This study explores the potential of novel boron nitride (BN) microplatelet composites with combined thermal conduction and electrical insulation properties. These composites are manufactured through Fusion Deposition Modeling (FDM), and their application for thermal management in electronic devices is demonstrated. The primary focus of this work is, therefore, the investigation of the thermoplastic composite properties to show the 3D printing of lightweight polymeric heat sinks with remarkable thermal performance. By comparing various microfillers, including BN and MgO particles, their effects on material properties and alignment within the polymer matrix during filament fabrication and FDM processing are analyzed. The characterization includes the evaluation of morphology, thermal conductivity, and mechanical and electrical properties. Particularly, a composite with 32 wt% of BN microplatelets shows an in-plane thermal conductivity of 1.97 W m−1 K−1, offering electrical insulation and excellent printability. To assess practical applications, lightweight pin fin heat sinks using these composites are designed and 3D printed. Their thermal performance is evaluated via thermography under different heating conditions. The findings are very promising for an efficient and cost-effective fabrication of thermal devices, which can be obtained through extrusion-based Additive Manufacturing (AM), such as FDM, and exploited as enhanced thermal management solutions in electronic devices.
Cutin, one of the main structural components of tomato peels, is a waxy biopolymer rich in hydroxylated fatty acids. In this study, 10,16-dihydroxyhexadecanoic acid (10,16-diHHDA) was extracted and isolated from tomato peels and exploited to develop fully crosslinked polyesters as potential candidates for replacing fossil-based metal protective coatings. A preliminary screening was conducted to select the base formulation, and then a design of experiments (DoE) was used as a methodology to identify the optimal composition to develop a suitable coating material. Different formulations containing 10,16-diHHDA and other biorefinery monomers, including 2,5-furandicarboxylic acid, were considered. To this end, all polyesters were characterized through differential scanning calorimetry (DSC) and gel content measurements to determine their Tg value and crosslinking efficiency. Compositions exhibiting the best trade-off between Tg value, chemical resistance, and sufficiently high 10,16-diHHDA content between 39 and 48 wt.% were used to prepare model coatings that were characterized for assessing their wettability, scratch hardness, chemical resistance, and adhesion to metal substrates. These polyester coatings showed a Tg in the range of 45–55 °C, a hydrophobic behavior with a water contact angle of around 100°, a good solvent resistance (>100 MEK double rubs), and an adhesion strength to steel higher than 2 MPa. The results obtained confirmed the potential of cutin-based resins as coatings for metal protection, meeting the requirements for ensuring physicochemical properties of the final product, as well as for optimizing the valorization of such an abundant agri-food waste as tomato peels.
Over the last decade, polymers have attracted increasing attention for the fabrication of electronic devices due to the innovative results that can be achieved using additive manufacturing (AM) processes. Intrinsically conductive polymers are commonly used to obtain flexible and stretchable devices. They also enable the customisation of electronic devices when processed through AM. However, their main limitation is the reduction in electrical conductivity under mechanical deformation, such as bending. Extrinsically conductive nanocomposites, incorporating conductive fillers into polymer matrices, demonstrate the ability to retain electrical conductivity even following repeated bending, presenting a promising solution to the limitations of intrinsically conductive polymers. However, a gap remains in optimising their processing conditions for diverse 3D printing technologies. Moreover, fillers should be carefully selected according to the application’s specific needs. Dielectric polymers are also very promising for various electronic applications, but they are less investigated and have lower visibility than their conductive counterparts. This review presents three classes of polymer materials, i.e., intrinsically and extrinsically conductive polymers and insulators, discussing their advantages, drawbacks, and applications for 3D printing in electronics. This overview concludes with assessing future investigation areas needed to unlock the possibilities of 3D-printed polymers in electronics.
Direct Ink Writing (DIW) is an additive manufacturing technology that fabricates structures through layer-wise deposition of liquid materials. In this process, a liquid feedstock is dispensed onto a substrate via pneumatic or mechanical extrusion, followed by a solidification step, such as UV curing, for materials compatible with this approach.The growing demand for multi-material objects in fields like electronics and life sciences highlights DIW's potential to address these needs through its adaptability and precision. This study presents the development of a versatile multi-extrusion technology DIW platform designed with adaptability and reconfigurability at its core, ensuring compatibility with diverse material-specific processing requirements. Adopting a material-driven approach, the platform leverages principles of frugal innovation, incorporating in-house designed and 3D printed structural components to maximize accessibility and efficiency, as well as the use of artificial intelligence for the optimization of specific functionalities.Potential applications for this platform include 3D bioprinting, advanced electronics, and contributions to the circular economy, demonstrating its wide-ranging utility.
The fabrication of complex architectures remains a central challenge in 3D bioprinting, as the low mechanical properties of hydrogels limit the range of achievable geometries. Four-dimensional (4D) bioprinting can address these limitations by enabling programmed shape-morphing behavior; however, in most approaches, this functionality is introduced after hydrogel formation, limiting the complexity of the resulting deformation. Here, a proof-of-concept strategy is presented, in which shape-morphing is directly encoded during fabrication. By modulating light exposure time layer-by-layer in vat photopolymerization, spatial variations in crosslinking density are introduced in situ within Gelatin Methacryloyl (GelMA) hydrogel constructs. Exposure times in the range of 20–70 s were investigated, enabling controlled bending of the printed structures upon immersion in aqueous media, with radii of curvature between 11 and 20 mm depending on the geometry. This approach allows deformation pathways to be programmed during printing, without requiring additional materials or post-processing steps. The morphing behavior was further supported by finite element simulations, which reproduced the experimentally observed deformation and enabled prediction of the shape change. In addition, high cell viability (>95%) was maintained after material contact and UV exposure. Overall, this study demonstrates that swelling-driven actuation can be encoded during fabrication. Although demonstrated on simplified geometries, this approach provides a versatile framework for process-driven shape-morphing and represents a step toward more spatially resolved and potentially volumetric 4D bioprinting strategies.