined by application of two hardness composite models: the Chicot-Lesage (C-L) and the Cheng-Gao (C-G) models. The 10, 20, 40 and 60 µm thick fine-grained Cu coatings were electrodeposited on the brass by the regime of pulsating current (PC) at an average current density of 50 mA cm⁻², and were characterized by scanning electron (SEM), atomic force (AFM) and optical (OM) microscopes. By application of the C-L model we determined a limiting relative indentation depth (RID) value that separates the area of the coating hardness from that with a strong effect of the substrate on the measured composite hardness. The coating hardness values in the 0.9418–1.1399 GPa range, obtained by the C-G model, confirmed the assumption that the Cu coatings on the brass belongs to the “soft film on hard substrate” composite hardness system. The obtained stress exponents in the 4.35–7.69 range at an applied load of 0.49 N indicated that the dominant creep mechanism is the dislocation creep and the dislocation climb. The obtained mechanical characteristics were compared with those recently obtained on the Si(111) substrate, and the effects of substrate characteristics such as hardness and roughness on the mechanical characteristics of the electrodeposited Cu coatings were discussed and explained.

Mechanical (hardness and adhesion) and electrical (sheet resistance) characteristics of electrolytically produced copper coatings have been investigated. Morphologies of Cu coatings produced galvanostatically at two current densities from the basic sulfate electrolyte and from an electrolyte containing levelling/brightening additives without and with application of ultrasound for the electrolyte stirring were characterized by SEM and AFM techniques. Mechanical characteristics were examined by Vickers microindentation using the Chen–Gao (C–G) composite hardness model, while electrical characteristics were examined by the four-point probe method. Application of ultrasound achieved benefits on both hardness and adhesion of the Cu coatings, thereby the use of both the larger current density and additive-free electrolyte improved these mechanical characteristics. The hardness of Cu coatings calculated according to the C–G model was in the 1.1844–1.2303 GPa range for fine-grained Cu coatings obtained from the sulfate electrolyte and in the 0.8572–1.1507 GPa range for smooth Cu coatings obtained from the electrolyte with additives. Analysis of the electrical characteristics of Cu coatings after an aging period of 4 years showed differences in the sheet resistance between the top and the bottom sides of the coating, which is attributed to the formation of a thin oxide layer on the coating surface area.

The influence of various electrolysis parameters, such as the type of cathode, composition of the electrolyte and electrolysis time, on the morphology, structure and hardness of copper coatings has been investigated. Morphology and structure of the coatings were analyzed by scanning electron microscope (SEM), atomic force microscope (AFM) and X-ray diffraction (XRD), while coating hardness was examined by Vickers microindentation test applying the Chicot–Lesage (C–L) composite hardness model. Depending on the conditions of electrolysis, two types of Cu coatings were obtained: fine-grained mat coatings with a strong (220) preferred orientation from the sulfate electrolyte and smooth mirror bright coatings with a strong (200) preferred orientation from the electrolyte with added leveling/brightening additives. The mat coatings showed larger both measured composite and calculated coating hardness than the mirror bright coatings, that can be explained by the phenomena on boundary among grains. Independent of electrolysis conditions, the critical relative indentation depth (RID) of 0.14 was established for all types of the Cu coatings, separating the zone in which the composite hardness can be equaled with the coating hardness and the zone requiring an application of the C–L model for a determination of the absolute hardness of the Cu coatings.

The influence of various intensities of ultrasound applied for the electrolyte stirring on morphological and mechanical characteristics of electrolytically produced copper coatings has been investigated. The copper coatings produced by the galvanostatic regime of the electrodeposition from the basic sulphate electrolyte and the electrolyte with added levelling/brightening additives at the low temperature were characterized by scanning electron microscopy (SEM) and atomic force microscopy (AFM) techniques (surface morphology and topography, respectively) and by Vickers microindentation (hardness). The roughness of coatings increased with the increasing intensity of ultrasound, indicating that morphology of the coatings worsened with the enhanced application of ultrasonic waves. This is attributed to the strong effect of ultrasound on hydrodynamic conditions in the near-electrode layer, which is manifested by the increase of share of the activation control in the mixed activation-diffusion control of electrodeposition with increasing the intensity of ultrasound. The concept of "effective overpotential" originally proposed to explain a change of surface morphology in the conditions of vigorous hydrogen evolution is also applicable for a change of morphology of Cu coatings under the imposed effect of ultrasonic waves. Hardness analysis of the coatings showed that an intensity of applied ultrasound did not have any significant effect on the hardness, especially for the Cu coatings produced from the basic sulphate electrolyte.

The mechanical properties of systems consisting of copper coatings electrodeposited on both brass sheet (BS) and thick electrodeposited nickel coating (ED Ni) substrates have been investigated. The electrodeposition of copper coatings was performed with and without the ultrasound assistance. The ultrasound application decreases root mean square (RMS) roughness of deposited Cu coating on both applied substrates, as obtained from non-contact AFM measurement. The coating roughness is highly dependent on the substrate roughness, being the smallest for the Cu coatings deposited on ED Ni substrate with the ultrasound mixing. The hardness and adhesion properties were characterized using the Vickers microindentation test. Model of Korsunsky was applied to the experimental data for determination the film hardness and the model of Chen-Gao was used for the adhesion evaluation. The introduction of ultrasonic agitation caused the changes in the film microstructure, and consequently in the mechanical properties. The copper coatings on both substrates, have higher hardness when deposited from electrolyte with ultrasound agitation. Although the type of the substrate has the major influence on the adhesion strength, it can be said that Cu electrodeposition with ultrasonic mixing contributes to an increase in adhesion.

The adhesion of copper thin films galvanostatically electrodeposited on Cu cathodes from electrolytes without or with the addition of various additives, such as chloride ions, polyethylene glycol 6000 (PEG 6000), and 3–mercapto–1–propanesulfonic acid, has been investigated. Morphological and structural analyses of synthesized films were performed using the SEM, AFM, and XRD methods, while the adhesion of the films was examined by applying the theoretical Chen–Gao (C–G) composite hardness model using results from Vickers microindentation, a bidirectional bending test, and a scratch-tape adhesion test. The morphologies of the films were either very smooth, with mirror-like brightness, obtained from the electrolyte containing all three additives, or microcrystalline, with different grain sizes, obtained from other electrolytes. The best adhesion was observed in the fine-grained film with numerous boundaries among grains, obtained with the addition of chloride ions and PEG 6000, while the mirror-bright film obtained with a combination of all three additives showed the worst adhesion. The boundaries among grains represented barriers that decreased the depth of penetration during microindentation and, consequently, increased the hardness and enhanced the adhesion of the film. The size of the grains—and hence, the number of grain boundaries—was regulated by the composition of the electrolytes achieved by the addition of additives. Good agreement was observed among the various methods used for the estimation of the adhesion properties of Cu films.