Silicon photonics, serving as a cornerstone technology in modern information technology, demonstrates significant application potential in critical scenarios such as high-speed data center interconnects and integrated optical communication systems. Facing the persistent demand for information processing capabilities in the post-Moore era, photonic chips have emerged as a pivotal direction for overcoming the performance bottlenecks of traditional chips, leveraging their advantages of low power consumption, high speed, and high integration density. This review focuses specifically on the optical interconnection and packaging technologies for photonic chips. It comprehensively analyzes the research frontiers and key challenges in packaging technologies, encompassing efficient fiber-to-chip coupling techniques, chip-scale optical interconnection technologies, and 2D, 2.5D, and 3D stacked co-packaged optics technologies. By synthesizing and summarizing recent research advances, this paper aims to provide researchers in related fields with a systematic understanding of photonic integrated circuit technology. Furthermore, it seeks to offer insights for future technological breakthroughs in device optimization, packaging innovation, and system-level applications of photonic integrated circuits.

Microchannel liquid cooling technology, characterized by high heat-transfer efficiency, represents an effective solution for thermal management in high heat-flux density electronic devices. Existing research has mainly focused on optimizing the structural design of microchannel heat sinks, while neglecting the specific effects of inlet manifold configurations on their heat transfer and flow performance. To obtain more systematic data on microchannel heat transfer performance and internal velocity distribution, this study designed microchannels with single-inlet and triple-inlet configurations. A microchannel cooling performance testing platform was established, and visualization experiments of the internal flow field in straight microchannels were conducted using a particle image velocimetry (PIV) system. The velocity distribution uniformity and heat transfer performance were compared between single-inlet and triple-inlet microchannels with varying channel spacings. The results show that under the same flow conditions, the triple-inlet splitter structure yields a more uniform flow distribution, a lower peak temperature for the heat source chip, and improved heat transfer performance, with its pressure drop reduced to 11.1–26.6% of that of the single-inlet configuration. Furthermore, smaller channel spacings yield improved heat-transfer efficiency in microchannels.

Following publication, the authors made an administrative error during submission