Peng Liu

Dr. Peng Liu


Research Focus & Metrics

Academic Career Length

5Years (2022-Present)

(Calculated once Scilit publication data is synced: current year − year of first publication + 1)

Representative Publications

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26 January 2022 in Applied Sciences
Verified
Journal Article
Open access
PDF file
ZGZuwei Guan
Zuwei Guan
PLPeng Liu
Peng Liu
TZTianfeng Zhou
Tianfeng Zhou
LZLin Zhou
Lin Zhou
DZDanmei Zhang
Danmei Zhang
WZWenxiang Zhao
Wenxiang Zhao
In this paper, the pain point that cold chain transportation urgently needs for an efficient disinfection method is pointed out. Thus, this work aims at solving the problems and improving the disinfection efficiency in cold chain transportation. While Ultraviolet-C (UVC) irradiation is an effective method by which to kill viruses, it is difficult to apply the commonly used UVC-LED disinfection light source to ice-covered cold chain transportation due to its uneven light field distribution. Thus, the light field regulation of UVC-LED disinfection for cold chain transportation is studied. A UVC-LED chip with a wavelength of 275 nm was used as a light source, and parallel light was obtained by collimating lenses. Then, microlens array homogenization technology was used to shape the UVC light into a uniform light spot, with an energy space uniformity rate of 96.4%. Moreover, a simulation was conducted to compare the effects of the ice layer on the absorption of UVC light. Finally, an experiment was carried out to verify that the disinfection efficiency can be increased nearly by 30% with the proposed system by disinfecting E. coli (Escherichia coli), and the results indicate that the proposed system is an effective disinfection solution during cold chain transportation.

31 May 2023 in Micromachines
Verified
Journal Article
Open access
PDF file
TZTianfeng Zhou
Tianfeng Zhou
ZLZhongyi Li
Zhongyi Li
WGWeijia Guo
Weijia Guo
PLPeng Liu
Peng Liu
Bin ZhaoBin Zhao
Bin Zhao
XWXibin Wang
Xibin Wang
Microlens arrays have been widely employed to control the reflection, refraction, and diffraction characteristics of light due to its distinctive surface properties. Precision glass molding (PGM) is the primary method for the mass production of microlens arrays, of which pressureless sintered silicon carbide (SSiC) is a typical mold material due to its excellent wear resistance, high thermal conductivity, high-temperature resistance, and low thermal expansion. However, the high hardness of SSiC makes it hard to be machined, especially for optical mold material that requires good surface quality. The lapping efficiency of SSiC molds is quite low. and the underlying mechanism remains insufficiently explored. In this study, an experimental study has been performed on SSiC. A spherical lapping tool and diamond abrasive slurry have been utilized and various parameters have been carried out to achieve fast material removal. The material removal characteristics and damage mechanism have been illustrated in detail. The findings reveal that the material removal mechanism involves a combination of ploughing, shearing, micro-cutting, and micro-fracturing, which aligns well with the results obtained from finite element method (FEM) simulations. This study serves as preliminary reference for the optimization of the precision machining of SSiC PGM molds with high efficiency and good surface quality.

8 May 2025 in The International Journal of Advanced Manufacturing Technology
Verified
Journal Article
Closed access
PDF file
EYEnxiong Yu
Enxiong Yu
FQFangdong Qiu
Fangdong Qiu
TSTao Sun
Tao Sun
PLPeng Liu
Peng Liu
Bin ZhaoBin Zhao
Bin Zhao
TZTianfeng Zhou
Tianfeng Zhou

30 July 2025 in Micromachines
Verified
Journal Article
Open access
PDF file
AXAowei Xing
Aowei Xing
ZLZiwei Li
Ziwei Li
TZTianfeng Zhou
Tianfeng Zhou
ZHZhiyuan Huang
Zhiyuan Huang
WGWeijia Guo
Weijia Guo
PLPeng Liu
Peng Liu
Glass enjoys a wide range of applications thanks to its superior optical properties and chemical stability. Conventional glass bonding techniques suffer from low efficiency, limited precision, and high cost. Moreover, for multilayer glass bonding, repeated alignment is often required, further complicating the process. These limitations have become major constraints on the advancement of microfluidic chip technologies. Laser bonding of microfluidic chips offers high precision and efficiency. This research first uses an ultrafast laser system to investigate how processing parameters affect weld morphology, identifying the optimal parameter range. Then, this paper proposes two methods for ultrafast-laser bonding of multilayer glass with different thicknesses and performs preliminary experiments to demonstrate their feasibility. The research in this paper could expand the fabrication method of microfluidic chips and lay a foundation for the wider application of microfluidic chips.

31 October 2026 in Micromachines
Verified
Journal Article
Open access
PDF file
PLPeng Liu
Peng Liu
JYJiaqin Yang
Jiaqin Yang
TZTianfeng Zhou
Tianfeng Zhou
AXAowei Xing
Aowei Xing
WYWenhan Yang
Wenhan Yang
YZYichuan Zhang
Yichuan Zhang
Monocrystalline silicon is an ideal material for infrared optics microlens arrays, achieving excellent performance, but the processing is extremely difficult and poses a challenge to traditional processing processes. In this paper, a new process flow for processing monocrystalline silicon microlens arrays is proposed, combining femtosecond laser three-dimensional dynamic focusing processing technology with sandblasting and polishing finishing technology. Dynamic focusing technology is used to adjust the focus position in real time to adapt to the complex processing needs of three-dimensional structures, and the influence of different laser processing parameters on the processing size and morphology is studied. The mechanism of processing errors and surface defects is proposed to realize the compensation of three-dimensional processing errors. Through experiments and simulations, a 515 nm green light, 100 KHz repetition frequency, power of about 20 W—maintaining the same scanning speed of 3000 mm/s and isotropic filling scanning interval of 5 μm, with an on delay of 0.23 ms, an off delay of 0.12 ms, a corner delay of 0.13 ms, and a null walk delay of 0.24 ms, and a delamination height of 1 μm—were finally selected for the laser processing. The process parameters are feasible and the processing effect is good, providing a new solution for processing hard and brittle materials.

1 July 2026 in Journal of Physics: Conference Series
Verified
Conference Paper
Open access
YXYaxin Xu
Yaxin Xu
TZTianfeng Zhou
Tianfeng Zhou
PLPeng Liu
Peng Liu
AXAowei Xing
Aowei Xing
Glass microchannel structures typically feature micrometer-scale dimensions and high aspect ratios. During the pressing stage of precision glass molding, the mold and glass remain in point or line contact for an extended period, resulting in a real contact area that is much smaller than the nominal one. This induces pronounced temperature gradients within the glass, leading to nonuniform flow behavior, incomplete filling of the microstructures, and deviations from the target geometry. In this work, a thermo-mechanically coupled model is developed to describe the molding of glass microchannels under a non-uniform temperature field. A thermal regulation strategy for glass precision molding using multi-material mold assemblies is proposed, in which mold components with different thermal conductivities (heat-resistant stainless steel, tungsten carbide, and graphite) are combined to actively control the temperature uniformity and thermal stress distribution within the glass during the pressing stage. Experimental validation demonstrates that the filling ratios of the glass microchannels are improved by 65.97% and 69.96%, respectively.