Thin-film encapsulation has been a critical method to realize small-size OLED displays. However, the manufacturing of large-size flexible OLED is still in the preparatory phase prior to commercialization, which entails more rigorous demands for reliability and flexibility with regard to thin-film encapsulation. This review, from the perspective of engineering for mass production, addresses the development of thin-film encapsulation and its three core properties for comprehensive validation while engineering, including basic properties, reliability, and compatibility. Moreover, considering the prospective evolution of display products, the review on novel thin-film encapsulation was conducted to evaluate the potential engineering value for thinning, ultra-flexibility, multifunctionality, novel equipment, and emerging technology. It is anticipated that some of the aforementioned technologies may prove to be of significant engineering value. It is therefore hoped that by comprehensive engineering verification, the commercial application of novel thin-film encapsulation can be promoted and the competitiveness of OLED products can be effectively enhanced.

To improve the low deposition rate of atomic layer deposition (ALD), we introduced filtered cathodic vacuum arc (FCVA) technology for the high-rate deposition of Al₂O₃ films. The FCVA-Al₂O₃ process achieved a deposition rate of 15 nm/min, which is approximately an order of magnitude higher than that of conventional ALD. This process does not involve hydrogen, preventing hydrogen ion penetration and thereby ensuring the high stability of the oxide TFT backplane. FCVA-Al₂O₃ films were integrated with inkjet-printed (IJP) organic layers to form a hybrid thin-film encapsulation (TFE) structure for OLEDs. The resulting laminated encapsulation exhibited excellent water vapor barrier properties (WVTR, Water Vapor Transmission Rate of 1.2 × 10⁻⁴ g/m²/day), demonstrating the great potential of FCVA for packaging high-throughput and high-performance flexible electronics. In addition to evaluating barrier properties (surface roughness, residual stress, and WVTR) to assess the suitability of TFE, the impact of FCVA technology was assessed via oxide thin-film transistor (TFT) electrical performance and OLED device reliability tests. The electrical properties of oxide TFTs show no significant degradation post-encapsulation, while OLED performance, despite a slight increase in current efficiency, remains effectively unchanged. Additionally, the lifetime of OLED devices reached 300 h under accelerated aging conditions (85 °C, 85% relative humidity), which is nearly twice that of devices without FCVA-Al₂O₃ encapsulation.