Polymeric materials with a low dielectric constant are widely used in the electronic industry due to their properties. In particular, polymer adhesives can be used in many applications such as wafer bonding and three-dimensional integration. Benzocyclobutene (BCB) is a very interesting material thanks to its excellent bonding behavior and dielectric properties. Usually, BCB is applied by spin-coating, although this technology does not allow the fabrication of complex patterns. To obtain complex patterns, it is necessary to use a printing technology, such as inkjet printing. However, inkjet printing of BCB-based inks has not yet been investigated. Here, we show the feasibility of printing complex patterns with a BCB-based ink, reaching a resolution of 130 μm. We demonstrate that with a proper dilution, BCB-based inks enter the printability window and drop ejection is achieved without the formation of satellite drops. In addition, we present the conditions in which there is an appearance of the coffee ring effect. Inks that feature a too high interaction with the substrate are more likely to show the coffee ring effect, deteriorating the printing quality. We also observe that it is possible to achieve a better film uniformity by increasing the number of printed layers, due to redissolution of the BCB-based polymer that helps to level possible inhomogeneities. Our work represents the starting point for an in-depth study of BCB-based polymer fabrication using jet printing technologies, as a comparison of the bonding quality obtained with different materials and different technologies could give more information and broaden the perspective regarding this field.

Aerosol jet printing (AJP) is an emerging additive manufacturing technology that is gaining increasing attention in the electronic field. Several studies have been carried out on the AJP of conductive, semiconductive, and dielectric polymers for electronic applications. However, wafer bonding is an application that is still uncovered by literature. Therefore, in this work, the AJP of benzocyclobutene (BCB) as a polymeric adhesive for wafer bonding is presented for the first time. A thorough characterization of the processing parameters is carried out to identify the most ideal conditions for printing at a relatively high speed. Then, square patterns are printed, proving the versatility of the AJP technology in terms of the reachable thickness of the deposited BCB patterns. Complex patterns with a resolution of ≈60 µm are also printed. The bonding properties of the BCB are characterized from a morphological and mechanical point of view. In particular, the shear strength of the BCB coatings deposited with AJP is ≈39 MPa and it is comparable with the shear strength of BCB coating deposited by spin‐coating. Consequently, AJP represents a valid alternative for the deposition of polymeric adhesive for wafer bonding.

Over the last decade, polymers have attracted increasing attention for the fabrication of electronic devices due to the innovative results that can be achieved using additive manufacturing (AM) processes. Intrinsically conductive polymers are commonly used to obtain flexible and stretchable devices. They also enable the customisation of electronic devices when processed through AM. However, their main limitation is the reduction in electrical conductivity under mechanical deformation, such as bending. Extrinsically conductive nanocomposites, incorporating conductive fillers into polymer matrices, demonstrate the ability to retain electrical conductivity even following repeated bending, presenting a promising solution to the limitations of intrinsically conductive polymers. However, a gap remains in optimising their processing conditions for diverse 3D printing technologies. Moreover, fillers should be carefully selected according to the application’s specific needs. Dielectric polymers are also very promising for various electronic applications, but they are less investigated and have lower visibility than their conductive counterparts. This review presents three classes of polymer materials, i.e., intrinsically and extrinsically conductive polymers and insulators, discussing their advantages, drawbacks, and applications for 3D printing in electronics. This overview concludes with assessing future investigation areas needed to unlock the possibilities of 3D-printed polymers in electronics.

There is an ongoing effort to advance methodologies for culturing functional photoreceptors in vitro for retinal regenerative strategies. To support the formation of functional photoreceptors, a scaffold should replicate the native environment. The aim of this study was to optimize a sodium alginate–gelatin (SA-G) bioink to mimic the retinal properties while ensuring the printing of constructs with high shape fidelity. The optimized bioink was thoroughly characterized in terms of its physical, mechanical, and rheological properties, printability assessment, and preliminary biocompatibility. The material showed a constant degradation rate, which is crucial for effective tissue regeneration as it provides support for cell differentiation and polarization while gradually degrading to allow cell proliferation and matrix deposition. The optimized bioink displayed stiffness comparable to the native photoreceptor layer, potentially providing appropriate mechanical cues for photoreceptor maturation. Additionally, it exhibited shear-thinning behavior, the presence of yield stress, and fast recovery kinetics, which are essential for successful extrusion. The high shape fidelity of 3D-printed constructs suggested the feasibility of printing complex patterns to drive photoreceptor polarization. The preliminary cell results demonstrated homogeneous cell distribution and sustained cell viability over time. Overall, these findings indicate that the optimized bioink can provide the mechanical and topographical cues necessary for cultivating photoreceptors in vitro for retinal regeneration.